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1.
Sensors (Basel) ; 20(6)2020 Mar 17.
Artículo en Inglés | MEDLINE | ID: mdl-32192204

RESUMEN

A wristwatch-based wireless sensor platform for IoT wearable health monitoring applications is presented. The paper describes the platform in detail, with a particular focus given to the design of a novel and compact wireless sub-system for 868 MHz wristwatch applications. An example application using the developed platform is discussed for arterial oxygen saturation (SpO2) and heart rate measurement using optical photoplethysmography (PPG). A comparison of the wireless performance in the 868 MHz and the 2.45 GHz bands is performed. Another contribution of this work is the development of a highly integrated 868 MHz antenna. The antenna structure is printed on the surface of a wristwatch enclosure using laser direct structuring (LDS) technology. At 868 MHz, a low specific absorption rate (SAR) of less than 0.1% of the maximum permissible limit in the simulation is demonstrated. The measured on-body prototype antenna exhibits a -10 dB impedance bandwidth of 36 MHz, a peak realized gain of -4.86 dBi and a radiation efficiency of 14.53% at 868 MHz. To evaluate the performance of the developed 868 MHz sensor platform, the wireless communication range measurements are performed in an indoor environment and compared with a commercial Bluetooth wristwatch device.


Asunto(s)
Internet de las Cosas/instrumentación , Monitoreo Ambulatorio/instrumentación , Oximetría/instrumentación , Fotopletismografía/instrumentación , Tecnología Inalámbrica/instrumentación , Técnicas Biosensibles/instrumentación , Técnicas Biosensibles/métodos , Impedancia Eléctrica , Ambiente , Diseño de Equipo , Salud , Humanos , Aplicaciones Móviles , Monitoreo Ambulatorio/métodos , Oximetría/métodos , Fotopletismografía/métodos , Muñeca
2.
Microsyst Nanoeng ; 7: 39, 2021.
Artículo en Inglés | MEDLINE | ID: mdl-34567753

RESUMEN

As demand accelerates for multifunctional devices with a small footprint and minimal power consumption, 2.5D and 3D advanced packaging architectures have emerged as an essential solution that use through-substrate vias (TSVs) as vertical interconnects. Vertical stacking enables chip packages with increased functionality, enhanced design versatility, minimal power loss, reduced footprint and high bandwidth. Unlocking the potential of photolithography for vertical interconnect access (VIA) fabrication requires fast and accurate predictive modeling of diffraction effects and resist film photochemistry. This procedure is especially challenging for broad-spectrum exposure systems that use, for example, Hg bulbs with g-, h-, and i-line UV radiation. In this paper, we present new methods and equations for VIA latent image determination in photolithography that are suitable for broad-spectrum exposure and negate the need for complex and time-consuming in situ metrology. Our technique is accurate, converges quickly on the average modern PC and could be readily integrated into photolithography simulation software. We derive a polychromatic light attenuation equation from the Beer-Lambert law, which can be used in a critical exposure dose model to determine the photochemical reaction state. We integrate this equation with an exact scalar diffraction formula to produce a succinct equation comprising a complete coupling between light propagation phenomena and photochemical behavior. We then perform a comparative study between 2D/3D photoresist latent image simulation geometries and directly corresponding experimental data, which demonstrates a highly positive correlation. We anticipate that this technique will be a valuable asset to photolithography, micro- and nano-optical systems and advanced packaging/system integration with applications in technology domains ranging from space to automotive to the Internet of Things (IoT).

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