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1.
J Colloid Interface Sci ; 650(Pt B): 1235-1243, 2023 Nov 15.
Artigo em Inglês | MEDLINE | ID: mdl-37478740

RESUMO

The demand for flexible strain sensors with high sensitivity and durability has increased significantly. However, traditional sensors are limited in terms of their detection ranges and fabrications. In this work, a space stacking method was proposed to fabricate natural rubber (NR)/ Ti3C2Tx (MXene)/silica (SiO2) films that possessed exceptional electrical conductivity, sensitivity and reliability. The introduction of SiO2 into the NR/MXene composite enabled the construction of an "island-chain structure", which promoted the formation of conductive pathways and significantly improved the conductivity of the composite. Specifically, the electrical conductivity of the NR/MXene/10 wt%SiO2 composite was enhanced by about 200 times compared to that of the NR/MXene composite alone (from 0.07 to 13.4 S/m). Additionally, the "island-chain structure" further enhanced the sensing properties of the NR/MXene/10 wt%SiO2 composite, as evidenced by its excellent sensitivity (GF = 189.2), rapid response time (102 ms), and good repeatability over 10,000 cycles. The fabricated device demonstrates an outstanding mechanical sensing performance and can accurately detect human physiological signals. Specifically, the device serves as a strain detector, recognizing different strain signals by monitoring the movement of fingers, arms, and thighs. This study provides critical insights into composite manufacturing with exceptional conductivity, flexibility and stability, which are essential properties for creating high-performance flexible sensors.


Assuntos
Borracha , Dióxido de Silício , Humanos , Reprodutibilidade dos Testes , Condutividade Elétrica
2.
ACS Appl Mater Interfaces ; 15(18): 22602-22615, 2023 May 10.
Artigo em Inglês | MEDLINE | ID: mdl-37097807

RESUMO

Constructing porous structures in electromagnetic interference (EMI) shielding materials is a common strategy to decrease the secondary pollution caused by the reflection of electromagnetic waves (EMWs). However, the lack of direct analysis methods makes it difficult to fully understand the effect of porous structures on EMI, hindering EMI composites' development. Furthermore, while deep learning techniques, such as deep convolutional neural networks (DCNNs), have significantly impacted material science, their lack of interpretability limits their applications to property predictions and defect detection tasks. Until recently, advanced visualization techniques provided an approach to reveal the relevant information behind DCNNs' decisions. Inspired by it, a visual approach for porous EMI nanocomposite mechanism studies is proposed. This work combines DCNN visualization with experiments to investigate EMI porous nanocomposites. First, a rapid and straightforward salt-leaked cold-pressing powder sintering method is employed to prepare high-EMI CNTs/PVDF composites with various porosities and filler loadings. Notably, the solid sample with 30 wt % loading maintains an ultrahigh shielding effectiveness of 105 dB. The influence of porosity on the shielding mechanism is discussed macroscopically based on the prepared samples. To determine the shielding mechanism, a modified deep residual network (ResNet) is trained on a dataset of scanning electron microscopy (SEM) images of the samples. The Eigen-CAM visualization of the modified ResNet intuitively shows that the amount and depth of the pores impact the shielding mechanisms and that shallow pore structures contribute less to EMW absorption. This work is instructive for material mechanism studies. Besides, the visualization has the potential as a porous-like structure marking tool.

3.
Nanomicro Lett ; 14(1): 127, 2022 Jun 14.
Artigo em Inglês | MEDLINE | ID: mdl-35699776

RESUMO

Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed.

4.
ACS Appl Mater Interfaces ; 13(49): 59364-59372, 2021 Dec 15.
Artigo em Inglês | MEDLINE | ID: mdl-34856098

RESUMO

3D porous structural materials are proved to be enticing candidates for the fabrication of high-performance organic phase change materials (PCMs), but the stringent fabrication process and poor processability greatly hampered their commercialization. Herein, flexible leakage-proof composite PCMs with pronounced comprehensive performance are fabricated by a scalable polymer swelling strategy without using any solvent, in which the paraffin wax (PW) segment is confined in a robust flexible 3D polymer network, giving rise to the composite PCMs with excellent form stability even at 160 °C, a high latent heat energy storage density of 133.6 J/g, and an outstanding thermal conductivity of up to ∼5.11 W/mK. More importantly, the mass production of the flexible composite phase change fiber, film, and bulk products can be achieved by adopting mature processing technologies. These resultant composite PCMs exhibit promising thermal management ability to solve the overheating problem of electronics and high-efficiency solar-thermal energy conversion capacity.

5.
J Colloid Interface Sci ; 556: 420-431, 2019 Nov 15.
Artigo em Inglês | MEDLINE | ID: mdl-31472316

RESUMO

A kind of side-chain type anion exchange membranes (AEMs) with high ionic conductivity and good comprehensive stability was prepared via direct modification of commercial engineering plastic polyketone with diamines through Paal-Knorr reaction and quaternization reaction. It was found that the amount of diamine can effectively tune the microphase morphology and properties of the prepared quaternized functionalized-polyketone anion exchange membranes (QAFPK-AEMs). The tensile strength was increased from 18.6 MPa to 38.6 MPa, and the ion exchange capacity (IEC) was increased from 1.11 mmol/g to 2.71 mmol/g depending on the amount of added diamine. The QAFPK-1-6-AEM with the IEC of 1.43 mmol/g showed the highest hydroxide conductivity of 65 mS/cm at 25 °C and 96.8 mS/cm at 80 °C. The high ionic conductivity was achieved through the establishment of effective ionic channels, and it maintained 70% of the initial ionic conductivity after the 192 h treatment in 2 mol/L KOH (aq) at 80 °C. Moreover, a peak power density of 129 mW/cm2 was achieved when the assembled single cell with QAFPK-1-6-AEM was operated at 50 °C. Thus, the prepared QAFPK-AEMs showed great potential applications for the anion exchange membrane fuel cells (AEMFCs).

6.
ACS Appl Mater Interfaces ; 11(20): 18739-18745, 2019 May 22.
Artigo em Inglês | MEDLINE | ID: mdl-31026137

RESUMO

Thermal management materials (TMMs) used in electronic devices are crucial for future electronics and technologies such as flexible electronics and artificial intelligence (AI) technologies. As future electronics will work in a more complicated circumstance, the overheating and overcooling problems can exist in the same electronics while the common TMMs cannot meet the demand of thermal management for future electronics. In this work, nacre-mimetic graphene-based films with super flexibility and durability (in over 10,000 tensile cycles), excellent capability to dissipate excess heat (20.84 W/(m·K) at only 16-22 µm thickness), and outstanding heating performance to generate urgent heat for electronics under extremely cold conditions are fabricated by a facile solution casting method, and the fabricated composites are proved to be superior multifunctional TMMs for the thermal management in electronic chips. In addition, the application of the paper-like films with high in-plane thermal conductivity to a flexible heat spreader and film heater is demonstrated by simulation using a finite volume method, which shows the high importance of the in-plane thermal conductivity in thermal management of electronics.

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