The impact of laparoscopic radical gastrectomy on the inflammatory response and immune function of patients with gastric cancer.

The currest study aimed to measure the effects of laparoscopic radical gastrectomy on inflammatory response along with immune function in gastric cancer (GC) patients. Seventy patients with GC in our hospital were retrospectively chosen to be the study objects and separated into control group (CG, 35 cases) and observation group (OG, 35 cases). Patients in the OG received radical laparotomy. Patients in the OG received laparoscopic radical gastrectomy. The surgical indicators, postoperative recovery indicators, inflammatory factors, immune function, incidence of adverse reactions along with quality of life of patients in both groups were compared. In contrast to the CG, the operation time of the OG presented as shorter (P<0.05), and the amount of intraoperative blood loss together with postoperative VAS score in the OG presented lower (P<0.05), but the number of lymph nodes dissection presented not statistically significant between 2 groups (P>0.05). The postoperative exhaust time, feeding time as well as hospital stay in the OG presented shorter relative to the CG (P<0.05). The serum levels of CRP, and IL-6 together with TNF-α presented elevated in both groups after surgery, and those in the OG presented lower when compared with the CG (P<0.05). The serum levels of IgA, and IgG together with IgM presented declined in both groups after surgery, and those in the OG presented higher when compared with the CG (P<0.05). The incidence of postoperative complications in the OG presented reduction relative to the CG (P<0.05). The GLQI scores of the OG presented significantly higher relative to the CG at discharge (P<0.05). Compared with radical gastrectomy, laparoscopic radical gastrectomy is more suitable for the treatment of GC, which can reduce the inflammatory response and promote the immune function of GC patients.

MiR-485-3p/MiR-543/MiR-337-3p is Required for the Oncogenic Potential of the Hsa_circ_0007385-MEMO1 Axis in Colorectal Cancer.

Circular RNAs (circRNAs) play regulatory roles in the biological processes of multiple tumors, colorectal cancer (CRC) included. Our previous study probed the impact of circ_0007385 on CRC cell malignant behaviors, while the underlying mechanism remains obscure. In this work, the potential mechanism of hsa_circ_0007385 in CRC was probed. Functional experiments were implemented for probing the function of hsa_circ_0007385 in CRC. Further analysis revealed the relation between hsa_circ_0007385 and miRNAs. A xenograft mouse model was implemented for probing the influence of hsa_circ_0007385 on CRC growth and metastasis in vivo. Hsa_circ_0007385 was up-regulated in CRC. Hsa_circ_0007385 positively regulated its host gene mediator of cell motility 1 (MEMO1). Hsa_circ_0007385 silencing inhibited CRC progression. Hsa_circ_0007385 and MEMO1 bond to miR-485-3p/miR-543/miR-337-3p, and these three miRNAs were lowly expressed in CRC, and negatively modulated by hsa_circ_0007385. Hsa_circ_0007385 functioned as an oncogene in CRC in a miR-485-3p/miR-543/miR-337-3p- or MEMO1-dependent manner. Hsa_circ_0007385 promoted CRC progression via modulating miR-485-3p/miR-543/miR-337-3p/MEMO1 axis. Thus, circ-MEMO1 might be a promising therapeutic target for CRC.

Near-Theoretical Thermal Conductivity Silver Nanoflakes as Reinforcements in Gap-Filling Adhesives.

The rapid development of highly integrated microelectronic devices causes urgent demands for advanced thermally conductive adhesives (TCAs) to solve the interfacial heat-transfer issue. Due to their natural 2D structure and isotropic thermal conductivity, metal nanoflakes are promising fillers blended with polymer to develop high-performance TCAs. However, achieving corresponding TCAs with thermal conductivity over 10 W m-1 K-1 at filler content below 30 vol% remains challenging so far. This longstanding bottleneck is mainly attributed to the fact that most current metal nanoflakes are prepared by "bottom-up" processes (e.g., solution-based chemical synthesis) and inevitably contain lattice defects or impurities, resulting in lower intrinsic thermal conductivities, only 20-65% of the theoretical value. Here, a "top-down" strategy by splitting highly purified Ag foil with nanoscale thickness is adopted to prepare 2D Ag nanoflakes with an intrinsic thermal conductivity of 398.2 W m-1 K-1 , reaching 93% of the theoretical value. After directly blending with epoxy, the resultant Ag/epoxy exhibits a thermal conductivity of 15.1 W m-1 K-1 at low filler content of 18.6 vol%. Additionally, in practical microelectronic cooling performance evaluations, the interfacial heat-transfer efficiency of the Ag/epoxy achieves ≈1.4 times that of the state-of-the-art commercial TCA.

A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface Material.

With the increase in heat power density in modern integrating electronics, thermal interface materials (TIM) that can efficiently fill the gaps between the heat source and heat sinks and enhance heat dissipation are urgently needed owing to their high thermal conductivity and excellent mechanical durability. Among all the emerged TIMs, graphene-based TIMs have attracted increasing attention because of the ultrahigh intrinsic thermal conductivity of graphene nanosheets. Despite extensive efforts, developing high-performance graphene-based papers with high through-plane thermal conductivity remains challenging despite their high in-plane thermal conductivity. In this study, a novel strategy for enhancing the through-plane thermal conductivity of graphene papers by in situ depositing AgNWs on graphene sheets (IGAP) was proposed, which could boost the through-plane thermal conductivity of the graphene paper up to 7.48 W m-1 K-1 under packaging conditions. In the TIM performance test under actual and simulated operating conditions, our IGAP exhibits strongly enhanced heat dissipation performance compared to the commercial thermal pads. We envision that our IGAP as a TIM has great potential for boosting the development of next-generation integrating circuit electronics.

Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction.

Developing advanced thermal interface materials (TIMs) to bridge heat-generating chip and heat sink for constructing an efficient heat transfer interface is the key technology to solve the thermal management issue of high-power semiconductor devices. Based on the ultra-high basal-plane thermal conductivity, graphene is an ideal candidate for preparing high-performance TIMs, preferably to form a vertically aligned structure so that the basal-plane of graphene is consistent with the heat transfer direction of TIM. However, the actual interfacial heat transfer efficiency of currently reported vertically aligned graphene TIMs is far from satisfactory. In addition to the fact that the thermal conductivity of the vertically aligned TIMs can be further improved, another critical factor is the limited actual contact area leading to relatively high contact thermal resistance (20-30 K mm2 W-1) of the "solid-solid" mating interface formed by the vertical graphene and the rough chip/heat sink. To solve this common problem faced by vertically aligned graphene, in this work, we combined mechanical orientation and surface modification strategy to construct a three-tiered TIM composed of mainly vertically aligned graphene in the middle and micrometer-thick liquid metal as a cap layer on upper and lower surfaces. Based on rational graphene orientation regulation in the middle tier, the resultant graphene-based TIM exhibited an ultra-high thermal conductivity of 176 W m-1 K-1. Additionally, we demonstrated that the liquid metal cap layer in contact with the chip/heat sink forms a "liquid-solid" mating interface, significantly increasing the effective heat transfer area and giving a low contact thermal conductivity of 4-6 K mm2 W-1 under packaging conditions. This finding provides valuable guidance for the design of high-performance TIMs based on two-dimensional materials and improves the possibility of their practical application in electronic thermal management.

A highly orientational architecture formed by covalently bonded graphene to achieve high through-plane thermal conductivity of polymer composites.

Combining the advantages of high thermal conductivities and low graphene contents to fabricate polymer composites for applications in thermal management is still a great challenge due to the high defect degree of exfoliated graphene, the poor orientation of graphene in polymer matrices, and the horrible phonon scattering between graphene/graphene and graphene/polymer interfaces. Herein, mesoplasma chemical vapor deposition (CVD) technology was successfully employed to synthesize vertically aligned graphene nanowalls (GNWs), which are covalently bonded by high-quality CVD graphene nanosheets. The unique architecture leads to an excellent thermal enhancement capacity of the GNWs, and a corresponding composite film with a matrix of polyvinylidene fluoride (PVDF) presented a high through-plane thermal conductivity of 12.8 ± 0.77 W m-1 K-1 at a low filler content of 4.0 wt%, resulting in a thermal conductivity enhancement per 1 wt% graphene loading of 1659, which is far superior to that using conventional graphene structures as thermally conductive pathways. In addition, this composite exhibited an excellent capability in cooling a high-power light-emitting diode (LED) device under real application conditions. Our finding provides a new route to prepare high-performance thermal management materials with low filler loadings via the rational design of the microstructures/interfaces of graphene skeletons.

Enhanced Electromagnetic Shielding and Thermal Conductive Properties of Polyolefin Composites with a Ti3C2Tx MXene/Graphene Framework Connected by a Hydrogen-Bonded Interface.

The rapid increase of operation speed, transmission efficiency, and power density of miniaturized devices leads to a rising demand for electromagnetic interference (EMI) shielding and thermal management materials in the semiconductor industry. Therefore, it is essential to improve both the EMI shielding and thermal conductive properties of commonly used polyolefin components (such as polyethylene (PE)) in electronic systems. Currently, melt compounding is the most common method to fabricate polyolefin composites, but the difficulty of filler dispersion and high resistance at the filler/filler or filler/matrix interface limits their properties. Here, a fold fabrication strategy was proposed to prepare PE composites by incorporation of a well-aligned, seamless graphene framework premodified with MXene nanosheets into the matrix. We demonstrate that the physical properties of the composites can be further improved at the same filler loading by nanoscale interface engineering: the formation of hydrogen bonds at the graphene/MXene interface and the development of a seamlessly interconnected graphene framework. The obtained PE composites exhibit an EMI shielding property of ∼61.0 dB and a thermal conductivity of 9.26 W m-1 K-1 at a low filler content (∼3 wt %, including ∼0.4 wt % MXene). Moreover, other thermoplastic composites with the same results can also be produced based on our method. Our study provides an idea toward rational design of the filler interface to prepare high-performance polymer composites for use in microelectronics and microsystems.

Tailoring Highly Ordered Graphene Framework in Epoxy for High-Performance Polymer-Based Heat Dissipation Plates.

As the power density and integration level of electronic devices increase, there are growing demands to improve the thermal conductivity of polymers for addressing the thermal management issues. On the basis of the ultrahigh intrinsic thermal conductivity, graphene has exhibited great potential as reinforcing fillers to develop polymer composites, but the resultant thermal conductivity of reported graphene-based composites is still limited. Here, an interconnected and highly ordered graphene framework (HOGF) composed of high-quality and horizontally aligned graphene sheets was developed by a porous film-templated assembly strategy, followed by a stress-induced orientation process and graphitization post-treatment. After embedding into the epoxy (EP), the HOGF/EP composite (24.7 vol %) exhibits a record-high in-plane thermal conductivity of 117 W m-1 K-1, equivalent to ≈616 times higher than that of neat epoxy. This thermal conductivity enhancement is mainly because the HOGF as a filler concurrently has high intrinsic thermal conductivity, relatively high density, and a highly ordered structure, constructing superefficient phonon transport paths in the epoxy matrix. Additionally, the use of our HOGF/EP as a heat dissipation plate was demonstrated, and it achieved 75% enhancement in practical thermal management performance compared to that of conventional alumina for cooling the high-power LED.

Multiscale Structural Modulation of Anisotropic Graphene Framework for Polymer Composites Achieving Highly Efficient Thermal Energy Management.

Graphene is usually embedded into polymer matrices for the development of thermally conductive composites, preferably forming an interconnected and anisotropic framework. Currently, the directional self-assembly of exfoliated graphene sheets is demonstrated to be the most effective way to synthesize anisotropic graphene frameworks. However, achieving a thermal conductivity enhancement (TCE) over 1500% with per 1 vol% graphene content in polymer matrices remains challenging, due to the high junction thermal resistance between the adjacent graphene sheets within the self-assembled graphene framework. Here, a multiscale structural modulation strategy for obtaining highly ordered structure of graphene framework and simultaneously reducing the junction thermal resistance is demonstrated. The resultant anisotropic framework contributes to the polymer composites with a record-high thermal conductivity of 56.8-62.4 W m-1 K-1 at the graphene loading of ≈13.3 vol%, giving an ultrahigh TCE per 1 vol% graphene over 2400%. Furthermore, thermal energy management applications of the composites as phase change materials for solar-thermal energy conversion and as thermal interface materials for electronic device cooling are demonstrated. The finding provides valuable guidance for designing high-performance thermally conductive composites and raises their possibility for practical use in thermal energy storage and thermal management of electronics.

Ultrahigh-Aspect-Ratio Boron Nitride Nanosheets Leading to Superhigh In-Plane Thermal Conductivity of Foldable Heat Spreader.

The rapid development of integrated circuits and electronic devices creates a strong demand for highly thermally conductive yet electrically insulating composites to efficiently solve "hot spot" problems during device operation. On the basis of these considerations, hexagonal boron nitride nanosheets (BNNS) have been regarded as promising fillers to fabricate polymer matrix composites. However, so far an efficient approach to prepare ultrahigh-aspect-ratio BNNS with large lateral size while maintaining an atomically thin nature is still lacking, seriously restricting further improvement of the thermal conductivity for BNNS/polymer composites. Here, a rapid and high-yield method based on a microfluidization technique is developed to obtain exfoliated BNNS with a record high aspect ratio of ≈1500 and a low degree of defects. A foldable and electrically insulating film made of such a BNNS and poly(vinyl alcohol) (PVA) matrix through filtration exhibits an in-plane thermal conductivity of 67.6 W m-1 K-1 at a BNNS loading of 83 wt %, leading to a record high value of thermal conductivity enhancement (≈35 500). The composite film then acts as a heat spreader for heat dissipation of high-power LED modules and shows superior cooling efficiency compared to commercial flexible copper clad laminate. Our findings provide a practical route to produce electrically insulating polymer composites with high thermal conductivity for thermal management applications in modern electronic devices.