RESUMO
The dual sintering of copper (Cu) nanoparticles (NPs) was introduced to produce conductive patterns suitable for flexible electronics applications. In this method, laser irradiation using a Nd:YAG laser with a wavelength of 1064 nm was performed at laser powers of 400, 600 and 800 mJ. The laser irradiation time was 15 and 30 s for each laser power. After laser irradiation, all of the Cu NP patterns were thermally sintered under formic acid vapors. The temperature and time for thermal treatment were selected as 260 °C and 15 min, respectively. The resultant physical, chemical, electrical and mechanical properties were evaluated and compared considering the six different dual sintering conditions. The Cu NP patterns sintered using 800 mJ for 30 s showed increased necking and coalescence compared to the other patterns and featured a microstructure with increased density. Despite being oxidized, the Cu NP patterns sintered with 800 mJ for 30 s showed the lowest electrical resistivity of 11.25µΩ cm. The surface of every sintered Cu pattern was oxidized, and mechanical hardness increased with increasing laser power. The Cu NP pattern sintered with 800 mJ for 30 s demonstrated the highest hardness of 48.64 N mm-2. After sintering using the six different conditions, the Cu NP patterns exhibited a weight loss of 0.02-3.87 wt%, and their roughness varied in the range of 26.15-74.08 nm. This can be attributed to the effective removal of organic residues and the degree of particle agglomeration. After performing folding tests up to 50 cycles, Cu NP patterns showed an upward trend in resistance with increasing laser power and time. The highest and lowest resistance ratios were observed as 3.97 and 17.24 for the patterns sintered at 400 mJ for 15 s and 800 mJ for 30 s, respectively.
