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Peel-and-Stick Integration of Atomically Thin Nonlayered PtS Semiconductors for Multidimensionally Stretchable Electronic Devices.
Han, Sang Sub; Ko, Tae-Jun; Shawkat, Mashiyat Sumaiya; Shum, Alex Ka; Bae, Tae-Sung; Chung, Hee-Suk; Ma, Jinwoo; Sattar, Shahid; Hafiz, Shihab Bin; Mahfuz, Mohammad M Al; Mofid, Sohrab Alex; Larsson, J Andreas; Oh, Kyu Hwan; Ko, Dong-Kyun; Jung, Yeonwoong.
Afiliación
  • Han SS; NanoScience Technology Center, University of Central Florida, Orlando, Florida 32826, United States.
  • Ko TJ; Department of Materials Science and Engineering, Seoul National University, Seoul 08826, South Korea.
  • Shawkat MS; NanoScience Technology Center, University of Central Florida, Orlando, Florida 32826, United States.
  • Shum AK; NanoScience Technology Center, University of Central Florida, Orlando, Florida 32826, United States.
  • Chung HS; Analytical Research Division, Korea Basic Science Institute, Jeonju 54907, South Korea.
  • Ma J; Analytical Research Division, Korea Basic Science Institute, Jeonju 54907, South Korea.
  • Sattar S; Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States.
  • Hafiz SB; Applied Physics, Division of Materials Science, Department of Engineering Sciences and Mathematics, Luleå University of Technology, Luleå SE-97187, Sweden.
  • Mahfuz MMA; Department of Physics and Electrical Engineering, Linnaeus University, SE-39231 Kalmar, Sweden.
  • Mofid SA; Department of Electrical and Computer Engineering, New Jersey Institute of Technology, Newark, New Jersey 07102, United States.
  • Larsson JA; Department of Electrical and Computer Engineering, New Jersey Institute of Technology, Newark, New Jersey 07102, United States.
  • Oh KH; NanoScience Technology Center, University of Central Florida, Orlando, Florida 32826, United States.
  • Ko DK; Applied Physics, Division of Materials Science, Department of Engineering Sciences and Mathematics, Luleå University of Technology, Luleå SE-97187, Sweden.
  • Jung Y; Department of Materials Science and Engineering, Seoul National University, Seoul 08826, South Korea.
ACS Appl Mater Interfaces ; 14(17): 20268-20279, 2022 May 04.
Article en En | MEDLINE | ID: mdl-35442029
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Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2022 Tipo del documento: Article País de afiliación: Estados Unidos
Texto completo
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2022 Tipo del documento: Article País de afiliación: Estados Unidos