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Enhanced Electrical Properties of Copper Nitride Films Deposited via High Power Impulse Magnetron Sputtering.
Chen, Yin-Hung; Lee, Pei-Ing; Sakalley, Shikha; Wen, Chao-Kuang; Cheng, Wei-Chun; Sun, Hui; Chen, Sheng-Chi.
Afiliação
  • Chen YH; Institute of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan.
  • Lee PI; Department of Materials Engineering and Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, New Taipei City 243, Taiwan.
  • Sakalley S; Institute of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan.
  • Wen CK; Department of Materials Engineering and Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, New Taipei City 243, Taiwan.
  • Cheng WC; Department of Mechanical Engineering, National Taiwan University of Science and Technology, Taipei 106, Taiwan.
  • Sun H; Institute of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan.
  • Chen SC; Department of Materials Engineering and Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, New Taipei City 243, Taiwan.
Nanomaterials (Basel) ; 12(16)2022 Aug 16.
Article em En | MEDLINE | ID: mdl-36014680
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2022 Tipo de documento: Article
Texto completo
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XML
PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2022 Tipo de documento: Article