Use of Green Fs Lasers to Generate a Superhydrophobic Behavior in the Surface of Wind Turbine Blades.

Ice generation on the surface of wind generator blades can affect the performance of the generator in several aspects. It can deteriorate sensor performance, reduce efficiency, and cause mechanical failures. One of the alternatives to minimize these effects is to include passive solutions based on the modification of the blade surfaces, and in particular to generate superhydrophobic behavior. Ultra-short laser systems enable improved micromachining of polymer surfaces by reducing the heat affected zone (HAZ) and improving the quality of the final surface topography. In this study, a green fs laser is used to micromachine different patterns on the surface of materials with the same structure that can be found in turbine blades. Convenient optimization of surface topography via fs laser micromachining enables the transformation of an initially hydrophilic surface into a superhydrophobic one. Thus, an initial surface finish with a contact angle ca. 69° is transformed via laser treatment into one with contact angle values above 170°. In addition, it is observed that the performance of the surface is maintained or even improved with time. These results open the possibility of using lasers to control turbine blade surface microstructure while avoiding the use of additional chemical coatings. This can be used as a complementary passive treatment to avoid ice formation in these large structures.

Highly Regular Hexagonally-Arranged Nanostructures on Ni-W Alloy Tapes upon Irradiation with Ultrashort UV Laser Pulses.

Nickel tungsten alloy tapes (Ni-5 at% W, 10 mm wide, 80 µm thick, biaxially textured) used in second-generation high temperature superconductor (2G-HTS) technology were laser-processed in air with ultraviolet ps-laser pulses (355 nm wavelength, 300 ps pulse duration, 250-800 kHz pulse repetition frequency). By employing optimized surface scan-processing strategies, various laser-generated periodic surface structures were generated on the tapes. Particularly, distinct surface microstructures and nanostructures were formed. These included sub-wavelength-sized highly-regular hexagonally-arranged nano-protrusions, wavelength-sized line-grating-like laser-induced periodic surface structures (LIPSS, ripples), and larger irregular pyramidal microstructures. The induced surface morphology was characterized in depth by electron-based techniques, including scanning electron microscopy (SEM), electron back scatter diffraction (EBSD), cross-sectional transmission electron microscopy (STEM/TEM) and energy dispersive X-ray spectrometry (EDS). The in-depth EBSD crystallographic analyses indicated a significant impact of the material initial grain orientation on the type of surface nanostructure and microstructure formed upon laser irradiation. Special emphasis was laid on high-resolution material analysis of the hexagonally-arranged nano-protrusions. Their formation mechanism is discussed on the basis of the interplay between electromagnetic scattering effects followed by hydrodynamic matter re-organization after the laser exposure. The temperature stability of the hexagonally-arranged nano-protrusion was explored in post-irradiation thermal annealing experiments, in order to qualify their suitability in 2G-HTS fabrication technology with initial steps deposition temperatures in the range of 773-873 K.

Improved Copper-Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications.

The objective of this work is the enhancement of metal-to-metal bonding to provide high thermal conductivity together with electrical insulation, to be used as heat sinks at room and cryogenic temperatures. High thermal conductive metal (copper) and epoxy resin (Stycast 2850FT) were used in this study, with the latter also providing the required electrical insulation. The copper surface was irradiated with laser to induce micro- and nano-patterned structures that result in an improvement of the adhesion between the epoxy and the copper. Thus, copper-to-copper bonding strength was characterized by means of mechanical tensile shear tests. The effect of the laser processing on the thermal conductivity properties of the Cu/epoxy/Cu joint at different temperatures, from 10 to 300 K, is also reported. Using adequate laser parameters, it is possible to obtain high bonding strength values limited by cohesive epoxy fracture, together with good thermal conductivity at ambient and cryogenic temperatures.