4-channel 200 Gb/s WDM O-band silicon photonic transceiver sub-assembly.

We demonstrate a 200G capable WDM O-band optical transceiver comprising a 4-element array of Silicon Photonics ring modulators (RM) and Ge photodiodes (PD) co-packaged with a SiGe BiCMOS integrated driver and a SiGe transimpedance amplifier (TIA) chip. A 4×50 Gb/s data modulation experiment revealed an average extinction ratio (ER) of 3.17 dB, with the transmitter exhibiting a total energy efficiency of 2 pJ/bit. Data reception has been experimentally validated at 50 Gb/s per lane, achieving an interpolated 10E-12 bit error rate (BER) for an input optical modulation amplitude (OMA) of -9.5 dBm and a power efficiency of 2.2 pJ/bit, yielding a total power efficiency of 4.2 pJ/bit for the transceiver, including heater tuning requirements. This electro-optic subassembly provides the highest aggregate data-rate among O-band RM-based silicon photonic transceiver implementations, highlighting its potential for next generation WDM Ethernet transceivers.

Silicon photonic 8 × 8 cyclic Arrayed Waveguide Grating Router for O-band on-chip communication.

We report an 8 × 8 silicon photonic integrated Arrayed Waveguide Grating Router (AWGR) targeted for WDM routing applications in O-band. The AWGR was designed for cyclic-frequency operation with a channel spacing of 10 nm. The fabricated AWGR exhibits a compact footprint of 700 × 270 µm2. Static device characterization revealed 3.545 dB maximum channel loss non-uniformity with 2.5 dB best-case channel insertion losses and 11 dB channel crosstalk, in good agreement with the simulated results. Successful data routing operation is demonstrated with 25 Gb/s signals for all 8 × 8 AWGR port combinations with a maximum power penalty of 2.45 dB.

Silicon photonics integrated circuits: a manufacturing platform for high density, low power optical I/O's.

Silicon photonics integrated circuits are considered to enable future computing systems with optical input-outputs co-packaged with CMOS chips to circumvent the limitations of electrical interfaces. In this paper we present the recent progress made to enable dense multiplexing by exploiting the integration advantage of silicon photonics integrated circuits. We also discuss the manufacturability of such circuits, a key factor for a wide adoption of this technology.