Research on Surface Morphology of Gold Micro Bumps Based on Monte Carlo Method.

In advanced packaging technology, the micro bump has become an important means of chip stacking and wafer interconnection. The reliability of micro bumps, which plays an important role in mechanical support, electrical connection, signal transmission and heat dissipation, determines the quality of chip packaging. Surface morphological defects are one of the main factors affecting the reliability of micro bumps, which are closely related to materials and bonding process parameters. In this paper, the electrodeposition process of preparing gold bumps is simulated at the atomic scale using the Kinetic Monte Carlo method. The differences in surface morphology and roughness of the plated layer are studied from a microscopic perspective under different deposition parameters. The results show that the gold micro bumps prepared by electrodeposition have better surface quality under conditions of lower deposition voltage, lower ion concentration and higher plating temperature, which can provide significant guidance for engineering applications.

Wideband and Large Angle Electromagnetically Induced Transparency by the Equivalent Transmission Line in a Metasurface.

A classical structure for a U-shaped metasurface exhibiting a wideband and large angle electromagnetically induced transparency (EIT) effect in the terahertz range is proposed. One horizontal and two vertical strips, which represent the bright and dark modes, respectively, are created for the U-shaped structure. The finite integration time domain (FITD) and equivalent circuit method are compared with the EIT result. The EIT effect is affected by the length of the vertical bar and by the distance from the vertical bar to the symmetry axis. The results show that the asymmetry of the main structure in the x and y axes makes it easier to achieve the EIT effect. In addition, by changing the incident angle, the EIT effect always exists until the angle of the incidental electromagnetic wave is 85 degrees. These results have many potential applications for terahertz filtering, large-angle switching and sensors.