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Simultaneous mapping of cathodoluminescence spectra and backscatter diffraction patterns in a scanning electron microscope.
Edwards, Paul R; Naresh Kumar, G; McKendry, Jonathan J D; Xie, Enyuan; Gu, Erdan; Dawson, Martin D; Martin, Robert W.
Afiliação
  • Edwards PR; Department of Physics, SUPA, University of Strathclyde, 107 Rottenrow, Glasgow G4 0NG, United Kingdom.
  • Naresh Kumar G; Department of Physics, SUPA, University of Strathclyde, 107 Rottenrow, Glasgow G4 0NG, United Kingdom.
  • McKendry JJD; School of Physics and Astronomy, Cardiff University, Maindy Road, Cardiff CF24 3AA, United Kingdom.
  • Xie E; Institute of Photonics, Department of Physics, SUPA, University of Strathclyde, 99 George St., Glasgow G1 1RD, United Kingdom.
  • Gu E; Institute of Photonics, Department of Physics, SUPA, University of Strathclyde, 99 George St., Glasgow G1 1RD, United Kingdom.
  • Dawson MD; Institute of Photonics, Department of Physics, SUPA, University of Strathclyde, 99 George St., Glasgow G1 1RD, United Kingdom.
  • Martin RW; Institute of Photonics, Department of Physics, SUPA, University of Strathclyde, 99 George St., Glasgow G1 1RD, United Kingdom.
Nanotechnology ; 35(39)2024 Jul 11.
Article em En | MEDLINE | ID: mdl-38955132
ABSTRACT
Electron backscatter diffraction and cathodoluminescence are complementary scanning electron microscopy modes widely used in the characterisation of semiconductor films, respectively revealing the strain state of a crystalline material and the effect of this strain on the light emission from the sample. Conflicting beam, sample and detector geometries have meant it is not generally possible to acquire the two signals together during the same scan. Here, we present a method of achieving this simultaneous acquisition, by collecting the light emission through a transparent sample substrate. We apply this combination of techniques to investigate the strain field and resultant emission wavelength variation in a deep-ultraviolet micro-LED. For such compatible samples, this approach has the benefits of avoiding image alignment issues and minimising beam damage effects.
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2024 Tipo de documento: Article

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2024 Tipo de documento: Article