A Novel Manifold Dual-Microchannel Flow Field Structure with High-Performance Heat Dissipation.

Yang, Xing; Lin, Kabin; Zhang, Daxing; Liu, Shaoyi; Han, Baoqing; Wang, Zhihai; Yu, Kunpeng; Wu, Wenzhi; Ge, Dongming; Wang, Congsi

Yang, Xing; Lin, Kabin; Zhang, Daxing; Liu, Shaoyi; Han, Baoqing; Wang, Zhihai; Yu, Kunpeng; Wu, Wenzhi; Ge, Dongming; Wang, Congsi.

Afiliación

Yang X; Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi'an 710071, China.
Lin K; Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi'an 710071, China.
Zhang D; Guangzhou Institute of Technology, Xidian University, Guangzhou 510555, China.
Liu S; Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi'an 710071, China.
Han B; Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi'an 710071, China.
Wang Z; CETC No. 38 Research Institute, Hefei 230088, China.
Yu K; CETC No. 38 Research Institute, Hefei 230088, China.
Wu W; CETC No. 38 Research Institute, Hefei 230088, China.
Ge D; Beijing Institute of Spacecraft System Engineering, Beijing 100094, China.
Wang C; Guangzhou Institute of Technology, Xidian University, Guangzhou 510555, China.

Micromachines (Basel) ; 13(9)2022 Aug 28.

Article en En | MEDLINE | ID: mdl-36144043

Palabras clave

double-microchannel; electronics cooling; manifold microchannel; numerical simulation; thermal performance

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Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: Micromachines (Basel) Año: 2022 Tipo del documento: Article País de afiliación: China

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