Porous materials as effective chemiresistive gas sensors.

Chemiresistive gas sensors (CGSs) have revolutionized the field of gas sensing by providing a low-power, low-cost, and highly sensitive means of detecting harmful gases. This technology works by measuring changes in the conductivity of materials when they interact with a testing gas. While semiconducting metal oxides and two-dimensional (2D) materials have been used for CGSs, they suffer from poor selectivity to specific analytes in the presence of interfering gases and require high operating temperatures, resulting in high signal-to-noise ratios. However, nanoporous materials have emerged as a promising alternative for CGSs due to their high specific surface area, unsaturated metal actives, and density of three-dimensional inter-connected conductive and pendant functional groups. Porous materials have demonstrated excellent response and recovery times, remarkable selectivity, and the ability to detect gases at extremely low concentrations. Herein, our central emphasis is on all aspects of CGSs, with a primary focus on the use of porous materials. Further, we discuss the basic sensing mechanisms and parameters, different types of popular sensing materials, and the critical explanations of various mechanisms involved throughout the sensing process. We have provided examples of remarkable performance demonstrated by sensors using these materials. In addition to this, we compare the performance of porous materials with traditional metal-oxide semiconductors (MOSs) and 2D materials. Finally, we discussed future aspects, shortcomings, and scope for improvement in sensing performance, including the use of metal-organic frameworks (MOFs), covalent-organic frameworks (COFs), and porous organic polymers (POPs), as well as their hybrid counterparts. Overall, CGSs using porous materials have the potential to address a wide range of applications, including monitoring water quality, detecting harmful chemicals, improving surveillance, preventing natural disasters, and improving healthcare.

Effects of thermal annealing on analog resistive switching behavior in bilayer HfO2/ZnO synaptic devices: the role of ZnO grain boundaries.

The effects of thermal annealing on analog resistive switching behavior in bilayer HfO2/ZnO synaptic devices were investigated. The annealed active ZnO layer between the top Pd electrode and the HfO2 layer exhibited electroforming-free resistive switching. In particular, the switching uniformity, stability, and reliability of the synaptic devices were dramatically improved via thermal annealing at 600 °C atomic force microscopy and X-ray diffraction analyses revealed that active ZnO films demonstrated increased grain size upon annealing from 400 °C to 700 °C, whereas the ZnO film thickness and the annealing of the HfO2 layer in bilayer HfO2/ZnO synaptic devices did not profoundly affect the analog switching behavior. The optimized thermal annealing at 600 °C in bilayer HfO2/ZnO synaptic devices dramatically improved the nonlinearity of long-term potentiation/depression properties, the relative coefficient of variation of the asymmetry distribution σ/µ, and the asymmetry ratio, which approached 1. The results offer valuable insights into the implementation of highly robust synaptic devices in neural networks.

ZnWO4 nanorod-colloidal SnO2 quantum dots core@shell heterostructures: Efficient solar-light-driven photocatalytic degradation of tetracycline.

Zinc tungsten oxide (ZW) and colloidal SnO2 quantum dots (CS) were synthesized individually by hydrothermal and wet chemical methods. ZW-CS core@shell nanorods were prepared using a sonochemical method for the enhanced photocatalytic activity of tetracycline (TC) degradation. ZW-CS core@shell nanorods were systematically characterized by structural, morphological mapping and optical techniques. All characterization techniques were synchronized to confirm the construction of core@shell nanorods. Optical absorption studies indicate an increased light-capturing efficiency along with a reduced bandgap from 3.56 to 3.23 eV, which is further supported by photoluminescence. Mapping analysis from SEM and HR-TEM evidence the presence of elements as well as a core@shell nanostructure. The optimized sample of ZW-CS 1.0 shows improved photocatalytic degradation of TC under stimulated solar light. The TC degradation efficiency by ZW-CS 1.0 core@shell nanorods was about 97% within 2 h. The formation of core@shell nanorod structure might be the reason for the better photocatalytic tetracycline degradation performance.

Effect of high-pressure D2 and H2 annealing on LFN properties in FD-SOI pTFET.

Tunneling field-effect transistors (TFETs) are a promising candidate for the next generation of low-power devices, but their performance is very sensitive to traps near the tunneling junction. This study investigated the effects of high-pressure deuterium (D2) annealing and hydrogen (H2) annealing on the electrical performance and low-frequency noise (LFN) of a fully depleted silicon-on-insulator p-type TFET. Without high-pressure annealing, the typical noise power spectral density exhibited two Lorentzian spectra that were affected by fast and slow trap sites. With high-pressure annealing, the interface trap density related to fast trap sites was reduced. The passivation of traps near the tunneling junction indicates that high-pressure H2 and D2 annealing improves the electrical performance and LFN properties, and it may become a significant and necessary step for realizing integrated TFET technology in the future.

IGZO-decorated ZnO thin films and their application for gas sensing.

In this study, indium-gallium-zinc oxide (IGZO)-decorated ZnO thin films were investigated through the change in IGZO deposition time for the detection of NO2 gas. The atomic layer deposited ZnO on interdigitated Au electrode alumina substrates are decorated with IGZO by controlling the deposition time. The IGZO (ZnO:Ga2O3:In2O3 = 1:1:1 mol. %) polycrystalline target was used for deposition and effect of deposition time was investigated. The sensor responses (Rgas/Rair) of 20.6, 39.3, and 57.1 and 45.2, 102.5, and 243.5 were obtained at 150 °C, 200 °C, and 250 °C and 25-ppm NO2 concentration for ZnO (Z1) and IGZO-decorated ZnO (Z3) films, respectively. The sensor response (Rgas/Rair) increased from ∼27 to 243.5 by decorating the ZnO film with IGZO for a 60-s sputtering time. The sensor recovery and response times of the IGZO-decorated ZnO/ZnO sensor increased, and the sensor selectivity to different gases was also evaluated.

Zinc oxide and indium-gallium-zinc-oxide bi-layer synaptic device with highly linear long-term potentiation and depression characteristics.

The electrical properties, resistive switching behavior, and long-term potentiation/depression (LTP/LTD) in a single indium-gallium-zinc-oxide (IGZO) and bi-layer IGZO/ZnO (ZnO: zinc oxide) memristors were investigated for synapse application. The use of the oxide bi-layer memristors, in particular, improved electrical properties such as stability, memristor reliability, and an increase in synaptic weight states. The set voltage of bi-layer IGZO/ZnO memristors was 0.9 V, and the reset voltage was around - 0.7 V, resulting in a low-operating voltage for neuromorphic systems. The oxygen vacancies in the X-ray photoelectron spectroscopy analysis played a role in the modulation of the high-resistance state (HRS) (oxygen-deficient) and the low-resistance state (oxygen-rich) region. The VRESET of the bi-layer IGZO/ZnO memristors was lower than that of a single IGZO, which implied that oxygen-vacancy filaments could be easily ruptured due to the higher oxygen vacancy peak HRS layer. The nonlinearity of the LTP and LTD characteristics in a bi-layer IGZO/ZnO memristor was 6.77% and 11.49%, respectively, compared to those of 20.03% and 51.1% in a single IGZO memristor, respectively. Therefore, the extra ZnO layer in the bi-layer memristor with IGZO was potentially significant and essential to achieve a small set voltage and a reset voltage, and the switching behavior to form the conductive path.

Fluorine-implanted indium-gallium-zinc oxide (IGZO) chemiresistor sensor for high-response NO2 detection.

Gas sensors fabricated using In-Ga-Zn oxide (IGZO) thin films doped with Fluorine (F) were used to detect nitrogen dioxide (NO2) gas. IGZO films with a thickness of 250 nm were deposited onto SiO2/Si substrates via radio-frequency magnetron sputtering, followed by F-doping by an ion-implantation procedure with implant energy of 45 keV and a dose of 3 × 1015 ions/cm2. The NO2 gas detection performance of the fabricated thin-film sensors was tested at various temperatures and NO2 concentrations. The F-doped IGZO (F-IGZO) sensor showed high NO2 gas sensitivity: the ratio between the responses to NO2 and air (Rgas/Rair) was 590 at 250 °C and 100 ppm NO2 gas concentration. F-IGZO sensor showed superior selectivity toward NO2 over other gases. The stability of the sensor was also investigated; the sensor was observed to exhibit stable performance for 2 weeks.

Effective Schottky barrier lowering of NiGe/p-Ge(100) using Terbium interlayer structure for high performance p-type MOSFETs.

Ultra-low contact resistance at the interface between NiGe and p-Ge, i.e., NiGe/p-Ge was achieved by introducing terbium (Tb) as an interlayer in forming NiGe using Tb/Ni/TiN structure. The contact resistance value obtained using the circular transmission line model for an 8-nm thick Tb interlayer sample was 7.21 × 10-8 Ω·cm2, which is two orders of magnitude less than that of reference sample (without the Tb interlayer) of 7.36 × 10-6 Ω·cm2. The current-voltage characteristics were studied at a temperature range of -110 ~ 25 °C to determine the effective Schottky barrier height (eSBH). An eSBH of 0.016 eV was obtained for the 8-nm thick Tb interlayer. Various Tb interlayer thicknesses were selected to study their effect on the contact resistance. The Tb interlayer surface and structural properties were characterized using FESEM, XRD, XPS, TEM, and SIMS analyses.

Temperature Dependence of Low Frequency Noise in Silicon on Insulator Tunneling Field Effect Transistor.

In this work, noise mechanism of a tunneling field-effect transistor (TFET) on a silicon-on-insulator substrate was studied as a function of temperature. The results show that the drain current and subthreshold slope increase with increase in temperature. This temperature dependence is likely caused by the generation of greater current flow owing to decreased silicon band gap and leakage. Further, the TFET noise decreases with increase in temperature. Therefore, the effective tunneling length between the source and the channel appears to decrease and Poole-Frenkel tunneling occurs.