InP-based waveguide photodiodes heterogeneously integrated on silicon-on-insulator for photonic microwave generation.

High-linearity modified uni-traveling carrier photodiodes on silicon-on-insulator with low AM-to-PM conversion factor are demonstrated. The devices deliver more than 2.5 dBm RF output power up to 40 GHz and have an output third order intercept point of 30 dBm at 20 GHz. Photodiode arrays exceed a saturation current-bandwidth-product of 630 mA · GHz and reach unsaturated RF output power levels of 10 dBm at 20 GHz.

High-power flip-chip mounted photodiode array.

Four-element modified uni-traveling-carrier (MUTC) photodiode arrays (PDA) flip-chip bonded onto transmission lines on AlN substrates are demonstrated. High RF output powers of 26.2 dBm and 21.0 dBm are achieved at 35 GHz and 48 GHz, respectively, using a PDA with 28-µm diameter photodiodes. A systematic comparison between a PDA with four 20 µm-diameter elements and a discrete detector with the same active area (40-µm diameter) is presented. The PDA achieved higher output power and thermal dissipation compared to its discrete counterpart.