Probing the Atomic-Scale Structure of Amorphous Aluminum Oxide Grown by Atomic Layer Deposition.

Atomic layer deposition (ALD) is a well-established technique for depositing nanoscale coatings with pristine control of film thickness and composition. The trimethylaluminum (TMA) and water (H2O) ALD chemistry is inarguably the most widely used and yet to date, we have little information about the atomic-scale structure of the amorphous aluminum oxide (AlOx) formed by this chemistry. This lack of understanding hinders our ability to establish process-structure-property relationships and ultimately limits technological advancements employing AlOx made via ALD. In this work, we employ synchrotron high-energy X-ray diffraction (HE-XRD) coupled with pair distribution function (PDF) analysis to characterize the atomic structure of amorphous AlOx ALD coatings. We combine ex situ and in operando HE-XRD measurements on ALD AlOx and fit these experimental data using stochastic structural modeling to reveal variations in the Al-O bond length, Al and O coordination environment, and extent of Al vacancies as a function of growth conditions. In particular, the local atomic structure of ALD AlOx is found to change with the substrate and number of ALD cycles. The observed trends are consistent with the formation of bulk Al2O3 surrounded by an O-rich surface layer. We deconvolute these data to reveal atomic-scale structural information for both the bulk and surface phases. Overall, this work demonstrates the usefulness of HE-XRD and PDF analysis in improving our understanding of the structure of amorphous ALD thin films and provides a pathway to evaluate how process changes impact the structure and properties of ALD films.

In Situ Thermal Atomic Layer Etching for Sub-5 nm InGaAs Multigate MOSFETs.

Thermal atomic layer etching (ALE) was demonstrated on ternary III-V compound semiconductors. In particular, thermal ALE on InGaAs and InAlAs was achieved with sequential, self-limiting fluorination and ligand-exchange reactions using hydrogen fluoride (HF) as the fluorination reactant and dimethylaluminum chloride (DMAC) as the ligand-exchange reactant. Thermal ALE was investigated on planar surfaces and three-dimensional nanostructures. The measured radial etch rates on In0.53Ga0.47As and In0.52Al0.48As vertical nanowires (VNWs) at 300 °C were 0.24 and 0.62 Å/cycle, respectively. An optimized thermal ALE process did not increase the surface roughness after 200 cycles. The etching process also displayed selectivity and orientation dependence. This new thermal ALE process in combination with in situ atomic layer deposition (ALD) was used to fabricate InGaAs gate-all-around structures with minimum width down to 3 nm. The in situ ALE-ALD process produced a sharp vertical MOS interface. Finally, the merits of thermal ALE were demonstrated in the fabrication of n-channel InGaAs FinFETs with record ON-state and OFF-state transistor performance. On the basis of this transistor demonstration, thermal ALE shows great promise for high-volume device manufacturing.

Electron-Enhanced Atomic Layer Deposition of Boron Nitride Thin Films at Room Temperature and 100 °C.

Electron-enhanced atomic layer deposition (EE-ALD) was used to deposit boron nitride (BN) thin films at room temperature and 100 °C using sequential exposures of borazine (B3N3H6) and electrons. Electron-stimulated desorption (ESD) of hydrogen surface species and the corresponding creation of reactive dangling bonds are believed to facilitate borazine adsorption and reduce the temperature required for BN film deposition. In situ ellipsometry measurements showed that the BN film thickness increased linearly versus the number of EE-ALD cycles at room temperature. Maximum growth rates of ~3.2 Å/cycle were measured at electron energies of 80-160 eV. BN film growth was self-limiting versus borazine and electron exposures, as expected for an ALD process. The calculated average hydrogen ESD cross section was σ = 4.2 × 10-17 cm2. Ex situ spectroscopic ellipsometry measurements across the ~1 cm2 area of the BN film defined by the electron beam displayed good uniformity in thickness. Ex situ X-ray photoelectron spectroscopy and in situ Auger spectroscopy revealed high purity, slightly boron-rich BN films with C and O impurity levels <3 at. %. High-resolution transmission electron microscopy (HR-TEM) imaging revealed polycrystalline hexagonal and turbostratic BN with the basal planes approximately parallel to the substrate surface. Ex situ grazing incidence X-ray diffraction measurements observed peaks consistent with hexagonal BN with domain sizes of 1-2 nm. The BN EE-ALD growth rate of ~3.2 Å/cycle is close to the distance of 3.3 Å between BN planes in hexagonal BN. The growth rate and HR-TEM images suggest that approximately one monolayer of BN is deposited for every BN EE-ALD cycle. TEM and scanning TEM/electron energy loss spectroscopy measurements of BN EE-ALD on trenched wafers also showed preferential BN EE-ALD on the horizontal surfaces. This selective deposition on the horizontal surfaces suggests that EE-ALD may enable bottom-up filling of vias and trenches.

Rapid Growth of Crystalline Mn5O8 by Self-Limited Multilayer Deposition using Mn(EtCp)2 and O3.

This work investigates the use of ozone as a post-treatment of ALD-grown MnO and as a coreactant with bis(ethylcyclopentadienyl)manganese (Mn(EtCp)2) in ALD-like film growth. In situ quartz crystal microbalance measurements are used to monitor the mass changes during growth, which are coupled with ex situ materials characterization following deposition to evaluate the resulting film composition and structure. We determined that during O3 post-treatment of ALD-grown MnO, O3 oxidizes the near-surface region corresponding to a conversion of 22 Å of the MnO film to MnO2. Following oxidation by O3, exposure of Mn(EtCp)2 results in mass gains of over 300 ng/cm(2), which exceeds the expected mass gain for reaction of the Mn(EtCp)2 precursor with surface hydroxyls by over four times. We attribute this high mass gain to adsorbed Mn(EtCp)2 shedding its EtCp ligands at the surface and releasing Mn(II) ions which subsequently diffuse into the bulk film and partially reduce the oxidized film back to MnO. These Mn(EtCp)2 and O3 reactions are combined in sequential steps with (a) Mn(EtCp)2 reacting at the surface of an O-rich layer, shedding its two EtCp ligands and freeing Mn(II) to diffuse into the film followed by (b) O3 oxidizing the film surface and withdrawing Mn from the subsurface to create an O-rich layer. This deposition process results in self-limiting multilayer deposition of crystalline Mn5O8 films with a density of 4.7 g/cm(3) and an anomalously high growth rate of 5.7 Å/cycle. Mn5O8 is a metastable phase of manganese oxide which possesses an intermediate composition between the alternating MnO and MnO2 compositions of the near-surface during the Mn(EtCp)2 and O3 exposures.

Electron Enhanced Growth of Crystalline Gallium Nitride Thin Films at Room Temperature and 100 °C Using Sequential Surface Reactions.

Low energy electrons may provide mechanisms to enhance thin film growth at low temperatures. As a proof of concept, this work demonstrated the deposition of gallium nitride (GaN) films over areas of ∼5 cm2 at room temperature and 100 °C using electrons with a low energy of 50 eV from an electron flood gun. The GaN films were deposited on Si(111) wafers using a cycle of reactions similar to the sequence employed for GaN atomic layer deposition (ALD). Trimethylgallium (Ga(CH3)3, TMG), hydrogen (H) radicals and ammonia (NH3) were employed as the reactants with electron exposures included in the reaction cycle after the TMG/H and NH3 exposures. A number of ex situ techniques were then employed to analyze the GaN films. Spectroscopic ellipsometry measurements revealed that the GaN films grew linearly with the number of reaction cycles. Linear growth rates of up to 1.3 Å/ cycle were obtained from the surface areas receiving the highest electron fluxes. Grazing incidence X-ray diffraction analysis revealed polycrystalline GaN films with the wurtzite crystal structure. Transmission electron microscopy (TEM) images showed crystalline grains with diameters between 2 and 10 nm depending on the growth temperature. X-ray photoelectron spectroscopy depth-profiling displayed no oxygen contamination when the GaN films were capped with Al prior to atmospheric exposure. However, the carbon concentrations in the GaN films were 10-35 at. %. The mechanism for the low temperature GaN growth is believed to result from the electron stimulated desorption (ESD) of hydrogen. Hydrogen ESD yields dangling bonds that facilitate Ga-N bond formation. Mass spectrometry measurements performed concurrently with the reaction cycles revealed increases in the pressure of H2 and various GaN etch products during the electron beam exposures. The amount of H2 and GaN etch products increased with electron beam energy from 25 to 200 eV. These results indicate that the GaN growth occurs with competing GaN etching during the reaction cycles.

Ultrathin oxide films by atomic layer deposition on graphene.

In this paper, a method is presented to create and characterize mechanically robust, free-standing, ultrathin, oxide films with controlled, nanometer-scale thickness using atomic layer deposition (ALD) on graphene. Aluminum oxide films were deposited onto suspended graphene membranes using ALD. Subsequent etching of the graphene left pure aluminum oxide films only a few atoms in thickness. A pressurized blister test was used to determine that these ultrathin films have a Young's modulus of 154 ± 13 GPa. This Young's modulus is comparable to much thicker alumina ALD films. This behavior indicates that these ultrathin two-dimensional films have excellent mechanical integrity. The films are also impermeable to standard gases suggesting they are pinhole-free. These continuous ultrathin films are expected to enable new applications in fields such as thin film coatings, membranes, and flexible electronics.

Molecular layer deposition of aluminum alkoxide polymer films using trimethylaluminum and glycidol.

Molecular layer deposition (MLD) of aluminum alkoxide polymer films was examined using trimethlyaluminum (TMA) and glycidol (GLY) as the reactants. Glycidol is a high vapor pressure heterobifunctional reactant with both hydroxyl and epoxy chemical functionalites. These two different functionalities help avoid "double reactions" that are common with homobifuctional reactants. A variety of techniques, including in situ Fourier transform infrared (FTIR) spectroscopy and quartz crystal microbalance (QCM) measurements, were employed to study the film growth. FTIR measurements at 100 and 125 °C observed the selective reaction of the GLY hydroxyl group with the AlCH(3) surface species during GLY exposure. Epoxy ring-opening and methyl transfer from TMA to the surface epoxy species were then monitored during TMA exposure. This epoxy ring-opening reaction is dependent on strong Lewis acid-base interactions between aluminum and oxygen. The QCM experiments observed linear growth with self-limiting surface reactions at 100-175 °C under certain growth conditions. With a sufficient purge time of 20 s after TMA and GLY exposures at 125 °C, the mass gain per cycle (MGPC) was 19.8 ng/cm(2)-cycle. The individual mass gains after the TMA and GLY exposures were also consistent with a TMA/GLY stoichiometry of 4:3 in the MLD film. This TMA/GLY stoichiometry suggests the presence of Al(2)O(2) dimeric core species. The MLD films resulting from these TMA and GLY exposures also evolved with annealing temperature to form thinner conformal porous films with increased density. Non-self-limiting growth was a problem at shorter purge times and lower temperatures. With shorter purge times of 10 s at 125 °C, the MPGC increased dramatically to 134 ng/cm(2)-cycle. The individual mass gains after the TMA and GLY exposures in the CVD regime were consistent with a TMA/GLY stoichiometry of 1:1. The MGPC decreased progressively versus purge time. This behavior was attributed to the removal of reactants that could lead to CVD and the instability of the surface species after the reactant exposures. These results reveal that the TMA and GLY reaction displays much complexity and must be carefully controlled to be a useful MLD process.

Using atomic layer deposition to hinder solvent decomposition in lithium ion batteries: first-principles modeling and experimental studies.

Passivating lithium ion (Li) battery electrode surfaces to prevent electrolyte decomposition is critical for battery operations. Recent work on conformal atomic layer deposition (ALD) coating of anodes and cathodes has shown significant technological promise. ALD further provides well-characterized model platforms for understanding electrolyte decomposition initiated by electron tunneling through a passivating layer. First-principles calculations reveal two regimes of electron transfer to adsorbed ethylene carbonate molecules (EC, a main component of commercial electrolyte), depending on whether the electrode is alumina coated. On bare Li metal electrode surfaces, EC accepts electrons and decomposes within picoseconds. In contrast, constrained density functional theory calculations in an ultrahigh vacuum setting show that, with the oxide coating, e(-) tunneling to the adsorbed EC falls within the nonadiabatic regime. Here the molecular reorganization energy, computed in the harmonic approximation, plays a key role in slowing down electron transfer. Ab initio molecular dynamics simulations conducted at liquid EC electrode interfaces are consistent with the view that reactions and electron transfer occur right at the interface. Microgravimetric measurements demonstrate that the ALD coating decreases electrolyte decomposition and corroborates the theoretical predictions.

Ultrathin coatings on nano-LiCoO2 for Li-ion vehicular applications.

To deploy Li-ion batteries in next-generation vehicles, it is essential to develop electrodes with durability, high energy density, and high power. Here we report a breakthrough in controlled full-electrode nanoscale coatings that enables nanosized materials to cycle with durable high energy and remarkable rate performance. The nanoparticle electrodes are coated with Al(2)O(3) using atomic layer deposition (ALD). The coated nano-LiCoO(2) electrodes with 2 ALD cycles deliver a discharge capacity of 133 mAh/g with currents of 1400 mA/g (7.8C), corresponding to a 250% improvement in reversible capacity compared to bare nanoparticles (br-nLCO), when cycled at this high rate. The simple ALD process is broadly applicable and provides new opportunities for the battery industry to design other novel nanostructured electrodes that are highly durable even while cycling at high rate.

Conformal surface coatings to enable high volume expansion Li-ion anode materials.

An alumina surface coating is demonstrated to improve electrochemical performance of MoO(3) nanoparticles as high capacity/high-volume expansion anodes for Li-ion batteries. Thin, conformal surface coatings were grown using atomic layer deposition (ALD) that relies on self-limiting surface reactions. ALD coatings were tested on both individual nanoparticles and prefabricated electrodes containing conductive additive and binder. The coated and non-coated materials were characterized using transmission electron microscopy, energy-dispersive X-ray spectroscopy, electrochemical impedance spectroscopy, and galvanostatic charge/discharge cycling. Importantly, increased stability and capacity retention was only observed when the fully fabricated electrode was coated. The alumina layer both improves the adhesion of the entire electrode, during volume expansion/contraction and protects the nanoparticle surfaces. Coating the entire electrode also allows for an important carbothermal reduction process that occurs during electrode pre-heat treatment. ALD is thus demonstrated as a novel and necessary method that may be employed to coat the tortuous network of a battery electrode.

Atomic layer deposition on gram quantities of multi-walled carbon nanotubes.

Atomic layer deposition (ALD) was employed to grow coaxial thin films of Al(2)O(3) and Al(2)O(3) /W bilayers on multi-walled carbon nanotubes (MWCNTs). Although the MWCNTs have an extremely high surface area, a rotary ALD reactor was successfully employed to perform ALD on gram quantities of MWCNTs. The uncoated and ALD-coated MWCNTs were characterized with transmission electron microscopy and x-ray photoelectron spectroscopy. Al(2)O(3) ALD on untreated MWCNTs was characterized by nucleation difficulties that resulted in the growth of isolated Al(2)O(3) nanospheres on the MWCNT surface. The formation of a physisorbed NO(2) monolayer provided an adhesion layer for the nucleation and growth of Al(2)O(3) ALD films. The NO(2) monolayer facilitated the growth of extremely conformal coaxial Al(2)O(3) ALD coatings on the MWCNTs. Cracks were also observed in the coaxial Al(2)O(3) ALD films on the MWCNTs. After cracking, the coaxial Al(2)O(3) ALD films were observed to slide on the surface of the MWCNTs and expose regions of bare MWCNTs. The Al(2)O(3) ALD film also served as a seed layer for the growth of W ALD on the MWCNTs. The W ALD films can significantly reduce the resistance of the W/Al(2)O(3)/MWCNT wire. The results demonstrate the potential for ALD films to tune the properties of gram quantities of very high surface area MWCNTs.

Quantum confinement in amorphous TiO(2) films studied via atomic layer deposition.

Despite the significant recent increase in quantum-based optoelectronics device research, few deposition techniques can reliably create the required functional nanoscale systems. Atomic layer deposition (ALD) was used here to study the quantum effects attainable through the use of this ångström-level controlled growth process. Size-dependent quantum confinement has been demonstrated using TiO(2) layers of nanoscale thickness applied to the surfaces of silicon wafers. TiO(2) films were deposited at 100 °C using TiCl(4) and H(2)O(2) in a viscous flow ALD reactor, at a rate of 0.61 Å/cycle. The low-temperature process was utilized to guarantee the amorphous deposition of TiO(2) layers and post-deposition thermal annealing was employed to promote crystallite-size modification. Hydrogen peroxide significantly reduced the residual chlorine that remained from a typical TiCl(4)-H(2)O ALD process at this temperature, down to 1.6%. Spectroscopic ellipsometry was used to quantify the optical properties both below and above the bandgap energy. A central composite design was employed to map the surface response of the film thickness-dependent bandgap shift for the as-deposited case and up to a thermal annealing temperature of 550 °C. The Brus model was used to develop a correlation between the amorphous TiO(2) film thickness and the quantum length to promote equivalent bandgap shifts.