A High-Performance MEMS Accelerometer with an Improved TGV Process of Low Cost.

Fu, Yingchun; Han, Guowei; Gu, Jiebin; Zhao, Yongmei; Ning, Jin; Wei, Zhenyu; Yang, Fuhua; Si, Chaowei

Fu, Yingchun; Han, Guowei; Gu, Jiebin; Zhao, Yongmei; Ning, Jin; Wei, Zhenyu; Yang, Fuhua; Si, Chaowei.

Afiliação

Fu Y; Beijing Smart-Chip Microelectronics Technology Co., Ltd., Beijing 100192, China.
Han G; Zhongguancun Xinhaizeyou Technology Co., Ltd., Beijing 100192, China.
Gu J; Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.
Zhao Y; State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China.
Ning J; Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.
Wei Z; Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China.
Yang F; Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.
Si C; Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China.

Micromachines (Basel) ; 13(7)2022 Jul 05.

Article em En | MEDLINE | ID: mdl-35888888

Palavras-chave

MEMS accelerometer; TGV; comb structure; distributed stoppers

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Tipo de estudo: Health_economic_evaluation Idioma: En Ano de publicação: 2022 Tipo de documento: Article

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