Deposition of hermetic silver shells onto copper flakes.

Continuous silver shells were deposited on copper flakes using a two-stage precipitation process. A tightly packed layer of silver nanoparticles was first formed on the surface of the base metal by galvanic displacement. The size of the noble metal particles and their distribution on the substrate were controlled using complexing agents and dispersants. A continuous Ag deposit was subsequently grown by reducing slowly [Ag(NH3)2]+ ions with glucose. The final shell thickness was controlled by varying the amount of metal deposited in the second step. The electrical properties of resulting silver coated copper flakes are comparable to those measured for silver flakes of similar size and aspect ratio. By preventing the oxidation of copper cores up to 400°C, the hermetic noble metal shell dramatically extends the temperature range in which Ag/Cu flakes can successfully replace pure silver.

Observation of the formation of anisotropic silver microstructures by evanescent wave and electron microscopy.

Using a well-known galvanic displacement reaction, ∼25-40 µm long silver ribbons grown after mixing ∼50 nm copper particles with AgNO3 solution were observed as a function of Ag(+) concentration and their growth was characterized in real-time and in situ by evanescent wave (EW) microscopy. At low Ag(+) concentration, chain-like structures consisting of both Ag and Cu were observed. When the sequence of mixing these two reactants was reversed, different Ag microstructures (platelets and dendrites) were formed and were also characterized by EW microscopy. Dependence of the morphology of all these microstructures on silver ion concentration was determined by EW microscopy in conjunction with scanning and transmission electron microscopy.