Vibration of Mechanically-Assembled 3D Microstructures Formed by Compressive Buckling.

Wang, Heling; Ning, Xin; Li, Haibo; Luan, Haiwen; Xue, Yeguang; Yu, Xinge; Fan, Zhichao; Li, Luming; Rogers, John A; Zhang, Yihui; Huang, Yonggang

Wang, Heling; Ning, Xin; Li, Haibo; Luan, Haiwen; Xue, Yeguang; Yu, Xinge; Fan, Zhichao; Li, Luming; Rogers, John A; Zhang, Yihui; Huang, Yonggang.

Afiliação

Wang H; Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA.
Ning X; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA.
Li H; Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA.
Luan H; Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA.
Xue Y; Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA.
Yu X; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA.
Fan Z; AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
Li L; Center for Mechanics and Materials and Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China.
Rogers JA; Man-machine-Environment Engineering Institute, Department of Aeronautics & Astronautics Engineering, Tsinghua University, Beijing 100084, China.
Zhang Y; Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Neurological Surgery, Center for Bio-Integrated Electronics, Simpson Querrey Institute for BioNanotechnology, McCormick School of Engineering and
Huang Y; AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.

J Mech Phys Solids ; 112: 187-208, 2018 Mar.

Article em En | MEDLINE | ID: mdl-29713095

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: J Mech Phys Solids Ano de publicação: 2018 Tipo de documento: Article País de afiliação: Estados Unidos País de publicação: Reino Unido

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