A versatile atomic force microscope integrated with a scanning electron microscope.

A versatile atomic force microscope (AFM), which can be installed in a scanning electron microscope (SEM), is introduced. The flexible design of the instrument enables correlated analysis for different experimental configurations, such as AFM imaging directly after nanoindentation in vacuum. In order to demonstrate the capabilities of the specially designed AFM installed inside a SEM, slip steps emanating around nanoindents in single crystalline brass were examined. This example showcases how the combination of AFM and SEM imaging can be utilized for quantitative dislocation analysis through the measurement of the slip step heights without the hindrance of oxide formation. Finally, an in situ nanoindentation technique is introduced, illustrating the use of AFM imaging during indentation experiments to examine plastic deformation occurring under the indenter tip. The mechanical indentation data are correlated to the SEM and AFM images to estimate the number of dislocations emitted to the surface.

Measuring electro-mechanical properties of thin films on polymer substrates.

In order to advance flexible electronic technologies it is important to study the electrical properties of thin metal films on polymer substrates under mechanical load. At the same time, the observation of film deformation and fracture as well as the stresses that are present in the films during straining are also crucial to investigate. To address both the electromechanical and deformation behavior of metal films supported by polymer substrates, in-situ 4 point probe resistance measurements were performed with in-situ atomic force microscopy imaging of the film surface during straining. The 4 point probe resistance measurements allow for the examination of the changes in resistance with strain, while the surface imaging permits the visualization of localized thinning and crack formation. Furthermore, in-situ synchrotron tensile tests provide information about the stresses in the film and show the yield stress where the deformation initiates and the relaxation of the film during imaging. A thin 200 nm Cu film on 23 µm thick PET substrate will be used to illustrate the combined techniques. The combination of electrical measurements, surface imaging, and stress measurements allow for a better understanding of electromechanical behavior needed for the improvement and future success of flexible electronic devices.