Study of CFRP Laminate Gradually Modified throughout the Thickness Using Thin Ply under Transvers Tensile Loading.

The use of thin-ply composite materials has rapidly increased due to their tailorable mechanical properties and design flexibility. Considering an adhesively bonded composite joint, peel stress stands out as a key contributor leading to failure among other primary stress factors. Therefore, the reinforcement of carbon fiber-reinforced polymer (CFRP) laminates throughout the thickness could be considered as an approach to improve the joint strength. Using thin plies locally between the conventional CFRP layers in a laminate can enhance the strength, as the sudden change in stiffness means that the load transfer is not monotonous. Consequently, the following study examined the effect of altering thin plies gradually throughout the thickness on the behaviour of the CFRP laminates when subjected to transverse tensile loading. To achieve this goal, the CFRP laminates were gradually modified by using different commercially accessible prepreg thin plies, leading to an improved overall structural performance by reducing stress concentrations. Besides conducting an experimental study, a numerical assessment was also carried out utilizing Abaqus software with a Representative Volume Element (RVE) at the micro scale. The comparison of reference configurations, which involved various thin plies with different thicknesses and traditional CFRP laminates, with the suggested gradual configuration, demonstrated a notable enhancement in both strength and material cost. Furthermore, the proposed RVE model showed promising capability in accurately forecasting the strength of fabricated laminates.

Development of a Unified Specimen for Adhesive Characterization-Part 2: Experimental Study on the Mode I (mDCB) and II (ELS) Fracture Components.

Adhesive bonding has been increasingly employed in multiple industrial applications. This has led to a large industrial demand for faster, simpler, and cheaper characterization methods that allow engineers to predict the mechanical behavior of an adhesive with numerical models. Currently, these characterization processes feature a wide variety of distinct standards, specimen configurations, and testing procedures and require deep knowhow of complex data-reduction schemes. By suggesting the creation of a new and integrated experimental tool for adhesive characterization, it becomes possible to address this problem in a faster and unified manner. In this work, following a previous numerical study, the mode I and II components of fracture-toughness characterization were validated experimentally in two different configurations, Balanced and Unbalanced. For mode I, it was demonstrated that both configurations presented similar numerical and experimental R-curves. The relative error against standard tests was lower than ±5% for the Balanced specimen; the Unbalanced system showed higher variations, which were predicted by the numerical results. Under mode II, the Balanced specimen displayed plastic deformation due to high deflections. On the contrary, the Unbalanced specimen did not show this effect and presented a relative error of approximately ±2%. Nonetheless, it was proven that this approach to obtain such data by using a single unified specimen is still feasible but needs further development to obtain with similar precision of standard tests. In the end, a conceptual change is proposed to solve the current mode II issues.

Mode I Fatigue and Fracture Assessment of Polyimide-Epoxy and Silicon-Epoxy Interfaces in Chip-Package Components.

Semiconductor advancements demand greater integrated circuit density, structural miniaturization, and complex material combinations, resulting in stress concentrations from property mismatches. This study investigates the failure in two types of interfaces found in chip packages: silicon-epoxy mold compound (EMC) and polyimide-EMC. These interfaces were subjected to quasi-static and fatigue loading conditions. Employing a compliance-based beam method, the tests determined interfacial critical fracture energy values, (GIC), of 0.051 N/mm and 0.037 N/mm for the silicon-EMC and polyimide-EMC interfaces, respectively. Fatigue testing on the polyimide-epoxy interface revealed a fatigue threshold strain energy, (Gth), of 0.042 N/mm. We also observed diverse failure modes and discuss potential mechanical failures in multi-layer chip packages. The findings of this study can contribute to the prediction and mitigation of failure modes in the analyzed chip packaging. The obtained threshold energy and crack growth rate provide insights for designing safe lives for bi-material interfaces in chip packaging under cyclic loads. These insights can guide future research directions, emphasizing the improvement of material properties and exploration of the influence of manufacturing parameters on delamination in multilayer semiconductors.

Cohesive Properties of Bimaterial Interfaces in Semiconductors: Experimental Study and Numerical Simulation Using an Inverse Cohesive Contact Approach.

Examining crack propagation at the interface of bimaterial components under various conditions is essential for improving the reliability of semiconductor designs. However, the fracture behavior of bimaterial interfaces has been relatively underexplored in the literature, particularly in terms of numerical predictions. Numerical simulations offer vital insights into the evolution of interfacial damage and stress distribution in wafers, showcasing their dependence on material properties. The lack of knowledge about specific interfaces poses a significant obstacle to the development of new products and necessitates active remediation for further progress. The objective of this paper is twofold: firstly, to experimentally investigate the behavior of bimaterial interfaces commonly found in semiconductors under quasi-static loading conditions, and secondly, to determine their respective interfacial cohesive properties using an inverse cohesive zone modeling approach. For this purpose, double cantilever beam specimens were manufactured that allow Mode I static fracture analysis of the interfaces. A compliance-based method was used to obtain the crack size during the tests and the Mode I energy release rate (GIc). Experimental results were utilized to simulate the behavior of different interfaces under specific test conditions in Abaqus. The simulation aimed to extract the interfacial cohesive contact properties of the studied bimaterial interfaces. These properties enable designers to predict the strength of the interfaces, particularly under Mode I loading conditions. To this extent, the cohesive zone modeling (CZM) assisted in defining the behavior of the damage propagation through the bimaterial interfaces. As a result, for the silicon-epoxy molding compound (EMC) interface, the results for maximum strength and GIc are, respectively, 26 MPa and 0.05 N/mm. The second interface tested consisted of polyimide and silicon oxide between the silicon and EMC layers, and the results obtained are 21.5 MPa for the maximum tensile strength and 0.02 N/mm for GIc. This study's findings aid in predicting and mitigating failure modes in the studied chip packaging. The insights offer directions for future research, focusing on enhancing material properties and exploring the impact of manufacturing parameters and temperature conditions on delamination in multilayer semiconductors.

Development and Study of a New Silane Based Polyurethane Hybrid Flexible Adhesive-Part 1: Mechanical Characterization.

The need for more sustainable adhesive formulations has led to the use of silane-based adhesives in different industrial sectors, such as the automotive industry. In this work, the mechanical properties of a dual cure two-component prototype adhesive which combined silylated polyurethane resin (SPUR) with standard epoxy resin was characterized under quasi-static conditions. The characterization process consisted of tensile bulk testing, to determine the Young's modulus, the tensile strength and the tensile strain to failure. The shear stiffness and shear strength were measured by performing a thick adherend shear test. The in-plane strain field was obtained using a digital image correlation method. Double-cantilever beam and mixed-mode tests were performed to assess the fracture toughness under pure modes. The prototype adhesive showed promising but lower properties compared to commercial solutions. Furthermore, the adhesive was modified via the addition of three different resin modifier additives and characterized via measuring the shear and tensile properties, but no enhancements were found. Finally, the adhesive was formulated with three different SPUR viscosities. The critical energy release rate analysis showed an optimum value for the medium viscosity SPUR adhesive.

Extended Finite Element Method (XFEM) Model for the Damage Mechanisms Present in Joints Bonded Using Adhesives Doped with Inorganic Fillers.

The use of adhesive bonding in diverse industries such as the automotive and aerospace sectors has grown considerably. In structural construction, adhesive joints provide a unique combination of low structural weight, high strength and stiffness, combined with a relatively simple and easily automated manufacturing method, characteristics that are ideal for the development of modern and highly efficient vehicles. In these applications, ensuring that the failure mode of a bonded joint is cohesive rather than adhesive is important since this failure mode is more controlled and easier to model and to predict. This work presents a numerical technique that enables the precise prediction of the bonded joint's behavior regarding not only its failure mode, but also the joint's strength, when inorganic fillers are added to the adhesive. To that end, hollow glass particles were introduced into an epoxy adhesive in different amounts, and a numerical study was carried out to simulate their influence on single lap joint specimens. The numerical results were compared against experimental ones, not only in terms of joint strength, but also their failure pattern. The neat adhesive, which showed 9% and 20% variations in terms of failure load and displacement, respectively. However, looking at the doped configurations, these presented smaller variations of about 2% and 10% for each respective variable. In all cases, by adding glass beads, crack initiation tended to change from adhesive to cohesive but with lower strength and ductility, correctly modeling the general experimental behavior as intended.

The Development and Study of a New Silylated Polyurethane-Based Flexible Adhesive-Part 2: Joint Testing and Numerical Modelling.

The need for more sustainable adhesive formulations has presented the possibility of using silane-based adhesives in the automotive industry. In this work, a dual-cure two-component silylated polyurethane resin (SPUR) adhesive was tested in single-lap joints, to assess in-joint behaviour at room temperature under quasi-static conditions for aluminium substrates. The effect of two different overlap lengths, 25 and 50 mm, was also considered. A numerical model was built using cohesive zone modelling in finite element software, to reproduce the mechanical behaviour of the joint. The model was fed with data experimentally withdrawn from the first part of this paper. A triangular-shaped cohesive zone model (CZM) law was chosen as the adhesive behaviour was highly elastic and lacked yielding phenomena. The experimental results served as the base for the numerical validation, allowing accurate CZM parameters to be successfully determined.

Enhancing Fatigue Life and Strength of Adhesively Bonded Composite Joints: A Comprehensive Review.

Adhesive bonding is widely seen as the most optimal method for joining composite materials, bringing significant benefits over mechanical joining, such as lower weight and reduced stress concentrations. Adhesively bonded composite joints find extensive applications where cyclic fatigue loading takes place, but this might ultimately lead to crack damage and safety issues. Consequently, it has become essential to study how these structures behave under fatigue loads and identify the remaining gaps in knowledge to give insights into new possibilities. The fatigue life of adhesively bonded composite joints is influenced by various parameters, including joint configuration and material properties of adherends and adhesive. Numerous studies with varying outcomes have been documented in the literature. However, due to the multitude of influential factors, deriving conclusive insights from these studies for practical design purposes has proven to be challenging. Hence, this review aims to address this challenge by discussing different methods to enhance the fatigue performance of adhesively bonded composite joints. Additionally, it provides a comprehensive overview of the existing literature on adhesively bonded composite joints under cyclic fatigue loading, focusing on three main aspects: Adherends modification, adhesive modification, and joint configurations. Since the effect of modifying the adhesive, adherends, and joint configurations on fatigue performance has not been comprehensively studied in the literature, this review aims to fill this gap by compiling and comparing the relevant experimental data. Furthermore, this review discusses the challenges and limitations associated with the methods that can be used to monitor the initiation and propagation of fatigue cracks.

Rheological and Mechanical Properties of an Acrylic PSA.

The adhesion of pressure-sensitive adhesives (PSAs) is a complex phenomenon that can be understood through the characterization of different properties, including viscoelastic, mechanical, and fracture properties. The aim of the present paper is to determine the viscoelastic behaviour of an acrylic PSA and place it in the viscoelastic window, as well as to determine the tensile strength of the material. Additionally, different numbers of stacked adhesive layers and two crosshead speeds were applied to characterize the tensile strength of the adhesive in the different conditions. Adding a new interface between layers showed a negative influence in the tensile strength, while a higher crosshead speed implied a considerable increase in the same value. Finally, double cantilever beam (DCB) fracture tests were performed, and the J-integral approach was used to evaluate the fracture energy throughout the tests. The substrate roughness, the number of stacked layers, and the thickness of the PSA proved to decrease the performance of the PSA in fracture tests. While tensile bulk tests in viscoelastic materials are not easily found in the literature, as well as DCB tests, for fracture characterization, the obtained results allowed for the characterization of those properties in an acrylic PSA.

Study of Hybrid Composite Joints with Thin-Ply-Reinforced Adherends.

It has been demonstrated that a possible solution to reducing delamination in a unidirectional composite laminate lies in the replacement of conventional carbon-fibre-reinforced polymer layers with optimized thin-ply layers, thus creating hybrid laminates. This leads to an increase in the transverse tensile strength of the hybrid composite laminate. This study investigates the performance of a hybrid composite laminate reinforced by thin plies used as adherends in bonded single lap joints. Two different composites with the commercial references Texipreg HS 160 T700 and NTPT-TP415 were used as the conventional composite and thin-ply material, respectively. Three configurations were considered in this study: two reference single lap joints with a conventional composite or thin ply used as the adherends and a hybrid single lap. The joints were quasi-statically loaded and recorded with a high-speed camera, allowing for the determination of damage initiation sites. Numerical models of the joints were also created, allowing for a better understanding of the underlying failure mechanisms and the identification of the damage initiation sites. The results show a significant increase in tensile strength for the hybrid joints compared to the conventional ones as a result of changes in the damage initiation sites and the level of delamination present in the joint.

From High Strain Rates to Elevated Temperatures: Investigating Mixed-Mode Fracture Behaviour in a Polyurethane Adhesive.

The investigation of the behaviour of adhesive joints under high strain rates is an active area of research, primarily due to the widespread use of adhesives in various industries, including automotive manufacturing. Understanding how adhesives perform when subjected to high strain rates is crucial for designing vehicle structures. Additionally, it is particularly important to comprehend the behaviour of adhesive joints when exposed to elevated temperatures. Therefore, this study aims to analyse the impact of strain rate and temperature on the mixed-mode fracture characteristics of a polyurethane adhesive. To achieve this, mixed-mode bending tests were conducted on test specimens. These specimens were subjected to three different strain rates (0.2 mm/min, 200 mm/min, and 6000 mm/min) and tested at temperatures ranging from -30 °C to 60 °C. The crack size was measured using a compliance-based method during the tests. For temperatures above Tg, the maximum load supported by the specimen increased with an increasing loading rate. GI increased by a factor of 35 for an intermediate strain rate and 38 for a high strain rate from low temperature (-30 °C) to room temperature (23 °C). GII also increased for the same conditions by a factor of 25 and 95 times, respectively.

Development of a Unified Specimen for Adhesive Characterisation-Part 1: Numerical Study on the Mode I (mDCB) and II (ELS) Fracture Components.

Adhesives are increasingly being employed in industrial applications as a replacement for traditional mechanical joining methods, since they enable improvements in the strength-to-weight ratio and lower the cost of the overall structures. This has led to a need for adhesive mechanical characterisation techniques that can provide the data needed to build advanced numerical models, allowing structural designers to expedite the adhesive selection process and grant precise optimisation of bonded connection performance. However, mechanically mapping the behaviour of an adhesive involves numerous different standards resulting in a complex network of various specimens, testing procedures and data reduction methods that concern techniques which are exceedingly complex, time-consuming, and expensive. As such, and to address this problem, a novel fully integrated experimental characterisation tool is being developed to significantly reduce all the issues associated with adhesive characterisation. In this work, a numerical optimisation of the unified specimen's fracture toughness components, comprising the combined mode I (modified double cantilever beam) and II (end-loaded split) test, was performed. This was achieved by computing the desired behaviour as a function of the apparatus' and specimens' geometries, through several dimensional parameters, and by testing different adhesives, widening the range of applications of this tool. In the end, a custom data reduction scheme was deduced and set of design guidelines was defined.

An Exploratory Study on Determining and Modeling the Creep Behavior of an Acrylic Pressure-Sensitive Adhesive.

In the present paper, an exploratory study on the creep behavior of a pressure sensitive adhesive (PSA) is performed. After the determination of the quasi-static behavior of the adhesive for bulk specimens and single lap joints (SLJ), SLJs were subjected to creep tests at 80%, 60%, and 30% of their respective failure load. It was verified that the durability of the joints increases under static creep conditions as the load level decreases, with the second phase of the creep curve becoming more pronounced, where the strain rate is close to zero. In addition, cyclic creep tests were performed for the 30% load level at a frequency of 0.04 Hz. Finally, an analytical model was applied to the experimental results in order to reproduce the values obtained for both static and cyclic tests. The model was found to be effective, reproducing the three phases of the curves which allowed for the characterization of the full creep curve, something not commonly found in the literature, especially for PSAs.

Effect of the Interface/Interphase on the Water Ingress Properties of Joints with PBT-GF30 and Aluminum Substrates Using Silicone Adhesive.

The aim of this work is to analyze the difference between silicone/composite and silicone/metal interphases, both in terms of water diffusion behavior and failure of the aged joints. For that, silicone joints with two different suhbstrates were prepared. The substrates were polybutylene terephthalate with 30% of short glass fiber (PBT-GF30) and 6082-T6 aluminum. It is assumed that the water uptake of the joints is equal to the water uptake of the substrate, adhesive, and interphase. Therefore, knowing the first three, the last could be isolated. To study the water diffusion behavior of the complete joint, rectangular joints were prepared, immersed in water and their water uptake was measured. The water immersion was conducted at 70 °C. It was concluded that the aluminum/silicone joints absorbed more water through the interphase region than the PBT-GF30/silicone joints, since the difference between the expected water uptake and the experimentally measured mass gain is significantly higher, causing adhesive failure of the joint. The same was not observed in the PBT-GF30/silicone, with a more stable interphase, that does not absorb measurable quantities of water and always exhibits cohesive failure.

Numerical Design of a Thread-Optimized Gripping System for Lap Joint Testing in a Split Hopkinson Apparatus.

Currently, few experimental methods exist that enable the mechanical characterization of adhesives under high strain rates. One such method is the Split Hopkinson Bar (SHB) test. The mechanical characterization of adhesives is performed using different specimen configurations, such as Single Lap Joint (SLJ) specimens. A gripping system, attached to the bars through threading, was conceived to enable the testing of SLJs. An optimization study for selecting the best thread was performed, analyzing the thread type, the nominal diameter, and the thread pitch. Afterwards, the gripping system geometry was numerically evaluated. The optimal threaded connection for the specimen consists of a trapezoidal thread with a 14 mm diameter and a 2 mm thread pitch. To validate the gripping system, the load-displacement (P-δ) curve of an SLJ, which was simulated as if it were tested on the SHB apparatus, was compared with an analogous curve from a validated drop-weight test numerical model.

Developments in Laminate Modification of Adhesively Bonded Composite Joints.

The use of carbon fibre reinforced polymer (CFRP) materials is increasing in many different industries, such as those operating in the aviation, marine, and automotive sectors. In these applications, composite parts are often joined with other composite or metallic parts, where adhesive bonding plays a key role. Unlike conventional joining methods, adhesive bonding does not add weight or require the drilling of holes, both of which are major sources of stress concentration. The performance of a composite joint is dependent on multiple factors and can be improved by modifying the adhesive layer or the composite layup of the adherend. Moreover, joint geometry, surface preparation, and the manufacturing methods used for production are also important factors. The present work reviews recent developments on the design and manufacture of adhesively bonded joints with composite substrates, with particular interest in adherend modification techniques. The effects of stacking sequence, use of thin-plies, composite metal laminates and its specific surface preparations, and the use of toughened surface layers in the composite adherends are described for adhesively bonded CFRP structures.

Loading Rate and Temperature Interaction Effects on the Mode I Fracture Response of a Ductile Polyurethane Adhesive Used in the Automotive Industry.

Due to their high elongation at failure and damping capacity, polyurethanes are one of the main types of adhesives used in automotive structures. However, despite the wide range of applications of adhesives, their fracture mechanics behavior is still poorly studied in the literature, especially when both the loading rate and ambient temperature change. Accordingly, the main aim of the current work is to deal with the research gap. In the current research, mode I fracture energy of a ductile polyurethane adhesive with adaptive properties for its industrial application is determined at different test speeds and temperatures. Tests were done at quasi-static, intermediate, and high-speed levels and each at three different temperatures, including low, high, and room temperature. Mode I fracture toughness was determined using DCB tests. Increasing the loading rate from quasi-static to 6000 mm/min was found to significantly increase the maximum strength of the tested DCBs (from 1770 N to about 4180 N). The greatest sensitivity to the loading rate was observed for the DCBs tested at room temperature, where the fracture energy increased by a factor of 3.5 from quasi-static (0.2 mm/min) to a high loading rate (6000 mm/min). The stiffness analysis of the DCB samples showed that the transition from below the Tg to room temperature decreases the bond stiffness by about 60%, while a further temperature increase (from 23 °C to 60 °C) has no significant effect on this parameter. Since polyurethane-bonded joints often experience a wide range of temperatures and loading rates in service, the obtained results can be used to design these joints more securely against such loading/environmental conditions.

Experimental and Numerical Study of Thermal Residual Stresses on Multimaterial Adherends in Single-Lap Joints.

The presence of residual stresses in composite materials can significantly affect material performance, especially when integrated in bonded joints. These stresses, often generated during the cure process, can cause cracking and distortion of the material, and are caused by differences in the coefficients of thermal expansion or cure shrinkage. In the current research, multimaterial adherends combining carbon-fibre-reinforced polymer (CFRP) and aluminium in a single-lap joint (SLJ) configuration are analysed, allowing us to understand the effect of the thermal residual stresses, developed during the curing process, in the overall performance of the joints. A numerical model resorting to a finite element analysis (FEA) is developed to assess and predict the behaviour of the joints. The use of FML (fibre metal laminates) was found to significantly improve the strength of the joints, as well as the failure mode. The proposed geometry performed similarly to the comparable FML geometry, in addition to a decrease in the joint weight.

Development and Characterisation of Joints with Novel Densified and Wood/Cork Composite Substrates.

The automotive industry, driven by the desire to decrease the environmental impact of vehicles, is permanently seeking to develop lightweight structural components, which lead to lower gas emissions and energy consumption, reducing their carbon footprint. In parallel, adopting innovative, constructive solutions, which dispense non-recyclable and energy-intensive materials, can increase the footprint reduction. Thus, an increase in the use of renewable materials for structural applications, including wood and its by-products, has been observed over the last few decades. Furthermore, composite materials are often joined by using petroleum-based synthetic adhesives, which should be progressively replaced by eco-friendly bio-adhesives. In this study, novel densified wood and wood/cork composites, joined with a bio-adhesive, are proposed and characterised. The densification of the wood aims to enhance the mechanical properties of the natural material, with the purpose of improving the energy absorption of the wood/bio-adhesive joint. To mitigate delamination and the brittle behaviour of wood/cork agglomerates were introduced between the wood substrate and the bio-adhesive. Different configurations of single lap joints (SLJ) were manufactured to study the effect of the overlap length and loading rate on the performance of the joints, both in terms of failure load and energy absorption. Afterward, the joints were numerically simulated. The densification process was successful, although it represents an additional challenge in terms of surface flatness, because the bio-adhesive requires zero bondline thickness. The increase of the overlap had a positive impact on the energy absorption of the joint, and the addition of cork resulted in a more consistent failure mode and higher strain to failure. The numerical models developed had a good correlation with the experimental results.

Characterization of the Effect of Hollow Glass Beads on the Mechanical Properties of Structural Adhesives.

Adhesives are extensively used in the automotive and aeronautical industries as they enable the creation of durable and light weight joints, with exceptional strength to weight ratios. The constant search for the means of adapting the mechanical performance of adhesives to each application has led to the use of several types of fillers to change their properties. Following a study on the effect of inorganic fillers, i.e., hollow glass beads, in the failure mechanisms of single lap joint's (SLJ), this work focuses on the response of the strength and fracture properties of structural adhesives to this filler. To this end, their tensile strength and mode I fracture properties were thoroughly analyzed by performing bulk tensile and double-cantilever beam (DCB) tests, at a quasi-static speed. The specimens were manufactured by adding different %v/v of filler to two epoxy-based crash resistant adhesives. Both adhesives have shown a negligible effect on the tensile strength, a decrease in strain at failure and critical energy release rate in mode I, as well as an increase of the Young's modulus, for higher % in volume of hollow glass beads. These phenomena were further analyzed recurring to scanning electron microscopy, and the concept of rule of mixtures.