A Novel Feature Extraction Algorithm and System for Flexible Integrated Circuit Packaging Substrate.

ABSTRACT

Aiming at the line defect detection of a flexible integrated circuit substrate (FICS) without reference template, there are some problems such as line discontinuity or inaccurate line defect location in the detection results. In order to address these problems, a line feature detection algorithm for extracting an FICS image is proposed. Firstly, FICS image acquisition is carried out by using the appearance defect intelligent detection system independently developed in our lab. Secondly, in the algorithm design of the software system, the binary image of the line image to be segmented is obtained after the color FICS image is classified by K-means, median filtering, morphological filling and closed operation. Finally, for an FICS binary image, an image segmentation model with convexity-preserving indirect regular level set is proposed, which is applied to extract the line features of an FICS image. Experiment results show that, compared with the CV model, LBF model, LCV model, LGIF model, Order-LBF model and RSF model, the proposed model can extract line features with high accuracy, and the line boundary is smooth, which lays an important foundation for high-precision measurement of line width and line distance and high-precision location of defects.