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Study on the Mechanism of Solid-Phase Oxidant Action in Tribochemical Mechanical Polishing of SiC Single Crystal Substrate.
Qi, Wanting; Cao, Xiaojun; Xiao, Wen; Wang, Zhankui; Su, Jianxiu.
Afiliação
  • Qi W; School of Mechanical and Electrical Engineering, Henan Institute of Science and Technology, Xinxiang 453003, China.
  • Cao X; School of Mechanical and Electrical Engineering, Henan Institute of Science and Technology, Xinxiang 453003, China.
  • Xiao W; School of Mechanical and Electrical Engineering, Henan Institute of Science and Technology, Xinxiang 453003, China.
  • Wang Z; School of Mechanical and Electrical Engineering, Henan Institute of Science and Technology, Xinxiang 453003, China.
  • Su J; School of Mechanical and Electrical Engineering, Henan Institute of Science and Technology, Xinxiang 453003, China.
Micromachines (Basel) ; 12(12)2021 Dec 12.
Article em En | MEDLINE | ID: mdl-34945397
ABSTRACT
Na2CO3-1.5 H2O2, KClO3, KMnO4, KIO3, and NaOH were selected for dry polishing tests with a 6H-SiC single crystal substrate on a polyurethane polishing pad. The research results showed that all the solid-phase oxidants, except NaOH, could decompose to produce oxygen under the frictional action. After polishing with the five solid-phase oxidants, oxygen was found on the surface of SiC, indicating that all five solid-phase oxidants can have complex tribochemical reactions with SiC. Their reaction products are mainly SiO2 and (SiO2)x. Under the action of friction, due to the high flash point temperature of the polishing interface, the oxygen generated by the decomposition of the solid-phase oxidant could oxidize the surface of SiC and generate a SiO2 oxide layer on the surface of SiC. On the other hand, SiC reacted with H2O and generated a SiO2 oxide layer on the surface of SiC. After polishing with NaOH, the SiO2 oxide layer and soluble Na2SiO3 could be generated on the SiC surface; therefore, the surface material removal rate (MRR) was the highest, and the surface roughness was the largest, after polishing. The lowest MRR was achieved after the dry polishing of SiC with KClO3.
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article