Analytical modelling of the transport in analog filamentary conductive-metal-oxide/HfOx ReRAM devices.

The recent co-optimization of memristive technologies and programming algorithms enabled neural networks training with in-memory computing systems. In this context, novel analog filamentary conductive-metal-oxide (CMO)/HfOx redox-based resistive switching memory (ReRAM) represents a key technology. Despite device performance enhancements reported in literature, the underlying mechanism behind resistive switching is not fully understood. This work presents the first physics-based analytical model of the current transport and of the resistive switching in these devices. As a case study, analog TaOx/HfOx ReRAM devices are considered. The current transport is explained by a trap-to-trap tunneling process, and the resistive switching by a modulation of the defect density within the sub-band of the TaOx that behaves as electric field and temperature confinement layer. The local temperature and electric field distributions are derived from the solution of the electric and heat transport equations in a 3D finite element ReRAM model. The intermediate resistive states are described as a gradual modulation of the TaOx defect density, which results in a variation of its electrical conductivity. The drift-dynamics of ions during the resistive switching is analytically described, allowing the estimation of defect migration energies in the TaOx layer. Moreover, the role of the electro-thermal properties of the CMO layer is unveiled. The proposed analytical model accurately describes the experimental switching characteristic of analog TaOx/HfOx ReRAM devices, increasing the physical understanding and providing the equations necessary for circuit simulations incorporating this technology.

Polymer waveguides for electro-optical integration in data centers and high-performance computers.

To satisfy the intra- and inter-system bandwidth requirements of future data centers and high-performance computers, low-cost low-power high-throughput optical interconnects will become a key enabling technology. To tightly integrate optics with the computing hardware, particularly in the context of CMOS-compatible silicon photonics, optical printed circuit boards using polymer waveguides are considered as a formidable platform. IBM Research has already demonstrated the essential silicon photonics and interconnection building blocks. A remaining challenge is electro-optical packaging, i.e., the connection of the silicon photonics chips with the system. In this paper, we present a new single-mode polymer waveguide technology and a scalable method for building the optical interface between silicon photonics chips and single-mode polymer waveguides.

Flip-chip optical couplers with scalable I/O count for silicon photonics.

A scalable and tolerant optical interfacing method based on flip-chip bonding is developed for silicon photonics packaging. Bidirectional optical couplers between multiple silicon-on-insulator waveguides and single-mode polymer waveguides are designed and fabricated. Successful operation is verified experimentally in the 1530-1570 nm spectral window. At the wavelength of 1570 nm, the coupling loss is as low as 0.8 dB for both polarization states and the planar misalignment loss is less than 0.6 dB for TE and 0.3 dB for TM polarization in a lateral silicon-polymer waveguide offset range of ± 2 µm. The coupling loss does not exhibit any temperature dependence up to the highest measurement point of 70°C.

A single InP-on-SOI microdisk for high-speed half-duplex on-chip optical links.

We demonstrate for the first time that a single compact, electrically contacted indium phosphide based microdisk heterogeneously integrated on a silicon-on-insulator waveguide can be used as both a high-speed modulator and photo detector. We demonstrate high-speed operation up to 10 Gb/s and present bit-error rate results of both operation modes.

A low-power high-speed InP microdisk modulator heterogeneously integrated on a SOI waveguide.

We report on the modulation characteristics of indium phosphide (InP) based microdisks heterogeneously integrated on a silicon-on-insulator (SOI) waveguide. We present static extinction ratios and dynamic operation up to 10 Gb/s. Operation with a bit-error rate below 1 × 10(-9) is demonstrated at 2.5, 5.0 and 10.0 Gb/s and the performance is compared with that of a commercial modulator. Power penalties are analyzed with respect to the pattern length. The power consumption is calculated and compared with state-of-the-art integrated modulator concepts. We demonstrate that InP microdisk modulators combine low-power and low-voltage operation with low footprint and high-speed. Moreover, the devices can be fabricated using the same technology as for lasers, detectors and wavelength converters, making them very attractive for co-integration.