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Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes.
Xu, Yingyu; Liu, Shuibin; He, Chunhua; Wu, Heng; Cheng, Lianglun; Huang, Qinwen; Yan, Guizhen.
Afiliação
  • Xu Y; School of Computer, Guangdong University of Technology, Guangzhou 510006, China.
  • Liu S; Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 510006, China.
  • He C; School of Computer, Guangdong University of Technology, Guangzhou 510006, China.
  • Wu H; School of Computer, Guangdong University of Technology, Guangzhou 510006, China.
  • Cheng L; School of Computer, Guangdong University of Technology, Guangzhou 510006, China.
  • Huang Q; School of Computer, Guangdong University of Technology, Guangzhou 510006, China.
  • Yan G; Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 510006, China.
Micromachines (Basel) ; 14(10)2023 Oct 20.
Article em En | MEDLINE | ID: mdl-37893393
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2023 Tipo de documento: Article
Texto completo
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PubMed Links
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2023 Tipo de documento: Article