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Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach.
Wang, Shih-Hung; Hsu, Wensyang; Liou, Yan-Yu; Huang, Pei-Chen; Lee, Chang-Chun.
Afiliação
  • Wang SH; Department of Mechanical Engineering, National Yang Ming Chiao Tung University, No. 1001, Ta Hsueh Rd. East Dist., Hsinchu City 30010, Taiwan.
  • Hsu W; Department of Mechanical Engineering, National Yang Ming Chiao Tung University, No. 1001, Ta Hsueh Rd. East Dist., Hsinchu City 30010, Taiwan.
  • Liou YY; Department of Power Mechanical Engineering, National Tsing Hua University, No. 101, Section 2, Kuang-Fu Road, Hsinchu 30013, Taiwan.
  • Huang PC; Department of Power Mechanical Engineering, National Tsing Hua University, No. 101, Section 2, Kuang-Fu Road, Hsinchu 30013, Taiwan.
  • Lee CC; Department of Power Mechanical Engineering, National Tsing Hua University, No. 101, Section 2, Kuang-Fu Road, Hsinchu 30013, Taiwan.
Materials (Basel) ; 15(20)2022 Oct 20.
Article em En | MEDLINE | ID: mdl-36295421
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2022 Tipo de documento: Article
Texto completo
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2022 Tipo de documento: Article