RESUMO
Determination of geometric parameters for thin film materials has always been a critical concern in scientific research. This paper proposes a novel approach for high-resolution and nondestructive measurement of nanoscale film thickness. In this study, the neutron depth profiling (NDP) technique was employed to accurately measure the thickness of nanoscale Cu films, achieving an impressive resolution of up to 1.78 nm/keV. The measurement results exhibited a deviation from the actual thickness of less than 1%, highlighting the accuracy of the proposed method. Additionally, simulations were conducted on graphene samples to demonstrate the applicability of NDP in measuring the thickness of multilayer graphene films. These simulations provide a theoretical foundation for subsequent experimental measurements, further enhancing the validity and practicality of the proposed technique.