Protocol for producing phosphoramidate using phosphorus fluoride exchange click chemistry.

Phosphorus fluoride exchange (PFEx) is a catalytic click reaction that involves exchanging high oxidation state P-F bonds with alcohol and amine nucleophiles, reliably yielding P-O- and P-N-linked compounds. Here, we describe steps for preparing a phosphoramidic difluoride and performing two sequential PFEx reactions to yield a phosphoramidate through careful catalyst selection. We then detail procedures for handling and quenching potentially toxic P-F-containing compounds to ensure user safety when conducting PFEx reactions. For complete details on the use and execution of this protocol, please refer to Sun et al.1.

Protocol for extraction, characterization, and computational analysis of uranium from seawater.

Here, we present a protocol for uranium extraction from seawater (UES) and its characterization and computational-based structure analysis. We describe formulating batch adsorption experiments for adsorptive separation of uranium using thin film (TFCH) of Hydrogen-bonded Organic Framework (CSMCRIHOF-1). We then detail the recovery of uranium using eluent mixtures and the steps to regenerate TFCH for recyclability studies. Finally, we describe the spectroscopic characterizations of TFCH and uranium adsorbed TFCH, followed by computational analysis of the structures and binding sites. For complete details on the use and execution of this protocol, please refer to Kaushik et al. (2022).1.

Protocol for growing silica nanowires on various substrates to enhance superwetting and self-jumping properties.

The protocol outlines the steps for growing silica nanowires on various substrates such as glass and stainless-steel foil. Silica nanowires are grown by thermal chemical vapor deposition via a vapor-liquid-solid mechanism, in which silicon wafers are used as silicon sources and platinum films as catalysts. This protocol can be used to grow silica nanowires on other substrates such as quartz filter, quartz sphere, alumina plate, and silicon wafer, provided the substrate materials can tolerate the temperature during process heating. For complete details on the use and execution of this profile, please refer to Lee et al. (2019), Tsai and Shieh (2019), and Tsai et al. (2021).