Robust Metallic Microcapsules: A Direct Path to New Multifunctional Materials.

Sun, Dawei; Zhang, He; Zhang, Xin; Yang, Jinglei

Sun, Dawei; Zhang, He; Zhang, Xin; Yang, Jinglei.

Afiliação

Sun D; Department of Mechanical and Aerospace Engineering , The Hong Kong University of Science and Technology , Kowloon 999077 , Hong Kong SAR.
Zhang H; College of Materials Science and Engineering , Beijing University of Technology , Beijing 100124 , China.
Zhang X; Key Laboratory of Polymer Processing Engineering of the Ministry of Education, National Engineering Research Center of Novel Equipment for Polymer Processing , South China University of Technology , Guangzhou 510640 , China.
Yang J; School of Civil and Environmental Engineering , Nanyang Technological University , 639798 , Singapore.

ACS Appl Mater Interfaces ; 11(9): 9621-9628, 2019 Mar 06.

Article em En | MEDLINE | ID: mdl-30729779

Palavras-chave

barrier property; electroless plating; metallic microcapsule; multifunctional material; robustness

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Assunto da revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Ano de publicação: 2019 Tipo de documento: Article País de publicação: Estados Unidos

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