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Electrodeposition of (111)-oriented and nanotwin-doped nanocrystalline Cu with ultrahigh strength for 3D IC application.
Zheng, Zeyang; Huang, Yu-Ting; Wang, Zhenyu; Zhang, Mingyang; Wang, Wei-Ting; Chung, Chih-Chun; Cherng, Sheng-Jye; Tsai, Ya-Hui; Li, Po-Chien; Lu, Zhouguang; Chen, Chih-Ming; Feng, Shien-Ping.
Afiliação
  • Zheng Z; Department of Mechanical Engineering, The University of Hong Kong, Pokfulam Rd, Hong Kong, People's Republic of China.
  • Huang YT; Department of Mechanical Engineering, The University of Hong Kong, Pokfulam Rd, Hong Kong, People's Republic of China.
  • Wang Z; Department of Mechanical Engineering, The University of Hong Kong, Pokfulam Rd, Hong Kong, People's Republic of China.
  • Zhang M; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, People's Republic of China.
  • Wang WT; Department of Mechanical Engineering, The University of Hong Kong, Pokfulam Rd, Hong Kong, People's Republic of China.
  • Chung CC; Department of Mechanical Engineering, The University of Hong Kong, Pokfulam Rd, Hong Kong, People's Republic of China.
  • Cherng SJ; Department of Mechanical Engineering, The University of Hong Kong, Pokfulam Rd, Hong Kong, People's Republic of China.
  • Tsai YH; Doctech Limited, Taichung 402, Taiwan.
  • Li PC; Doctech Limited, Taichung 402, Taiwan.
  • Lu Z; Department of Chemical Engineering, National Chung Hsing University, Taichung 402, Taiwan.
  • Chen CM; Resound Technology Inc., Kaohsiung 806, Taiwan.
  • Feng SP; Resound Technology Inc., Kaohsiung 806, Taiwan.
Nanotechnology ; 32(22)2021 Mar 11.
Article em En | MEDLINE | ID: mdl-33621959
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article
Texto completo
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PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article