Cyclic Bending Reliability and Failure Mechanism of Printed Biodegradable Flexible Supercapacitor on Polymer Substrate.

A flexible supercapacitor (SC) is an attractive energy storage device for powering low-power sensors, since it can be built using only nontoxic and sustainable materials. In this study, the advantages of using biodegradable polylactic acid (PLA) substrate for printed SC are investigated by studying the SC's cyclic bending reliability, failure mechanism, and the impact of the bending radius. The results confirm that the SCs with laminated PLA with polymer barrier substrate exhibited the highest bending reliability, stability, and capability in preventing liquid electrolyte evaporation among the investigated substrates. Besides, the reliability decreased with the decreasing bending radius only when the strongly impacted areas lie on the electrode, the flaking and cracking of which was found to be the failure mechanisms of the tested SCs, except for the SCs with PLA/Al substrate, which failed due to the Al cracking. This research suggests that using PLA/barrier substrate, developing more robust activated carbon electrodes, developing cellulose paper with more dense fiber structure and smaller porous areas, and controlling the bending radius are crucial to improving the SC's reliability.

Impedance plethysmography-based method in the assessment of subclinical atherosclerosis.

BACKGROUND AND AIMS: The aim of this study was to examine an association of individual and combined pulse waveform parameters derived from bioimpedance measurements, that is pulse waves from a distal impedance plethysmographic (IPG), a whole-body impedance cardiographic (ICG) and transformed distal impedance plethysmographic (tIPG) signals, with markers of subclinical atherosclerosis, i.e. carotid intima-media thickness (cIMT), brachial artery flow-mediated dilation (FMD) and carotid artery distensibility (Cdist). The level of the association was also compared for arterial pulse wave velocity (PWV) and cIMT, FMD, and Cdist. METHODS: IPG, ICG, tIPG signals were measured from 1741 Finnish adults aged 30-45 years. The association between pulse wave parameters and cIMT, FMD and Cdist was studied using bootstrapped stepwise Akaike's Information Criterion method resulting in selection of parameters other than PWV, i.e. parameters having stronger association with cIMT, FMD and Cdist than PWV, in the model. Then risk scores were calculated from the selected pulse wave parameters and their association between cIMT, FMD and Cdist was studied with multivariable linear regression analysis. RESULTS: The risk score was found to be the third strongest predictor of subclinical atherosclerosis as indicated by cIMT measurement, the second strongest predictor of FMD and the strongest predictor of Cdist. These findings show that several individual pulse wave parameters were associated more strongly with cIMT, FMD, and Cdist than PWV when adjusted with clinical risk factors. CONCLUSIONS: Impedance based pulse waveform analysis provides a useful tool for assessing cardiovascular risk and estimating presence of structural changes in the vasculature.

Mechanically driven strategies to improve electromechanical behaviour of printed stretchable electronic systems.

Stretchable electronics promise to extend the application range of conventional electronics by enabling them to keep their electrical functionalities under system deformation. Within this framework, development of printable silver-polymer composite inks is making possible to realize several of the expected applications for stretchable electronics, which range from seamless sensors for human body measurement (e.g. health patches) to conformable injection moulded structural electronics. However, small rigid electric components are often incorporated in these devices to ensure functionality. Under mechanical loading, these rigid elements cause strain concentrations and a general deterioration of the system's electrical performance. This work focuses on different strategies to improve electromechanical performance by investigating the deformation behaviour of soft electronic systems comprising rigid devices through Finite Element analyses. Based on the deformation behaviour of a simple stretchable device under tensile loading, three general strategies were proposed: local component encapsulation, direct component shielding, and strain dispersion. The FE behaviour achieved using these strategies was then compared with the experimental results obtained for each design, highlighting the reasons for their different resistance build-up. Furthermore, crack formation in the conductive tracks was analysed under loading to highlight its link with the evolution of the system electrical performance.

Inkjet Printable Polydimethylsiloxane for All-Inkjet-Printed Multilayered Soft Electrical Applications.

In recent years, additive manufacturing of polydimethylsiloxane (PDMS) has gained interest for the development of soft electronics. To build complex electrical devices, fabrication of multilayered structures is required. We propose here a straightforward digital printing fabrication process of silicone rubber-based, multilayered electronics. An inkjet-printable PDMS solution was developed for the digital patterning of elastomeric structures. The silicone ink was used together with a highly conductive silver nanoparticle (Ag NP) ink for the fabrication of all-inkjet-printed multilayered electrical devices. The application of the multilayered circuit board was successful. The sheet resistances were below 0.3 Ω/□, and the conductive layer thickness was less than 1 µm. The electrical insulation between the conductive layers was done by printing a 20-25 µm-thick dielectric PDMS layer selectively on top of the bottommost conductive layer.

Drying-Mediated Self-Assembly of Graphene for Inkjet Printing of High-Rate Micro-supercapacitors.

Scalable fabrication of high-rate micro-supercapacitors (MSCs) is highly desired for on-chip integration of energy storage components. By virtue of the special self-assembly behavior of 2D materials during drying thin films of their liquid dispersion, a new inkjet printing technique of passivated graphene micro-flakes is developed to directly print MSCs with 3D networked porous microstructure. The presence of macroscale through-thickness pores provides fast ion transport pathways and improves the rate capability of the devices even with solid-state electrolytes. During multiple-pass printing, the porous microstructure effectively absorbs the successively printed inks, allowing full printing of 3D structured MSCs comprising multiple vertically stacked cycles of current collectors, electrodes, and sold-state electrolytes. The all-solid-state heterogeneous 3D MSCs exhibit excellent vertical scalability and high areal energy density and power density, evidently outperforming the MSCs fabricated through general printing techniques.

Printed Flexible Microelectrode for Application of Nanosecond Pulsed Electric Fields on Cells.

Medical treatment is increasingly benefiting from biomedical microsystems, especially the trending telemedical application. A promising modality for tumor therapy showed the application of nanosecond pulsed electric fields (nsPEF) on cells to achieve nanoporation, cell death, and other cell reactions. A key technology for this method is the generation of pulsed fields in the nanosecond range with high-field strengths in the range of several kilovolts per centimeter. For further biomedical applications, state-of-the-art setups need to decrease in size and improve their capability of integration into microsystems. Due to demanding electronic requirements, i.e., using high voltages and fast pulses, miniaturization and low-cost fabrication of the electrode is first considered. This paper proposes a proof-of-concept for a miniaturized printed flexible electrode that can apply nsPEF on adherent fibroblast cells. The interdigital gold electrode was printed on polyimide with line-width of about 10 µm using an electrohydrodynamic inkjet printer. Furthermore, an electrical circuit was developed to generate both electrical pulses in the nano-second range and voltages up to 180 V. The electrode was integrated into an experimental setup for in-vitro application to human fibroblasts. Field strengths up to 100 kV/cm with 45 ns pulse duration were applied, depending on the degree of cell confluence. The cells show contraction, detachment from the electrode, and lethal reactions after the nsPEF treatment. Furthermore, this printed miniaturized electrode was found to be suitable for subsequent microsystem integration and further cell experiments to optimize pulse parameters for control of cell reaction and behavior.

Effect of Different ECG Leads on Estimated R-R Intervals and Heart Rate Variability Parameters.

Heart rate and heart rate variability parameters provide important information on sympathetic and parasympathetic branches of autonomous nervous system. These parameters are usually extracted from electrocardiograms often measured between two electrodes and called an ECG lead. Besides systems intended only for heart rate measurement, ECG measurement devices employ several well-known lead systems including the standard 12-lead system, EASI lead system and Mason-Likar systems. Therefore, the first step is to select the appropriate lead for heart rate variability analysis. The appropriate electrode locations for single-lead measurement systems or the preferred measurement lead in multi-lead measurement are choices that the user needs to make when the heart rate variability is of interest. However, it has not been addressed in the literature, if the lead selection has an effect on the obtained HRV parameters. In this work, we characterized the amount of deviation of heart rate and heart rate variability parameters extracted from nine ECG leads, six from EASI leads and three modified limb leads. The results showed a deviation of 2.04, 2.88, 2.06 and 3.45 ms in SDNN, rMSSD, SD1 and SD2, respectively. A relative difference up to 10% was observed in HRV parameters for single signal frames. Additionally, the discrimination of the R-peaks by amplitudes was evaluated. The A-S lead appeared to have the best performance in all the tests.

Non-Invasive Flexible and Stretchable Wearable Sensors With Nano-Based Enhancement for Chronic Disease Care.

Advances in flexible and stretchable electronics, functional nanomaterials, and micro/nano manufacturing have been made in recent years. These advances have accelerated the development of wearable sensors. Wearable sensors, with excellent flexibility, stretchability, durability, and sensitivity, have attractive application prospects in the next generation of personal devices for chronic disease care. Flexible and stretchable wearable sensors play an important role in endowing chronic disease care systems with the capability of long-term and real-time tracking of biomedical signals. These signals are closely associated with human body chronic conditions, such as heart rate, wrist/neck pulse, blood pressure, body temperature, and biofluids information. Monitoring these signals with wearable sensors provides a convenient and non-invasive way for chronic disease diagnoses and health monitoring. In this review, the applications of wearable sensors in chronic disease care are introduced. In addition, this review exploits a comprehensive investigation of requirements for flexibility and stretchability, and methods of nano-based enhancement. Furthermore, recent progress in wearable sensors-including pressure, strain, electrophysiological, electrochemical, temperature, and multifunctional sensors-is presented. Finally, opening research challenges and future directions of flexible and stretchable sensors are discussed.

The Effect of Encapsulation Geometry on the Performance of Stretchable Interconnects.

The stretchability of electronic devices is typically obtained by tailoring the stretchable interconnects that link the functional units together. The durability of the interconnects against environmental conditions, such as deformation and chemicals, is therefore important to take into account. Different approaches, including encapsulation, are commonly used to improve the endurance of stretchable interconnects. In this paper, the geometry of encapsulation layer is initially investigated using finite element analysis. Then, the stretchable interconnects with a narrow-to-wide layout are screen-printed using silver flake ink as a conductor on a thermoplastic polyurethane (TPU) substrate. Printed ultraviolet (UV)-curable screen-printed dielectric ink and heat-laminated TPU film are used for the encapsulation of the samples. The electromechanical tests reveal a noticeable improvement in performance of encapsulated samples compared to non-protected counterparts in the case of TPU encapsulation. The improvement is even greater with partial coverage of the encapsulation layer. A device with a modified encapsulation layer can survive for 10,000 repetitive cycles at 20% strain, while maintaining the electrical and mechanical performance.

Inkjet printing technology for increasing the I/O density of 3D TSV interposers.

Interposers with through-silicon vias (TSVs) play a key role in the three-dimensional integration and packaging of integrated circuits and microelectromechanical systems. In the current practice of fabricating interposers, solder balls are placed next to the vias; however, this approach requires a large foot print for the input/output (I/O) connections. Therefore, in this study, we investigate the possibility of placing the solder balls directly on top of the vias, thereby enabling a smaller pitch between the solder balls and an increased density of the I/O connections. To reach this goal, inkjet printing (that is, piezo and super inkjet) was used to successfully fill and planarize hollow metal TSVs with a dielectric polymer. The under bump metallization (UBM) pads were also successfully printed with inkjet technology on top of the polymer-filled vias, using either Ag or Au inks. The reliability of the TSV interposers was investigated by a temperature cycling stress test (-40 °C to +125 °C). The stress test showed no impact on DC resistance of the TSVs; however, shrinkage and delamination of the polymer was observed, along with some micro-cracks in the UBM pads. For proof of concept, SnAgCu-based solder balls were jetted on the UBM pads.

Inkjet-Printed Graphene/PEDOT:PSS Temperature Sensors on a Skin-Conformable Polyurethane Substrate.

Epidermal electronic systems (EESs) are skin-like electronic systems, which can be used to measure several physiological parameters from the skin. This paper presents materials and a simple, straightforward fabrication process for skin-conformable inkjet-printed temperature sensors. Epidermal temperature sensors are already presented in some studies, but they are mainly fabricated using traditional photolithography processes. These traditional fabrication routes have several processing steps and they create a substantial amount of material waste. Hence utilizing printing processes, the EES may become attractive for disposable systems by decreasing the manufacturing costs and reducing the wasted materials. In this study, the sensors are fabricated with inkjet-printed graphene/PEDOT:PSS ink and the printing is done on top of a skin-conformable polyurethane plaster (adhesive bandage). Sensor characterization was conducted both in inert and ambient atmosphere and the graphene/PEDOT:PSS temperature sensors (thermistors) were able reach higher than 0.06% per degree Celsius sensitivity in an optimal environment exhibiting negative temperature dependence.

Screen-Printing Fabrication and Characterization of Stretchable Electronics.

This article focuses on the fabrication and characterization of stretchable interconnects for wearable electronics applications. Interconnects were screen-printed with a stretchable silver-polymer composite ink on 50-µm thick thermoplastic polyurethane. The initial sheet resistances of the manufactured interconnects were an average of 36.2 mΩ/◽, and half the manufactured samples withstood single strains of up to 74%. The strain proportionality of resistance is discussed, and a regression model is introduced. Cycling strain increased resistance. However, the resistances here were almost fully reversible, and this recovery was time-dependent. Normalized resistances to 10%, 15%, and 20% cyclic strains stabilized at 1.3, 1.4, and 1.7. We also tested the validity of our model for radio-frequency applications through characterization of a stretchable radio-frequency identification tag.

Comparison of laser and intense pulsed light sintering (IPL) for inkjet-printed copper nanoparticle layers.

In this contribution we discuss the sintering of an inkjet-printed copper nanoparticle ink based on electrical performance and microstructure analysis. Laser and intense pulsed light (IPL) sintering are employed in order to compare the different techniques and their feasibility for electronics manufacturing. A conductivity of more than 20% of that of bulk copper material has been obtained with both sintering methods. Laser and IPL sintering techniques are considered to be complementary techniques and are highly suitable in different application fields.

Bio-patch design and implementation based on a low-power system-on-chip and paper-based inkjet printing technology.

This paper presents the prototype implementation of a Bio-Patch using fully integrated low-power System-on-Chip (SoC) sensor and paper-based inkjet printing technology. The SoC sensor is featured with programmable gain and bandwidth to accommodate a variety of bio-signals. It is fabricated in a 0.18-ìm standard CMOS technology, with a total power consumption of 20 ìW from a 1.2 V supply. Both the electrodes and interconnections are implemented by printing conductive nano-particle inks on a flexible photo paper substrate using inkjet printing technology. A Bio-Patch prototype is developed by integrating the SoC sensor, a soft battery, printed electrodes and interconnections on a photo paper substrate. The Bio-Patch can work alone or operate along with other patches to establish a wired network for synchronous multiple-channel bio-signals recording. The measurement results show that electrocardiogram and electromyogram are successfully measured in in-vivo tests using the implemented Bio-Patch prototype.

A system-on-chip and paper-based inkjet printed electrodes for a hybrid wearable bio-sensing system.

This paper presents a hybrid wearable bio-sensing system, which combines traditional small-area low-power and high-performance System-on-Chip (SoC), flexible paper substrate and cost-effective Printed Electronics. Differential bio-signals are measured, digitized, stored and transmitted by the SoC. The total area of the chip is 1.5 × 3.0 mm(2). This enables the miniaturization of the wearable system. The electrodes and interconnects are inkjet printed on paper substrate and the performance is verified in in-vivo tests. The quality of electrocardiogram signal sensed by printed electrodes is comparable with commercial electrodes, with noise level slightly increased. The paper-based inkjet printed system is flexible, light and thin, which makes the final system comfortable for end-users. The hybrid bio-sensing system offers a potential solution to the next generation wearable healthcare technology.