RESUMO
The power and temperature characteristics of Ø200â µm half-disk microlasers with a half-ring metal contact and high-density InGaAs/GaAs quantum dots are studied. In a continuous wave (CW) mode, the maximal optical power at 20°C was 134â mW, and the maximal CW lasing temperature reached 113°C. In a pulsed regime the maximal optical power of 1.6â W, limited by catastrophic degradation, was achieved. By comparing the CW and pulsed current-voltage characteristics, the dependence of a microlaser temperature on CW pumping current was determined. At CW currents corresponding to the maximal wall-plug efficiency, the maximal optical power, and complete lasing quenching, the laser temperatures were 60, 99, and 149°C, respectively.
RESUMO
We study the impact of improved heat removal on the performance of InGaAs/GaAs microdisk lasers epi-side down bonded onto a silicon substrate. Unlike the initial characteristics of microlasers on a GaAs substrate, the former's bonding results in a decrease in thermal resistance by a factor of 2.3 (1.8) in microdisks with a diameter of 19 (31) µm, attributed to a thinner layered structure between the active region and the substrate and the better thermal conductivity of Si than GaAs. Bonded microdisk lasers show a 2.4-3.4-fold higher maximum output power, up to 21.7 mW, and an approximately 20% reduction in the threshold current. A record high 3 dB small-signal modulation bandwidth of 7.9 GHz for InGaAs/GaAs microdisk lasers is achieved.
RESUMO
We report on direct large signal modulation and the reliability studies of microdisk lasers based on InGaAs/GaAs quantum well-dots. A 23 µm in diameter microlaser exhibits an open eye diagram up to 12.5 Gbit/s and is capable of error-free 10 Gbit/s data transmission at 30°C without temperature stabilization. The ageing tests of a 31 µm in diameter microdisk laser were conducted at room and elevated temperatures during more than 1200 hr. The average rate of the output power degradation was about 25 and 29 nW/hr at 40°C and 60°C, respectively.