RESUMO
The electrical and electromechanical responses of ~200 µm thick extruded nanocomposite films comprising of 4 wt.% and 5 wt.% multiwall carbon nanotubes mixed with polypropylene are investigated under an alternating current (AC) and compared to their direct current (DC) response. The AC electrical response to frequency (f) and strain (piezoimpedance) is characterized using two configurations, namely one that promotes resistive dominance (resistive configuration) and the other that promotes the permittivity/capacitive contribution (dielectric configuration). For the resistive configuration, the frequency response indicated a resistive-capacitive (RC) behavior (negative phase angle, θ), with a significant contribution of capacitance for frequencies of 104 Hz and above, depending on the nanotube content. The piezoimpedance characterization in the resistive configuration yielded an increasing impedance modulus (|Z|) and an increasing (negative) value of θ as the strain increased. The piezoimpedance sensitivity at f = 10 kHz was ~30% higher than the corresponding DC piezoresistive sensitivity, yielding a sensitivity factor of 9.9 for |Z| and a higher sensitivity factor (~12.7) for θ. The dielectric configuration enhanced the permittivity contribution to impedance, but it was the least sensitive to strain.
RESUMO
The effect of polymerization kinetics and resin viscosity on the electrical response of a single carbon nanotube yarn (CNTY) embedded in a vinyl ester resin (VER) during polymerization was investigated. To analyze the effect of the polymerization kinetics, the concentration of initiator (methyl ethyl ketone peroxide) was varied at three levels, 0.6, 0.9, and 1.2 wt.%. Styrene monomer was added to VER, to reduce the polymer viscosity and to determine its effect on the electrical response of the CNTY upon resin wetting and infiltration. Upon wetting and wicking of the CNTY by VER, a transient decrease in the CNTY electrical resistance (ca. -8%) was observed for all initiator concentrations. For longer times, this initial decrease in electrical resistance may become a monotonic decrease (up to ca. -17%) or change its trend, depending on the initiator concentration. A higher concentration of initiator showed faster and more negative electrical resistance changes, which correlate with faster gel times and higher build-up of residual stresses. An increase in styrene monomer concentration (reduced viscosity) resulted in an upward shift of the electrical resistance to less negative values. Several mechanisms, including wetting, wicking, infiltration, electronic transfer, and shrinkage, are attributed to the complex electrical response of the CNTY upon resin wetting and infiltration.
RESUMO
Curing effects were investigated by using the electrical response of a single carbon nanotube yarn (CNTY) embedded in an epoxy resin during the polymerization process. Two epoxy resins of different viscosities and curing temperatures were investigated, varying also the concentration of the curing agent. It is shown that the kinetics of resin curing can be followed by using the electrical response of an individual CNTY embedded in the resin. The electrical resistance of an embedded CNTY increased (~ 9%) after resin curing for an epoxy resin cured at 130 °C with viscosity of ~ 59 cP at the pouring/curing temperature ("Epon 862"), while it decreased (~ -9%) for a different epoxy cured at 60 °C, whose viscosity is about double at the corresponding curing temperature. Lowering the curing temperature from 60 °C to room temperature caused slower and smoother changes of electrical resistance over time and smaller (positive) residual resistance. Increasing the concentration of the curing agent caused a faster curing kinetics and, consequently, more abrupt changes of electrical resistance over time, with negative residual electrical resistance. Therefore, the resin viscosity and curing kinetics play a paramount role in the CNTY wicking, wetting and resin infiltration processes, which ultimately govern the electrical response of the CNTY immersed into epoxy.
