Gallium arsenide optical phased array photonic integrated circuit.

A 16-channel optical phased array is fabricated on a gallium arsenide photonic integrated circuit platform with a low-complexity process. Tested with a 1064 nm external laser, the array demonstrates 0.92° beamwidth, 15.3° grating-lobe-free steering range, and 12 dB sidelobe level. Based on a reverse biased p-i-n structure, component phase modulators are 3 mm long with DC power consumption of less than 5 µW and greater than 770 MHz electro-optical bandwidth. Separately fabricated 4-mm-long phase modulators based on the same structure demonstrate single-sided Vπ·L modulation efficiency ranging from 0.5 V·cm to 1.22 V·cm when tested at wavelengths from 980 nm to 1360 nm.

Comparison of static and dynamic characteristics of 1550†nm quantum dash and quantum well lasers.

Compared to quantum well (QW) lasers, lower dimensional quantum dot (QD) or quantum dash (QDash) devices demonstrate superior performances, owing to their quantized energy levels and increased carrier confinement. Here, we report the systematic comparison of static and dynamic properties of long wavelength (1550 nm) QDash and QW lasers. For the QDash lasers, a higher maximum operating temperature and lower temperature dependence was achieved for long cavities, although the threshold current densities were larger than the QW reference devices. The lasing characteristics for QDashes are significantly improved following the application of a high reflectance (HR) coating on the rear facets. The QDash lasers also exhibit three orders lower dark current, of 45 µA/cm2 under -1 V reverse bias. Small signal modulation on the 4 × 550 µm2 Fabry-Perot cavities yields a modulation efficiency of 0.48 GHz/√mA and a maximum 3-dB bandwidth of 7.4 GHz for QDashes, slightly larger than that for the QW devices. Meanwhile, a stronger damping effect was observed for the QDash lasers due to their lower differential gain.

Electrically driven, polarized, phosphor-free white semipolar (20-21) InGaN light-emitting diodes grown on semipolar bulk GaN substrate.

We demonstrate a simple method to fabricate efficient, electrically driven, polarized, and phosphor-free white semipolar (20-21) InGaN light-emitting diodes (LEDs) by adopting a top blue quantum well (QW) and a bottom yellow QW directly grown on (20-21) semipolar bulk GaN substrate. At an injection current of 20 mA, the fabricated 0.1 mm2 size regular LEDs show an output power of 0.9 mW tested on wafer without any backside roughing, a forward voltage of 3.1 V and two emission peaks located at 427 and 560 nm. A high polarization ratio of 0.40 was measured in the semipolar monolithic white LEDs, making them promising candidates for backlighting sources in liquid crystal displays (LCDs). Furthermore, a 3dB modulation bandwidth of 410 MHz in visible light communication (VLC) was obtained in the micro-size LEDs (µLEDs) with a size of 20×20 µm2 and 40×40 µm2, which could overcome the limitation of slow frequency response of yellow phosphor in commercial white LEDs combing blue LEDs and yellow phosphor.

Indium Phosphide Photonic Integrated Circuits for Free Space Optical Links.

An indium phosphide (InP)-based photonic integrated circuit (PIC) transmitter for free space optical communications was demonstrated. The transmitter consists of a sampled grating distributed Bragg reflector (SGDBR) laser, a high-speed semiconductor optical amplifier (SOA), a Mach-Zehnder modulator, and a high-power output booster SOA. The SGDBR laser tunes from 1521 nm to 1565 nm with >45 dB side mode suppression ratio. The InP PIC was also incorporated into a free space optical link to demonstrate the potential for low cost, size, weight and power. Error-free operation was achieved at 3 Gbps for an equivalent link length of 180 m (up to 300 m with forward error correction).

Low dark current III-V on silicon photodiodes by heteroepitaxy.

Top-illuminated PIN and modified uni-traveling carrier (MUTC) photodiodes based on InGaAs/InAlAs/InP were epitaxially grown on Si templates. Photodiodes with 30-µm diameter have dark currents as low as 10 nA at 3 V corresponding to a dark current density of only 0.8 mA/cm2. The responsivity, 3-dB bandwidth, output power and third-order output intercept point (OIP3) were 0.79 A/W, 9 GHz, 2.6 dBm and 15 dBm, respectively.

Strain-Compensated InGaAsP Superlattices for Defect Reduction of InP Grown on Exact-Oriented (001) Patterned Si Substrates by Metal Organic Chemical Vapor Deposition.

We report on the use of InGaAsP strain-compensated superlattices (SC-SLs) as a technique to reduce the defect density of Indium Phosphide (InP) grown on silicon (InP-on-Si) by Metal Organic Chemical Vapor Deposition (MOCVD). Initially, a 2 µm thick gallium arsenide (GaAs) layer was grown with very high uniformity on exact oriented (001) 300 mm Si wafers; which had been patterned in 90 nm V-grooved trenches separated by silicon dioxide (SiO2) stripes and oriented along the [110] direction. Undercut at the Si/SiO2 interface was used to reduce the propagation of defects into the III-V layers. Following wafer dicing; 2.6 µm of indium phosphide (InP) was grown on such GaAs-on-Si templates. InGaAsP SC-SLs and thermal annealing were used to achieve a high-quality and smooth InP pseudo-substrate with a reduced defect density. Both the GaAs-on-Si and the subsequently grown InP layers were characterized using a variety of techniques including X-ray diffraction (XRD); atomic force microscopy (AFM); transmission electron microscopy (TEM); and electron channeling contrast imaging (ECCI); which indicate high-quality of the epitaxial films. The threading dislocation density and RMS surface roughness of the final InP layer were 5 × 108/cm² and 1.2 nm; respectively and 7.8 × 107/cm² and 10.8 nm for the GaAs-on-Si layer.

Towards chip-scale optical frequency synthesis based on optical heterodyne phase-locked loop.

An integrated heterodyne optical phase-locked loop was designed and demonstrated with an indium phosphide based photonic integrated circuit and commercial off-the-shelf electronic components. As an input reference, a stable microresonator-based optical frequency comb with a 50-dB span of 25 nm (~3 THz) around 1550 nm, having a spacing of ~26 GHz, was used. A widely-tunable on-chip sampled-grating distributed-Bragg-reflector laser is offset locked across multiple comb lines. An arbitrary frequency synthesis between the comb lines is demonstrated by tuning the RF offset source, and better than 100Hz tuning resolution with ± 5 Hz accuracy is obtained. Frequency switching of the on-chip laser to a point more than two dozen comb lines away (~5.6 nm) and simultaneous locking to the corresponding nearest comb line is also achieved in a time ~200 ns. A low residual phase noise of the optical phase-locking system is successfully achieved, as experimentally verified by the value of -80 dBc/Hz at an offset of as low as 200 Hz.

3D integrated hybrid silicon laser.

Lasers were realized on silicon by flip-chip bonding of indium phosphide (InP) devices containing total internal reflection turning mirrors for surface emission. Light is coupled to the silicon waveguides through surface grating couplers. With this technique, InP lasers were integrated on silicon. Laser cavities were also formed by coupling InP reflective semiconductor optical amplifiers to microring resonator filters and distributed Bragg reflector mirrors. Single-mode continuous wave lasing was demonstrated with a side mode suppression ratio of 30 dB. Up to 2 mW of optical power was coupled to the silicon waveguide. Thermal simulations were also performed to evaluate the low thermal impedance afforded by this architecture and potential for high wall-plug efficiency.

A 100-Gb/s noncoherent silicon receiver for PDM-DBPSK/DQPSK signals.

An integrated noncoherent silicon receiver for demodulation of 100-Gb/s polarization-division multiplexed differential quadrature phase-shift keying and polarization-division multiplexed differential binary phase-shift keying signals is demonstrated. The receiver consists of a 2D surface grating coupler, four Mach-Zehnder delay interferometers and four germanium balanced photodetectors.

Versatile offset-free 16-QAM single dual-drive IQ modulator driven by binary signals.

A customized IQ modulator driven by equal-amplitude binary signals for generating offset-free 16-quadrature amplitude modulation (QAM) is proposed and validated through simulations. The incorporation of tunable splitters demonstrates the feasibility of the transmitter and enables more efficient constellations such as hexagonal 16-QAM.

Low-noise RF-amplifier-free slab-coupled optical waveguide coupled optoelectronic oscillators: physics and operation.

We demonstrate a 10-GHz RF-amplifier-free slab-coupled optical waveguide coupled optoelectronic oscillator (SCOW-COEO) system operating with low phase-noise (<-115 dBc/Hz at 1 kHz offset) and large sidemode suppression (>70 dB measurement-limited). The optical pulses generated by the SCOW-COEO exhibit 26.8-ps pulse width (post compression) with a corresponding spectral bandwidth of 0.25 nm (1.8X transform-limited). We also investigate the mechanisms that limit the performance of the COEO. Our measurements indicate that degradation in the quality factor (Q) of the optical cavity significantly impacts COEO phase-noise through increases in the optical amplifier relative intensity noise (RIN).

Amplifier-free slab-coupled optical waveguide optoelectronic oscillator systems.

We demonstrate a free-running 3-GHz slab-coupled optical waveguide (SCOW) optoelectronic oscillator (OEO) with low phase-noise (<-120 dBc/Hz at 1-kHz offset) and ultra-low sidemode spurs. These sidemodes are indistinguishable from noise on a spectrum analyzer measurement (>88 dB down from carrier). The SCOW-OEO uses high-power low-noise SCOW components in a single-loop cavity employing 1.5-km delay. The noise properties of our SCOW external-cavity laser (SCOWECL) and SCOW photodiode (SCOWPD) are characterized and shown to be suitable for generation of high spectral purity microwave tones. Through comparisons made with SCOW-OEO topologies employing amplification, we observe the sidemode levels to be degraded by any amplifiers (optical or RF) introduced within the OEO cavity.

Uni-traveling-carrier variable confinement waveguide photodiodes.

Uni-traveling-carrier waveguide photodiodes (PDs) with a variable optical confinement mode size transformer are demonstrated. The optical mode is large at the input for minimal front-end saturation and the mode transforms as the light propagates so that the absorption profile is optimized for both high-power and high-speed performance. Two differently designed PDs are presented. PD A demonstrates a 3-dB bandwidth of 12.6 GHz, and saturation currents of 40 mA at 1 GHz and 34 mA at 10 GHz. PD B demonstrates a 3-dB bandwidth of 2.5 GHz, a saturation current greater than 100 mA at 1 GHz, a peak RF output power of + 19 dBm, and a third-order output intercept point of 29.1 dBm at a photocurrent of 60 mA.

Measurement of intermodulation distortion in high-linearity photodiodes.

Accurately characterizing third order intermodulation distortion (IMD3) in high-linearity photodiodes is challenging. Two measurement techniques are evaluated-a standard two-tone measurement and a more complicated three-tone measurement technique to measure IMD3. A model of the measurement system is developed and used to analyze the limitations of the two techniques in determining the distortion of highly linear photodiodes. Experimental validation is provided by comparing the simulation trends with IMD3 results measured on two types of waveguide photodiodes: 1) an InP based uni-traveling-carrier (UTC) photodiode and 2) a Ge n-i-p waveguide photodetector on Silicon-on-Insulator (SOI) substrate.

Compact beam splitters with deep gratings for miniature photonic integrated circuits: design and implementation aspects.

We present an extensive study of an ultracompact grating-based beam splitter suitable for photonic integrated circuits (PICs) that have stringent density requirements. The 10 microm long beam splitter exhibits equal splitting, low insertion loss, and also provides a high extinction ratio in an integrated coherent balanced receiver. We further present the design strategies for avoiding mode distortion in the beam splitter and discuss optimization of the widths of the detectors to improve insertion loss and extinction ratio of the coherent receiver circuit. In our study, we show that the grating-based beam splitter is a competitive technology having low fabrication complexity for ultracompact PICs.

Selectively-undercut traveling-wave electroabsorption modulators incorporating a p-InGaAs contact layer.

A novel fabrication process has been developed for fabricating undercut-etched electroabsorption modulators that are compatible with tunable lasers. This process allows for the incorporation of highly doped p-type InGaAs above the upper cladding as an ohmic contact layer. The EAM demonstrates significant improvement in the microwave performance with little effect on modulation efficiency due to the undercut etching. This device uses a traveling wave electrode design with an integrated, matched termination resistor to demonstrate a 34 GHz 3-dB bandwidth for a 600 microm long modulator.

SOA gate array recirculating buffer with fiber delay loop.

We present a compact variable delay buffer for storage of 40 byte packets. The recirculating buffer is based on an InP SOA gate array two-by-two switch which provides greater than 40 dB of extinction, sub-nanosecond switching, and fiber-to-fiber gain. The switch is used with a fiber delay loop 450 centimeters, or 23 ns, in length. The buffer is demonstrated with greater than 98% packet recovery at 40 Gb/s for up to 184 ns of storage.