Your browser doesn't support javascript.
loading
Intelligent and highly sensitive strain sensor based on indium tin oxide micromesh with a high crack density.
Qiao, Yancong; Tang, Hao; Liu, Haidong; Jian, Jinming; Ji, Shourui; Han, Fei; Liu, Zhiyuan; Liu, Ying; Li, Yuanfang; Cui, Tianrui; Cai, Jingxuan; Gou, Guangyang; Zhou, Bingpu; Yang, Yi; Ren, Tian-Ling; Zhou, Jianhua.
Afiliación
  • Qiao Y; School of Biomedical Engineering, Sun Yat-Sen University, Shenzhen, 518107, China. zhoujh33@mail.sysu.edu.cn.
  • Tang H; School of Biomedical Engineering, Sun Yat-Sen University, Shenzhen, 518107, China. zhoujh33@mail.sysu.edu.cn.
  • Liu H; School of Biomedical Engineering, Sun Yat-Sen University, Shenzhen, 518107, China. zhoujh33@mail.sysu.edu.cn.
  • Jian J; School of Integrated Circuits (SIC) and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100084, China. rentl@tsinghua.edu.cn.
  • Ji S; School of Integrated Circuits (SIC) and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100084, China. rentl@tsinghua.edu.cn.
  • Han F; CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences (CAS), Shenzhen 518055, China.
  • Liu Z; CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences (CAS), Shenzhen 518055, China.
  • Liu Y; School of Biomedical Engineering, Sun Yat-Sen University, Shenzhen, 518107, China. zhoujh33@mail.sysu.edu.cn.
  • Li Y; School of Biomedical Engineering, Sun Yat-Sen University, Shenzhen, 518107, China. zhoujh33@mail.sysu.edu.cn.
  • Cui T; School of Integrated Circuits (SIC) and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100084, China. rentl@tsinghua.edu.cn.
  • Cai J; School of Biomedical Engineering, Sun Yat-Sen University, Shenzhen, 518107, China. zhoujh33@mail.sysu.edu.cn.
  • Gou G; School of Integrated Circuits (SIC) and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100084, China. rentl@tsinghua.edu.cn.
  • Zhou B; Joint Key Laboratory of the Ministry of Education, Institute of Applied Physics and Materials Engineering, University of Macau, Avenida da Universidade, Taipa, Macau 999078, China.
  • Yang Y; School of Integrated Circuits (SIC) and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100084, China. rentl@tsinghua.edu.cn.
  • Ren TL; School of Integrated Circuits (SIC) and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100084, China. rentl@tsinghua.edu.cn.
  • Zhou J; School of Biomedical Engineering, Sun Yat-Sen University, Shenzhen, 518107, China. zhoujh33@mail.sysu.edu.cn.
Nanoscale ; 14(11): 4234-4243, 2022 Mar 17.
Article en En | MEDLINE | ID: mdl-35234767
Texto completo
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Tipo de estudio: Diagnostic_studies / Prognostic_studies Idioma: En Revista: Nanoscale Año: 2022 Tipo del documento: Article País de afiliación: China
Texto completo
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Tipo de estudio: Diagnostic_studies / Prognostic_studies Idioma: En Revista: Nanoscale Año: 2022 Tipo del documento: Article País de afiliación: China