Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding.

The aim of this study was to develop a flexible package technology using laser-assisted bonding (LAB) technology and an anisotropic solder paste (ASP) material ultimately to reduce the bonding temperature and enhance the flexibility and reliability of flexible devices. The heat transfer phenomena during the LAB process, mechanical deformation, and the flexibility of a flexible package were analyzed by experimental and numerical simulation methods. The flexible package was fabricated with a silicon chip and a polyimide (PI) substrate. When the laser beam was irradiated onto the flexible package, the temperatures of the solder increased very rapidly to 220 °C, high enough to melt the ASP solder, within 2.4 s. After the completion of irradiation, the temperature of the flexible package decreased quickly. It was found that the solder powder in ASP was completely melted and formed stable interconnections between the silicon chip and the copper pads, without thermal damage to the PI substrate. After the LAB process, the flexible package showed warpage of 80 µm, which was very small compared to the size of the flexible package. The stress of each component in the flexible package generated during the LAB process was also found to be very low. The flexible device was bent up to 7 mm without failure, and the flexibility can be improved further by reducing the thickness of the silicon chip. The bonding strength and environmental reliability tests also showed the excellent mechanical endurance of the flexible package.

Enhancement of the Bond Strength and Reduction of Wafer Edge Voids in Hybrid Bonding.

The hybrid wafer bonding technique is drawing much interest in relation to three-dimensional integration technology, and its areas of application are expanding from image sensors to semiconductor memory packages. In hybrid bonding, the bond strength and void formation are the main issues influencing the performance, reliability, and yield of the bonding. In this study, we systematically investigate several parameters that affect both the bond strength and void formation, including the plasma gas, plasma power, and surface roughness. In particular, the effects of the wafer warpage on void formation were investigated. As O2 gas was used during plasma activation, the highest oxide growth rate and strongest bond strength were achieved. The bond strength improved when the oxide thickness was increased. An increase in the low-frequency plasma power improved the bond strength. However, when the plasma power increased further, the surface roughness increased due to the ion bombardment effect during the use of the plasma, resulting in a reduction in the bond strength. Therefore, optimization of the plasma power is required to improve the bond strength. It was found that the wafer warpage was also an important parameter which affected the formation of edge voids. The wafers with residual compressive stress exhibited fewer edge voids than those with tensile stress. Several methods to minimize edge void formation in wafers are proposed. The present study will provide practical guidelines to enhance the quality and yield of the bonding process and devices.

Enhanced Conductivity in Highly Stretchable Silver and Polymer Nanocomposite Conductors.

In stretchable conductors, there is a trade-off relationship between the stretchability and conductivity which makes it difficult to increase both properties simultaneously. From a practical point of view, however, high conductivity is a more important parameter for real-world applications of wearable and mobile electronics. To obtain a highly conductive stretchable conductor, we developed a stretchable conductor composed of silver (Ag) flat-type microparticles, Ag nanoparticles and a polyester binder. The printed stretchable conductor was then sintered using the intense pulse light sintering technique. The effects of different mixing ratios of Ag flat-type particles and nanoparticles on dispersibility, printability, surface properties, conductivity, and stretchability were examined. Increasing the content of Ag-flat type particles in the composite improved dispersibility, printability, and conductivity. The stretchable conductor exhibited the outstanding conductivity of 5.5×106 S/m. Increasing the Ag nanoparticles content increased the stretchability of the conductor. As the nanoparticle content increased to 30%, the stretchable conductor showed the excellent stretchability of 210%, and withstood 2,600 repeated stretching cycles at a fixed tensile strain of 50%. The conductors also exhibited superb foldability during 10,000 repeated folding tests, up to a radius of 1 mm, without any failures.

Development and Characteristics of Multipurpose Transparent Polyurethane Film.

In industry, recent research developments include flexible films and foldable films. The next step is the development of stretchable films, and studies are being intensively carried out. Research on the development of stretchable and transparent materials is also increasing greatly. Currently, polydimethylsiloxane (PDMS) is the most commonly used film in the industry. However, PDMS surfaces are hydrophobic, so their use is limited to making materials and compounds with hydrophilic properties. In this study, we developed a transparent polyurethane film that can be used for multiple purposes. A transparency comparison between the transparent polyurethane film and the general polyurethane film was used to verify their future application. The conventional polyurethane films showed a transmittance rate of 2.2 percent, but the transparent polyurethane films achieved a high transmittance rate of 85 percent. To determine whether the film can be realized, we produced a conductive paste using resin for the transparent polyurethane film. In addition, a conductive paste was made based on the material used in the transparent polyurethane film to verify the hardness and reliability of the adhesion of electrodes, and we confirmed this with thermogravimetric analysis (TGA). The transparent polyurethane based paste was made with stretchable electrodes through a screen printing method. The manufactured stretchable electrodes were demonstrated by mechanical and adhesion tests. Finally, a permittivity test was conducted to determine the suitability of the film for application to printed electrodes for antennas in the future. The genetic rate of transparent polyurethane films was better than that of conventional polyurethane films. Moreover, the adhesion of the transparent polyurethane film and stretchable electrodes was as good as that of conventional polyurethane film and stretchable electrodes, and observation by optical microscopy confirmed that the printing performance was also excellent. In addition, the conductive paste made based on the transparent polyurethane film material was cured for 1 hour at 120 °C, and TGA analysis confirmed that both the binders and curing agent responded well in the test for curing the developed stretchable electrodes and transparent polyurethane.

Topology-Changing Broadband Metamaterials Enabled by Closable Nanotrenches.

One of the most straightforward methods to actively control optical functionalities of metamaterials is to apply mechanical strain deforming the geometries. These deformations, however, leave symmetries and topologies largely intact, limiting the multifunctional horizon. Here, we present topology manipulation of metamaterials fabricated on flexible substrates by mechanically closing/opening embedded nanotrenches of various geometries. When an inner bending is applied on the substrate, the nanotrench closes and the accompanying topological change results in abrupt switching of metamaterial functionalities such as resonance, chirality, and polarization selectivity. Closable nanotrenches can be embedded in metamaterials of broadband spectrum, ranging from visible to microwave. The 99.9% extinction performance is robust, enduring more than a thousand bending cycles. Our work provides a wafer-scale platform for active quantum plasmonics and photonic application of subnanometer phenomena.

Deformation Behavior of Various Interconnection Structures Using Fine Pitch Microelectromechanical Systems (MEMS) Vertical Probe.

Recently, fine pitch wafer level packaging (WLP) technologies have drawn a great attention in the semiconductor industries. WLP technology uses various interconnection structures including microbumps and through-silicon-vias (TSVs). To increase yield and reduce cost, there is an increasing demand for wafer level testing. Contact behavior between probe and interconnection structure is a very important factor affecting the reliability and performance of wafer testing. In this study, with a MEMS vertical probe, we performed systematic numerical analysis of the deformation behavior of various interconnection structures, including solder bump, copper (Cu) pillar bump, solder capper Cu bump, and TSV. During probing, the solder ball showed the largest deformation. The Cu pillar bump also exhibited relatively large deformation. The Cu bump began to deform at OD of 10 µm. At OD of 20 µm, bump pillar was compressed, and the height of the bump decreased by 8.3%. The deformation behavior of the solder capped Cu bump was similar to that of the solder ball. At OD of 20 µm, the solder and Cu bumps were largely deformed, and the total height was reduced by 11%. The TSV structure showed the lowest deformation, but exerted the largest stress on the probe. In particular, copper protrusion at the outer edge of the via was observed, and very large shear stress was generated between the via and the silicon oxide layer. In summary, when probing various interconnection structures, the probe stress is less than that when using an aluminum pad. On the other hand, deformation of the structure is a critical issue. In order to minimize damage to the interconnection structure, smaller size probes or less overdrive should be used. This study will provide important guidelines for performing wafer-level testing and minimizing damage of probes and interconnection structures.

Large-Scale Rapid Laser Sintering of Highly Stretchable Electrodes Using a Homogenized Rectangular Laser Beam.

This study explored the feasibility of a fast and uniform large-scale laser sintering method for sintering stretchable electrodes. A homogenized rectangular infrared (IR) laser with a wavelength of 980 nm was used in the sintering process. A highly stretchable composite electrode was fabricated using silver (Ag) microparticles and Ag flakes as the fillers and polyester resin as the binder on the polyurethane substrate. This laser-sintering method showed a sintering time of 1 sec and a very uniform temperature across the surface, resulting in enhancing the conductivity and stretchability of the electrodes. The effects of the laser power on the electrical and electromechanical properties of the electrodes were investigated. Using stretching, bending, and twisting tests, the feasibility of the laser-sintered stretchable electrodes was comprehensively examined. The electrode that was sintered at a laser power of 50 W exhibited superior stretchability at a strain of 210%, high mechanical endurance of 1,000 repeated cycles, and excellent adhesion. The stretchable electrodes showed excellent bendability and twistability in which the electrodes can be bent up to 1 mm and twisted up to 90° without any damage; thus, they are highly applicable as stretchable electrodes for wearable electronics. Additionally, the Ag composites were explored for use in a radio-frequency (RF) stretchable antenna to confirm the application of the laser-sintering method for stretchable and wearable electronic devices. The stretchable dipole antenna showed an excellent radiation efficiency of 95% and a highly stable operation, even when stretched to 90% strain.

Effects of Binder and Substrate Materials on the Performance and Reliability of Stretchable Nanocomposite Strain Sensors.

In stretchable strain sensors, highly elastic elastomers such as polydimethylsiloxane (PDMS), Ecoflex, and polyurethane are commonly used for binder materials of the nanocomposite and substrates. However, the viscoelastic nature of the elastomers and the interfacial action between nanofillers and binders influence the critical sensor performances, such as repeatability, response, and hysteresis behavior. In this study, we developed a stretchable nanocomposite strain sensor composed of multiwalled carbon nanotubes and a silicone elastomer binder. The effects of binder and substrate materials on the repeatability, response, hysteresis behavior, and long-term endurance of the strain sensors were systematically investigated using stretching, bending, and repeated cyclic bending tests. Three different binder and substrate materials including PDMS, Ecoflex, and a mixture of PDMS/Ecoflex were tested. The stretchable strain sensors showed an excellent linearity and stretchability of more than 130%. Therefore, the long-term endurance of the strain sensors fabricated with Ecoflex binder should be improved. The strain sensors fabricated with Ecoflex binder showed a relatively large variation in electrical resistance during 10,000-cycle bending tests and repeatability errors at large bending angles. The strain sensors fabricated with PDMS binder showed repeatability errors at small bending angles and a slight response delay of 1 second. On the contrary, the strain sensors fabricated with a mixture of PDMS/Ecoflex binder showed excellent repeatability and response characteristics. The PDMS material showed hysteresis behavior; therefore, the strain sensors fabricated with PDMS binder on PDMS substrate exhibited a large hysteresis behavior in the first stretch-release cycle. It was found that the hysteresis behavior of the strain sensors was mainly dependent on substrate materials than on binder materials. The stretchable strain sensors made of the mixture of PDMS/Ecoflex exhibited excellent repeatability, response, hysteresis behavior, and excellent capability in detecting finger and wrist bending.

Highly Stretchable and Durable Nanocomposite Bow-Tie Antenna for Wearable Application.

We present a highly stretchable and compact bow-tie antenna which operates at 5 GHz for wearable applications. The dimensions of the bow-tie antenna were 7.9 mm×17.8 mm. The stretchable antenna was fabricated with a composite mixture of silver flake and polymer binder. The composite paste was printed on polyurethane and textile using the screen printing technique. The RF performances, stretchability, bendability, and durability of the antennas were evaluated, which are critical requirements in wearable electronics. The stretchable bow-tie antennas showed excellent RF performances and stretchability up to a stretching strain of 40%. The antennas could be bent up to a bending radius of 20 mm without degrading RF performance. The stretchable antennas also exhibited outstanding mechanical endurance after 10,000 cyclic stretching tests. The antennas were not affected by the presence of the body and showed very stable RF performances, exhibiting promising results for mobile and wearable applications.

Secondary Sensitivity Control of Silver-Nanowire-Based Resistive-Type Strain Sensors by Geometric Modulation of the Elastomer Substrate.

A secondary method for modulation of the sensitivity in silver nanowire (AgNW) resistive-type strain sensors without the need to change the material or coating process in the sensory layer is demonstrated. Instead of using a planar elastomer (polydimethylsiloxane is used in this study) substrate, diverse relief structures are introduced to induce nonuniform and complex strain within the elastic substrate and thereby different distributions of the crack density of the AgNWs upon stretching, which plays an important role in the modulation of the gauge factor (GF). Analysis of the sensory layer and mechanical studies reveal that a lower height ratio and greater number of trenches enhance the sensor sensitivity, for example, reaching a GF of 926 at 9.6% in this study. The demonstration of wrist-motion sensors using the technology illustrates the feasibility of using relief structures for various types of sensors and sensitivity ranges using an identical sensor layer.

Robust and stretchable indium gallium zinc oxide-based electronic textiles formed by cilia-assisted transfer printing.

Electronic textile (e-textile) allows for high-end wearable electronic devices that provide easy access for carrying, handling and using. However, the related technology does not seem to be mature because the woven fabric hampers not only the device fabrication process directly on the complex surface but also the transfer printing of ultrathin planar electronic devices. Here we report an indirect method that enables conformal wrapping of surface with arbitrary yet complex shapes. Artificial cilia are introduced in the periphery of electronic devices as adhesive elements. The cilia also play an important role in confining a small amount of glue and damping mechanical stress to maintain robust electronic performance under mechanical deformation. The example of electronic applications depicts the feasibility of cilia for 'stick-&-play' systems, which provide electronic functions by transfer printing on unconventional complex surfaces.

Sticker-type Alq(3)-based OLEDs based on printable ultrathin substrates in periodically anchored and suspended configurations.

Introducing two-dimensional post arrays and a water-soluble sacrificial layer between an ultrathin substrate and a handling substrate provides controllability of the interfacial adhesion in a stable manner. The periodically anchored and suspended configuration after the chemical etching process facilitates the development of, for example, printable Alq3 -based OLEDs that can be attached to unconventional surfaces.

Development of micro-heaters with optimized temperature compensation design for gas sensors.

One of the key components of a chemical gas sensor is a MEMS micro-heater. Micro-heaters are used in both semiconductor gas sensors and NDIR gas sensors; however they each require different heat dissipation characteristics. For the semiconductor gas sensors, a uniform temperature is required over a wide area of the heater. On the other hand, for the NDIR gas sensor, the micro-heater needs high levels of infrared radiation in order to increase sensitivity. In this study, a novel design of a poly-Si micro-heater is proposed to improve the uniformity of heat dissipation on the heating plate. Temperature uniformity of the micro-heater is achieved by compensating for the variation in power consumption around the perimeter of the heater. With the power compensated design, the uniform heating area is increased by 2.5 times and the average temperature goes up by 40 °C. Therefore, this power compensated micro-heater design is suitable for a semiconductor gas sensor. Meanwhile, the poly-Si micro-heater without compensation shows a higher level of infrared radiation under equal power consumption conditions. This indicates that the micro-heater without compensation is more suitable for a NDIR gas sensor. Furthermore, the micro-heater shows a short response time of less than 20 ms, indicating a very high efficiency of pulse driving.

Diagnosis of Helicobacter pylori bacterial infections using a voltammetric biosensor.

The voltammetric assay of Helicobacter pylori DNA was investigated using a bismuth-immobilized carbon nanotube electrode (BCNE). The analytical cyclic voltammetry (CV) peak potential was obtained at a 0.4V reduction scan, where the diagnostic optimum square-wave (SW) stripping working range was achieved at 0.72-7.92 µg/mL H. pylori DNA (11 points). A relative standard deviation of 1.68% (RSD, n=5) was obtained with 3.2 mg/mL H. pylori DNA using a 240 s accumulation time. Under optimum conditions, detection limit was 0.06 µg/mL. The developed sensors can be used for clinical application in the 15th doubted human gastric tissues, since the patient's peak current increased a hundred times more than the negative healthy tissue did. The sensing time obtained was only two minutes, and the process was simpler compared to common PCR amplification and electrophoresis photometric detection systems.