RESUMO
Treatment of copper chemical mechanical polishing (CMP) wastewater from a semiconductor plant by electrocoagulation is investigated. The CMP wastewater was characterized by high suspended solids (SS) content, high turbidity (NTU), chemical oxygen demand (COD) concentration up to 500 mgl(-1) and copper concentration up to 100 mgl(-1). In the present study, electrocoagulation was employed to treat the CMP wastewater with an attempt to simultaneously lower its turbidity, copper and COD concentrations. The test results indicated that electrocoagulation with Al/Fe electrode pair was very efficient and able to achieve 99% copper ion and 96.5% turbidity removal in less than 30 min. The COD removal obtained in the treatment was better than 85%, with an effluent COD below 100 mgl(-1). The effluent wastewater was very clear and its quality exceeded the direct discharge standard. In addition, sludge settling velocities after electrocoagulation were measured and the data were employed to verify the empirical sludge settling velocity models. Finally, the sludge settling characteristic data were also utilized to establish the relation between the solids flux (G) and the initial solids concentration.