RESUMO
An effort has been made to understand the nucleate and the rapid film boiling phenomena under the influence of an electric field using a molecular viewpoint. The behavior of water molecules with a solid copper surface during the film boiling process in the presence of an electric field of different intensities has been studied. The molecular reasoning behind the suppression of the Leidenfrost phenomenon upon application of a uniform electric field along the heating substrate is established. Furthermore, the effect of surface characteristics with different wettabilities on film boiling in the presence of an electric field has also been studied. The electric field produces a finger-like water column besides thinning of the water film over a non-wetting surface. A similar phenomenon is also evident over a hydrophilic surface only after reaching a threshold value of electric charge intensity. Molecular simulations have explained the phenomenon of nucleate boiling of water on hydrophilic or non-wetting surfaces. Finally, the ability to control the bubble formation and suppression at a required location using an electric field has also been demonstrated. The water molecules near the surface experience dispersion at a lower electric field and an attraction force at a higher electric field, mimicking bubble nucleation and suppression, respectively.