Stabilizing High Density Cu Active Sites with ZrO2 Quantum Dots as Chemical Ligand in N-doped Porous Carbon Nanofibers for Efficient ORR.

The emerging transition metal-nitrogen-carbon (MNC) materials are considered as a promising oxygen reduction reaction (ORR) catalyst system to substitute expensive Pt/C catalysts due to their high surface area and potential high catalytic activity. However, MNC catalysts are easy to be attacked by the ORR byproducts that easily lead to the deactivation of metal active sites. Moreover, a high metal loading affects the mass transfer and stability, but a low loading delivers inferior catalytic activity. Here, a new strategy of designing ZrO2 quantum dots and N-complex as dual chemical ligands in N-doped bubble-like porous carbon nanofibers (N-BPCNFs) to stabilize copper (Cu) by forming CuZrO3-x /ZrO2 heterostructures and CuN ligands with a high loading of 40.5 wt.% is reported. While the highly porous architecture design of N-BPCNFs builds a large solidelectrolytegas phase interface and promotes mass transfer. The preliminary results show that the half-wave potential of the catalyst reaches 0.856 V, and only decreases 0.026 V after 10 000 cycles, exhibiting excellent stability. The proposed strategy of stabilizing metal active sites with both heterostructures and CuN ligands is feasible and scalable for developing high metal loading ORR catalyst.

Influence of Pulse Current Forward-Reverse Duty Cycle on Structure and Performance of Electroplated W-Cu Composite Coatings.

Tungsten-copper (W-Cu) composites are widely used as electrical contact materials, resistance welding, electrical discharge machining (EDM), and plasma electrode materials due to their excellent arc erosion resistance, fusion welding resistance, high strength, and superior hardness. However, the traditional preparation methods pay little attention to the compactness and microstructural uniformity of W-Cu composites. Herein, W-Cu composite coatings are prepared by pulse electroplating using nano-W powder as raw material and the influence of forward-reverse duty cycle of pulse current on the structure and mechanical properties is systematically investigated. Moreover, the densification mechanism of the W-Cu composite coating is analyzed from the viewpoints of forward-pulse plating and reverse-pulse plating. At the current density (J) of 2 A/dm2, frequency (f) of 1500 Hz, forward duty cycle (df) of 40% and reverse duty cycle (dr) of 10%, the W-Cu composite coating rendered a uniform microstructure and compact structure, resulting in a hardness of 127 HV and electrical conductivity of 53.7 MS/m.

Scalable Preparation of Ultrathin Graphene-Reinforced Copper Composite Foils with High Mechanical Properties and Excellent Heat Dissipation.

As an important basic material of electronic equipment, copper (Cu) foils should have a small thickness, good mechanical properties, and excellent thermal conductivity. However, preparing an ultrathin Cu foil with good properties remains challenging. Herein, we report an electroless deposition (ELD) strategy for the facile and scalable preparation of an ultrathin freestanding nickel-coated graphene (NCG)/Cu composite foil in a short time of 25 min. The NCG can significantly improve the mechanical and physical properties of composite foils. Experimental results reveal that the NCG/Cu composite foil manifests the best performance when the NCG concentration in an ELD bath was 30 mg/L. The composite foil evidenced a thickness of 1.1 µm, a high tensile strength of 338.7 MPa, and a high thermal conductivity of 431.2 W/mK. Compared with the pure Cu foil, both bending times and elastic modulus are increased by 298.1 and 737.3%, respectively. Remarkably, the composite foil has excellent heat dissipation performance, showing enormous potential as a heat sink material. This work proposes a new method for manufacturing the ultrathin graphene-reinforced Cu composite foil with high performance for numerous applications.

Electroless Deposition of Automatically Shedded Thin Copper Foils.

Electroless deposition (ELD) is a process widely used for the production of thin metal films, but stripping the films from the substrate remains challenging. Here, we report a low-cost ELD method for the large-scale production of freestanding copper (Cu) foils in a short time of 25-55 min. By atomizing a thin (<100 nm) sacrificial layer of chitosan with weak glycosyl bonds and a high degree of deacetylation on the glass substrate, the chitosan is completely decomposed in the process of Cu-deposition, producing automatically shedded Cu foils with varied thicknesses from 746 nm to 8.33 µm and high elastic modulus. When used as battery current collectors, the thin Cu foils with enhanced adhesive fastness and contact areas greatly enhance the capacity and rate capability of graphite anodes. Compared with the commercial Cu current collectors, both the battery capacity and energy density are increased by 429.6 and 484.1%, respectively. The reported approach can be extended for fabricating other metal foils such as nickel with properties appealing for applications.