Investigation of Microstructure and Wear Properties of Precipitates-Strengthened Cu-Ni-Si-Fe Alloy.

Based on multi-component alloys using precipitation hardening, a Cu-Ni-Si-Fe copper alloy was prepared and studied for hardness, electrical conductivity, and wear resistance. Copper Nickel Silicon (Cu-Ni-Si) intermetallic compounds were observed as precipitates, leading to an increase in mechanical and physical properties. Further, the addition of Fe was discussed in intermetallic compound formation. Moreover, microstructures, age hardening, and dry sliding wear resistances of the present alloy were analyzed and compared with C17200 beryllium copper. The results showed that the present alloy performed extraordinarily, with 314 HV in hardness and 22.2 %IACS in conductivity, which is almost similar to C17200 alloy. Furthermore, the dry sliding wear resistance of the present alloy was 2199.3 (m/MPa·mm3) at an ambient temperature, leading to an improvement of 208% compared with the C17200 alloy.

Effect of serrated grain boundary on tensile and creep properties of a precipitation strengthened high entropy alloy.

In this study, tensile and creep deformation of a high-entropy alloy processed by selective laser melting (SLM) has been investigated; hot ductility drop was identified at first, and the loss of ductility at elevated temperature was associated with intergranular fracture. By modifying the grain boundary morphology from straight to serration, the hot ductility drop issue has been resolved successfully. The serrated grain boundary could be achieved by reducing the cooling rate of solution heat treatment, which allowed the coarsening of L12 structured γ' precipitates to interfere with mobile grain boundaries, resulting in undulation of the grain boundary morphology. Tensile and creep tests at 650°C were conducted, and serrated grain boundary could render a significant increase in tensile fracture strain and creep rupture life by a factor of 3.5 and 400, respectively. Detailed microstructure analysis has indicated that serrated grain boundary could distribute strains more evenly than that of straight morphology. The underlying mechanism of deformation with grain boundary serration was further demonstrated by molecular dynamic simulation, which has indicated that serrated grain boundaries could reduce local strain concentration and provide resistance against intergranular cracking. This is the first study to tackle the hot ductility drop issue in a high-entropy alloy fabricated by SLM; it can provide a guideline to develop future high-entropy alloys and design post heat treatment for elevated temperature applications.