Mitigating Dark Current for High-Performance Near-Infrared Organic Photodiodes via Charge Blocking and Defect Passivation.

Thin-film organic near-infrared (NIR) photodiodes can be essential building blocks in the rapidly emerging fields including the internet of things and wearable electronics. However, the demonstration of NIR organic photodiodes with not only high responsivity but also low dark current density that is comparable to that of inorganic photodiodes, for example, below 1 nA cm-2 for silicon photodiodes, remains a challenge. In this work, we have demonstrated non-fullerene acceptor-based NIR photodiodes with an ultralow dark current density of 0.2 nA cm-2 at -2 V by innovating on charge transport layers to mitigate the reverse charge injection and interfacial defect-induced current generation. The same device also shows a high external quantum efficiency approaching 70% at 850 nm and a specific detectivity of over 1013 Jones at wavelengths up to 940 nm. Furthermore, the versatility of our approach for mitigating dark current is demonstrated using a NIR photodetector utilizing different non-fullerene systems. Finally, the practical application of NIR organic photodiodes is demonstrated with an image sensor integrated on a silicon CMOS readout. This work provides new insight into the device stack design of low-dark current NIR organic photodiodes for weak light detection.

Density and Capture Cross-Section of Interface Traps in GeSnO2 and GeO2 Grown on Heteroepitaxial GeSn.

An imperative factor in adapting GeSn as the channel material in CMOS technology, is the gate-oxide stack. The performance of GeSn transistors is degraded due to the high density of traps at the oxide-semiconductor interface. Several oxide-gate stacks have been pursued, and a midgap Dit obtained using the ac conductance method, is found in literature. However, a detailed signature of oxide traps like capture cross-section, donor/acceptor behavior and profile in the bandgap, is not yet available. We investigate the transition region between stoichiometric insulators and strained GeSn epitaxially grown on virtual Ge substrates. Al2O3 is used as high-κ oxide and either Ge1-xSnxO2 or GeO2 as interfacial layer oxide. The interface trap density (Dit) profile in the lower half of the bandgap is measured using deep level transient spectroscopy, and the importance of this technique for small bandgap materials like GeSn, is explained. Our results provide evidence for two conclusions. First, an interface traps density of 1.7 × 10(13) cm(-2)eV(-1) close to the valence band edge (Ev + 0.024 eV) and a capture cross-section (σp) of 1.7 × 10(-18) cm(2) is revealed for GeSnO2. These traps are associated with donor states. Second, it is shown that interfacial layer passivation of GeSn using GeO2 reduces the Dit by 1 order of magnitude (2.6 × 10(12) cm(-2)eV(-1)), in comparison to GeSnO2. The results are cross-verified using conductance method and saturation photovoltage technique. The Dit difference is associated with the presence of oxidized (Sn(4+)) and elemental Sn in the interfacial layer oxide.

Sidewall crystalline orientation effect of post-treatments for a replacement metal gate bulk fin field effect transistor.

The crystalline orientation effect is investigated for post-treatments of a replacement metal gate (RMG) p-type bulk fin field effect transistor (FinFET). After post-deposition annealing (PDA) and SF6 plasma treatment, the hole mobility is improved. From low-frequency noise analysis, reduction of the trap density and noise level is observed in PDA- and SF6-plasma-treated devices. (100) sidewall-oriented FinFETs show a lower noise level because of fewer interface traps compared to (110) sidewall-oriented devices. SF6 plasma affects the interface traps, whereas PDA relatively more affects bulk oxide traps for RMG high-k last FinFET.