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Transfer-printed, tandem microscale light-emitting diodes for full-color displays.
Li, Lizhu; Tang, Guo; Shi, Zhao; Ding, He; Liu, Changbo; Cheng, Dali; Zhang, Qianyi; Yin, Lan; Yao, Zhibo; Duan, Lian; Zhang, Donghao; Wang, Chenggong; Feng, Meixin; Sun, Qian; Wang, Qiang; Han, Yanjun; Wang, Lai; Luo, Yi; Sheng, Xing.
Afiliação
  • Li L; Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Center for Flexible Electronics Technology, Tsinghua University, 100084 Beijing, China.
  • Tang G; Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Center for Flexible Electronics Technology, Tsinghua University, 100084 Beijing, China.
  • Shi Z; Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Center for Flexible Electronics Technology, Tsinghua University, 100084 Beijing, China.
  • Ding H; Beijing Engineering Research Center of Mixed Reality and Advanced Display, School of Optics and Photonics, Beijing Institute of Technology, 100081 Beijing, China.
  • Liu C; School of Materials Science and Engineering, Beihang University, 100191 Beijing, China.
  • Cheng D; Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Center for Flexible Electronics Technology, Tsinghua University, 100084 Beijing, China.
  • Zhang Q; School of Materials Science and Engineering, Tsinghua University, 100084 Beijing, China.
  • Yin L; School of Materials Science and Engineering, Tsinghua University, 100084 Beijing, China.
  • Yao Z; Department of Chemistry, Tsinghua University, 100084 Beijing, China.
  • Duan L; Department of Chemistry, Tsinghua University, 100084 Beijing, China.
  • Zhang D; R&D Department, Chengdu Vistar Optoelectronics Co., Ltd., 611730 Chengdu, China.
  • Wang C; R&D Department, Chengdu Vistar Optoelectronics Co., Ltd., 611730 Chengdu, China.
  • Feng M; Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences (CAS), 215123 Suzhou, China.
  • Sun Q; Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences (CAS), 215123 Suzhou, China.
  • Wang Q; Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Center for Flexible Electronics Technology, Tsinghua University, 100084 Beijing, China.
  • Han Y; Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Center for Flexible Electronics Technology, Tsinghua University, 100084 Beijing, China.
  • Wang L; Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Center for Flexible Electronics Technology, Tsinghua University, 100084 Beijing, China.
  • Luo Y; Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Center for Flexible Electronics Technology, Tsinghua University, 100084 Beijing, China.
  • Sheng X; Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Center for Flexible Electronics Technology, Tsinghua University, 100084 Beijing, China; xingsheng@tsinghua.edu.cn.
Proc Natl Acad Sci U S A ; 118(18)2021 May 04.
Article em En | MEDLINE | ID: mdl-33903240
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article
Texto completo
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PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article