A laser-based Ångstrom method for in-plane thermal characterization of isotropic and anisotropic materials using infrared imaging.

High heat fluxes generated in electronics and semiconductor packages require materials with high thermal conductivity to effectively diffuse the heat and avoid local hotspots. Engineered heat spreading materials typically exhibit anisotropic conduction behavior due to their composite construction. The design of thermal management solutions is often limited by the lack of fast and accurate characterization techniques for such anisotropic materials. A popular technique for measuring the thermal diffusivity of bulk materials is the Ångstrom method, where a thin strip or rod of material is heated periodically at one end, and the corresponding transient temperature profile is used to infer the thermal diffusivity. However, this method is generally limited to the characterization of one-dimensional samples and requires multiple measurements with multiple samples to characterize anisotropic materials. Here, we present a new measurement technique for characterizing the isotropic and anisotropic in-plane thermal properties of thin films and sheets as an extension of the one-dimensional Ångstrom method and other lock-in thermography techniques. The measurement leverages non-contact infrared temperature mapping to measure the thermal response from laser-based periodic heating at the center of a suspended thin film sample. Uniquely, our novel data extraction method does not require precise knowledge of the boundary conditions. To validate the accuracy of this technique, numerical models are developed to generate transient temperature profiles for hypothetical anisotropic materials with known properties. The resultant temperature profiles are processed through our fitting algorithm to extract the in-plane thermal conductivities without knowledge of the input properties of the model. Across a wide range of in-plane thermal conductivities, these results agree well with the input values. Experiments demonstrate the approach for a known isotropic reference material and an anisotropic heat spreading material. The limits of accuracy of this technique are identified based on the experimental and sample parameters. Further standardization of this measurement technique will enable the development and characterization of engineered heat spreading materials with desired anisotropic properties for various applications.

Thermal and mechanical characterization of high performance polymer fabrics for applications in wearable devices.

With advances in flexible and wearable device technology, thermal regulation will become increasingly important. Fabrics and substrates used for such applications will be required to effectively spread any heat generated in the devices to ensure user comfort and safety, while also preventing overheating of the electronic components. Commercial fabrics consisting of ultra-high molecular weight polyethylene (UHMW-PE) fibers are currently used in personal body armor and sports gear owing to their high strength, durability, and abrasion resistance. In addition to superior mechanical properties, UHMW-PE fibers exhibit very high axial thermal conductivity due to a high degree of polymer chain orientation. However, these materials have not been widely explored for thermal management applications in flexible and wearable devices. Assessment of their suitability for such applications requires characterization of the thermal and mechanical properties of UHMW-PE in the fabric form that will ultimately be used to construct heat spreading materials. Here, we use advanced techniques to characterize the thermal and mechanical properties of UHMW-PE fabrics, as well as other conventional flexible materials and fabrics. An infrared microscopy-based approach measures the effective in-plane thermal conductivity, while an ASTM-based bend testing method quantifies the bending stiffness. We also characterize the effective thermal behavior of fabrics when subjected to creasing and thermal annealing to assess their reliability for relevant practical engineering applications. Fabrics consisting of UHMW-PE fibers have significantly higher thermal conductivities than the benchmark conventional materials while possessing good mechanical flexibility, thereby showcasing great potential as substrates for flexible and wearable heat spreading application.

A thin film efficient pn-junction thermoelectric device fabricated by self-align shadow mask.

Large area highly crystalline MoS2 and WS2 thin films were successfully grown on different substrates using radio-frequency magnetron sputtering technique. Structural, morphological and thermoelectric transport properties of MoS2, and WS2 thin films have been investigated systematically to fabricate high-efficient thermal energy harvesting devices. X-ray diffraction data revealed that crystallites of MoS2 and WS2 films are highly oriented in 002 plane with uniform grain size distribution confirmed through atomic force microscopy study. Surface roughness increases with substrate temperature and it plays a big role in electron and phonon scattering. Interestingly, MoS2 films also display low thermal conductivity at room temperature and strongly favors achievement of higher thermoelectric figure of merit value of up to 1.98. Raman spectroscopy data shows two distinct MoS2 vibrational modes at 380 cm-1 for E12g and 410 cm-1 for A1g. Thermoelectric transport studies further demonstrated that MoS2 films show p-type thermoelectric characteristics, while WS2 is an n-type material. We demonstrated high efficient pn-junction thermoelectric generator device for waste heat recovery and cooling applications.