The role of microstructure in the thermal fatigue of solder joints.

Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure and damage in Sn-3Ag-0.5Cu joints throughout a ball grid array (BGA) package using EBSD mapping of localised subgrains, recrystallisation and heavily coarsened Ag3Sn. We then interpret the results with a multi-scale modelling approach that links from a continuum model at the package/board scale through to a crystal plasticity finite element model at the microstructure scale. We measure and explain the dependence of damage evolution on (i) the ß-Sn crystal orientation(s) in single and multigrain joints, and (ii) the coefficient of thermal expansion (CTE) mismatch between tin grains in cyclic twinned multigrain joints. We further explore the relative importance of the solder microstructure versus the joint location in the array. The results provide a basis for designing optimum solder joint microstructures for thermal fatigue resistance.

Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections.

While many aspects of electronics manufacturing are controlled with great precision, the nucleation of tin in solder joints is currently left to chance. This leads to a widely varying melt undercooling and different crystal orientations in each joint, which results in a different resistance to electromigration, thermomechanical fatigue, and other failure modes in each joint. Here we identify a family of nucleants for tin, prove their effectiveness using a novel droplet solidification technique, and demonstrate an approach to incorporate the nucleants into solder joints to control the orientation of the tin nucleation event. With this approach, it is possible to change tin nucleation from a stochastic to a deterministic process, and to generate single-crystal joints with their c-axis orientation tailored to best combat a selected failure mode.

In situ imaging of microstructure formation in electronic interconnections.

The development of microstructure during melting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has been studied by synchrotron radiography. Using Sn-3.0Ag-0.5Cu/Cu and Sn-0.7Cu/Cu as examples, we show that the interfacial Cu6Sn5 layer is present within 0.05 s of wetting, and explore the kinetics of flux void formation at the interface between the liquid and the Cu6Sn5 layer. Quantification of the nucleation locations and anisotropic growth kinetics of primary Cu6Sn5 crystals reveals a competition between the nucleation of Cu6Sn5 in the liquid versus growth of Cu6Sn5 from the existing Cu6Sn5 layer. Direct imaging confirms that the ß-Sn nucleates at/near the Cu6Sn5 layer in Sn-3.0Ag-0.5Cu/Cu joints.

Revealing the micromechanisms behind semi-solid metal deformation with time-resolved X-ray tomography.

The behaviour of granular solid-liquid mixtures is key when deforming a wide range of materials from cornstarch slurries to soils, rock and magma flows. Here we demonstrate that treating semi-solid alloys as a granular fluid is critical to understanding flow behaviour and defect formation during casting. Using synchrotron X-ray tomography, we directly measure the discrete grain response during uniaxial compression. We show that the stress-strain response at 64-93% solid is due to the shear-induced dilation of discrete rearranging grains. This leads to the counter-intuitive result that, in unfed samples, compression can open internal pores and draw the free surface into the liquid, resulting in cracking. A soil mechanics approach shows that, irrespective of initial solid fraction, the solid packing density moves towards a constant value during deformation, consistent with the existence of a critical state in mushy alloys analogous to soils.

Dilatant shear bands in solidifying metals.

Compacted granular materials expand in response to shear, and can exhibit different behaviour from that of the solids, liquids and gases of which they are composed. Application of the physics of granular materials has increased the understanding of avalanches, geological faults, flow in hoppers and silos, and soil mechanics. During the equiaxed solidification of metallic alloys, there exists a range of solid fractions where the microstructure consists of a geometrically crowded disordered assembly of crystals saturated with liquid. It is therefore natural to ask if such a microstructure deforms as a granular material and what relevance this might have to solidification processing. Here we show that partially solidified alloys can exhibit the characteristics of a cohesionless granular material, including Reynolds' dilatancy and strain localization in dilatant shear bands 7-18 mean crystals wide. We show that this behaviour is important in defect formation during high pressure die casting of Al and Mg alloys, a global industry that contributes over $7.3 billion to the USA's economy alone and is used in the manufacture of products that include mobile-phone covers and steering wheels. More broadly, these findings highlight the potential to apply the principles and modelling approaches developed in granular mechanics to the field of solidification processing, and also indicate the possible benefits that might be gained from exploring and exploiting further synergies between these fields.