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Anisotropic interlayer Dzyaloshinskii-Moriya interactions in synthetic ferromagnetic multilayers.
Chen, Ruyi; Xu, Feng; Cui, Qirui; Liang, Jinghua; Zhou, Yongjian; Wang, Ning; Pan, Feng; Xue, Fei; Yang, Hongxin; Song, Cheng.
Afiliação
  • Chen R; Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China.
  • Xu F; Anhui Province Key Laboratory of Condensed Matter Physics at Extreme Conditions, High Magnetic Field Laboratory, Chinese Academy of Sciences, Hefei 230031, China.
  • Cui Q; National Laboratory of Solid State Microstructures, School of Physics, Nanjing University, Nanjing 210093, China; Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China.
  • Liang J; National Laboratory of Solid State Microstructures, School of Physics, Nanjing University, Nanjing 210093, China.
  • Zhou Y; Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China.
  • Wang N; Anhui Province Key Laboratory of Condensed Matter Physics at Extreme Conditions, High Magnetic Field Laboratory, Chinese Academy of Sciences, Hefei 230031, China.
  • Pan F; Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China.
  • Xue F; Anhui Province Key Laboratory of Condensed Matter Physics at Extreme Conditions, High Magnetic Field Laboratory, Chinese Academy of Sciences, Hefei 230031, China; Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China. Electronic address: xuef@hmfl.ac.
  • Yang H; National Laboratory of Solid State Microstructures, School of Physics, Nanjing University, Nanjing 210093, China; Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China. Electronic address: hongxin.yang@nju.edu.cn.
  • Song C; Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China. Electronic address: songcheng@mail.tsinghua.edu.cn.
Sci Bull (Beijing) ; 68(9): 878-882, 2023 May 15.
Article em En | MEDLINE | ID: mdl-37080851
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2023 Tipo de documento: Article
Texto completo
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2023 Tipo de documento: Article