Your browser doesn't support javascript.
loading
Ultralow Thermal Conductivity in Diamondoid Structures and High Thermoelectric Performance in (Cu1-xAgx)(In1-yGay)Te2.
Xie, Hongyao; Hao, Shiqiang; Bailey, Trevor P; Cai, Songting; Zhang, Yinying; Slade, Tyler J; Snyder, G Jeffrey; Dravid, Vinayak P; Uher, Ctirad; Wolverton, Christopher; Kanatzidis, Mercouri G.
Afiliación
  • Xie H; Department of Chemistry, Northwestern University, Evanston, Illinois 60208, United States.
  • Hao S; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States.
  • Bailey TP; Department of Physics, University of Michigan, Ann Arbor, Michigan 48109, United States.
  • Cai S; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States.
  • Zhang Y; Department of Physics, University of Michigan, Ann Arbor, Michigan 48109, United States.
  • Slade TJ; Department of Chemistry, Northwestern University, Evanston, Illinois 60208, United States.
  • Snyder GJ; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States.
  • Dravid VP; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States.
  • Uher C; Department of Physics, University of Michigan, Ann Arbor, Michigan 48109, United States.
  • Wolverton C; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States.
  • Kanatzidis MG; Department of Chemistry, Northwestern University, Evanston, Illinois 60208, United States.
J Am Chem Soc ; 143(15): 5978-5989, 2021 Apr 21.
Article en En | MEDLINE | ID: mdl-33847500

Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: J Am Chem Soc Año: 2021 Tipo del documento: Article País de afiliación: Estados Unidos

Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: J Am Chem Soc Año: 2021 Tipo del documento: Article País de afiliación: Estados Unidos