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Mechanically Reinforced Skin-Electronics with Networked Nanocomposite Elastomer.
Han, Seungyong; Kim, Min Ku; Wang, Bo; Wie, Dae Seung; Wang, Shuodao; Lee, Chi Hwan.
Afiliación
  • Han S; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA.
  • Kim MK; School of Mechanical Engineering, Purdue University, West Lafayette, IN, 47907, USA.
  • Wang B; School of Mechanical and Aerospace Engineering, Oklahoma State University, Stillwater, OK, 74078, USA.
  • Wie DS; School of Mechanical Engineering, Purdue University, West Lafayette, IN, 47907, USA.
  • Wang S; School of Mechanical and Aerospace Engineering, Oklahoma State University, Stillwater, OK, 74078, USA.
  • Lee CH; Weldon School of Biomedical Engineering, School of Mechanical Engineering, Center for Implantable Devices, Birck Nanotechnology Center, Purdue University, West Lafayette, IN, 47907, USA.
Adv Mater ; 28(46): 10257-10265, 2016 Dec.
Article en En | MEDLINE | ID: mdl-27714861
ABSTRACT
Mechanically reinforced skin-electronics are presented by exploiting networked nanocomposite elastomers where high quality metal nanowires serve as conducting paths. Theoretical and experimental studies show that the established skin-electronics exhibit superior mechanical enhancements against crack and delamination phenomena. Device applications include a class of biomedical devices that offers the ability of thermotherapeutic stimulation and electrophysiological monitoring, all via the skin.
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Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: Adv Mater Asunto de la revista: BIOFISICA / QUIMICA Año: 2016 Tipo del documento: Article País de afiliación: Estados Unidos

Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: Adv Mater Asunto de la revista: BIOFISICA / QUIMICA Año: 2016 Tipo del documento: Article País de afiliación: Estados Unidos