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Testing for Wearability and Reliability of TPU Lamination Method in E-Textiles.
Veske, Paula; Bossuyt, Frederick; Vanfleteren, Jan.
Afiliação
  • Veske P; Centre for Microsystems Technology (CMST), Imec and Ghent University, Technologiepark 126, 9052 Gent, Belgium.
  • Bossuyt F; Centre for Microsystems Technology (CMST), Imec and Ghent University, Technologiepark 126, 9052 Gent, Belgium.
  • Vanfleteren J; Centre for Microsystems Technology (CMST), Imec and Ghent University, Technologiepark 126, 9052 Gent, Belgium.
Sensors (Basel) ; 22(1)2021 Dec 27.
Article em En | MEDLINE | ID: mdl-35009699
Electronic textiles (e-textiles) and wearable computing have been emerging increasingly during the last decade. Since the market interest and predictions have grown, the research into increasing reliability and durability of wearables and e-textiles is developing rapidly. The washability of different integration methods and resistance to mechanical stress are the main obstacles being tackled. However, the freedom of movement and overall comfort is still often overlooked during the development phase. It is essential to see the e-textile product as a whole and consider several aspects of user experience. This work will focus on developing and improving the thermoplastic polyurethane (TPU) lamination integration method for e-textiles. In the work, a stretchable copper-polyimide based circuit was laminated onto knit fabric using various TPU films and stacks. The study shares measurable characteristics to determine which material assembly and design would ensure the highest durability for the electronics part without losing its original textile softness, flexibility and stretchability.
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Assunto principal: Poliuretanos / Dispositivos Eletrônicos Vestíveis Tipo de estudo: Prognostic_studies Idioma: En Ano de publicação: 2021 Tipo de documento: Article

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Assunto principal: Poliuretanos / Dispositivos Eletrônicos Vestíveis Tipo de estudo: Prognostic_studies Idioma: En Ano de publicação: 2021 Tipo de documento: Article