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Conductive copper glue constructs a reversible and stable zinc metal anode interface for advanced aqueous zinc ion battery.
Bai, Youcun; Zhang, Heng; Usman Tahir, Muhammad; Xiang, Bin.
Afiliação
  • Bai Y; School of Chemistry and Chemical Engineering, Chongqing University, Chongqing 401331, China.
  • Zhang H; Institute for Clean Energy & Advanced Materials, Faculty of Materials and Energy, Southwest University, Chongqing 400715, China.
  • Usman Tahir M; Department of Chemical Engineering, The University of Faisalabad, Pakistan.
  • Xiang B; School of Chemistry and Chemical Engineering, Chongqing University, Chongqing 401331, China. Electronic address: xiangbin@cqu.edu.cn.
J Colloid Interface Sci ; 608(Pt 1): 22-29, 2022 Feb 15.
Article em En | MEDLINE | ID: mdl-34626969
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2022 Tipo de documento: Article
Texto completo
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2022 Tipo de documento: Article