Phase-engineered low-resistance contacts for ultrathin MoS2 transistors.

Ultrathin molybdenum disulphide (MoS2) has emerged as an interesting layered semiconductor because of its finite energy bandgap and the absence of dangling bonds. However, metals deposited on the semiconducting 2H phase usually form high-resistance (0.7 kΩ µm-10 kΩ µm) contacts, leading to Schottky-limited transport. In this study, we demonstrate that the metallic 1T phase of MoS2 can be locally induced on semiconducting 2H phase nanosheets, thus decreasing contact resistances to 200-300 Ω µm at zero gate bias. Field-effect transistors (FETs) with 1T phase electrodes fabricated and tested in air exhibit mobility values of ~50 cm(2) V(-1) s(-1), subthreshold swing values below 100 mV per decade, on/off ratios of >10(7), drive currents approaching ~100 µA µm(-1), and excellent current saturation. The deposition of different metals has limited influence on the FET performance, suggesting that the 1T/2H interface controls carrier injection into the channel. An increased reproducibility of the electrical characteristics is also obtained with our strategy based on phase engineering of MoS2.

Rapid prototyping of robust and versatile microfluidic components using adhesive transfer tapes.

A rapid prototyping technique of microfluidic devices is presented using adhesive transfer tapes. Lab on a chip systems can integrate multiple microfluidic functions in a single platform. Therefore, any rapid prototyping technique should be flexible and robust to accommodate different aspects of microfluidic integrations. In this work, the versatility of using adhesive transfer tapes for microfluidic applications is demonstrated by fabricating a wide range of platform. Prototypes demonstrating microfluidic mixing, dielectrophoretic trapping, complex microchannel networks and biologically relevant high temperature reactions were fabricated in less than 30 min. A novel ready to use world-to-chip interface was also developed using the same fabrication platform. All components (e.g. tapes, electrodes, acoustic sources or heaters) were obtained as finished products alleviating any chemical or clean-room specific processing. Only a 2D CAD software, a CO2 laser cutter and a seam roller was utilized to fabricate the devices. Adhesive transfer tapes provide additional flexibility compared to common double sided tapes as they do not contain any carrier material layer. Demonstrated ability to sustain in a wide range of dynamic physical processes (mechanical, electrical, or thermal) validates the robustness and the versatility of adhesive transfer tapes as an option for developing integrated lab on a chip systems.

Supporting data for impact of filler composition on mechanical and dynamic response of 3-D printed silicone-based nanocomposite elastomers.

This research reports on the physical and mechanical effects of various filler materials used in direct ink write (DIW) 3-D printing resins. The data reported herein supports interpretation and discussion provided in the research article "Impact of Filler Composition on Mechanical and Dynamic Response of 3-D Printed Silicone-based Nanocomposite Elastomers" [1]. The datasheet describes the model structures and the interaction energies between the fillers and the other components by using Molecular Dynamics (MD) simulations. This report includes mechanical responses of single-cubic (SC) and face-centered tetragonal (FCT) structures printed using new DIW resin formulations (polydimethylsiloxane-based silicones filled with aluminum oxide, graphite, or titanium dioxide). Using MD simulations and mechanical data, the overall flexibility and interactions between resin components are fully characterized.