Pinaceae Pine Resins (Black Pine, Shore Pine, Rosin, and Baltic Amber) as Natural Dielectrics for Low Operating Voltage, Hysteresis-Free, Organic Field Effect Transistors.

Four pinaceae pine resins analyzed in this study: black pine, shore pine, Baltic amber, and rosin demonstrate excellent dielectric properties, outstanding film forming, and ease of processability from ethyl alcohol solutions. Their trap-free nature allows fabrication of virtually hysteresis-free organic field effect transistors operating in a low voltage window with excellent stability under bias stress. Such green constituents represent an excellent choice of materials for applications targeting biocompatibility and biodegradability of electronics and sensors, within the overall effort of sustainable electronics development and environmental friendliness.

Enhancement of the Sensing Performance of Devices based on Multistimuli-Responsive Hybrid Materials.

Capturing environmental stimuli is an essential aspect of electronic skin applications in robotics and prosthetics. Sensors made of temperature- and humidity-responsive hydrogel and piezoelectric zinc oxide (ZnO) core-shell nanorods have shown the necessary sensitivity. This is achieved by using highly conformal and substrate independent deposition methods for the ZnO and the hydrogel, i.e., plasma enhanced atomic layer deposition (PEALD) and initiated chemical vapor deposition (iCVD). In this work, we demonstrate that the use of a multichamber reactor enables performing PEALD and iCVD, sequentially, without breaking the vacuum. The sequential deposition of uniform as well as conformal thin films responsive to force, temperature, and humidity improved the deposition time and quality significantly. Proper interlayer adhesion could be achieved via in situ interface activation, a procedure easily realizable in this unique multichamber reactor. Beyond the fabrication method, also the mechanical properties of the template used to embed the core-shell nanorods and the cross-linker density in the hydrogel were optimized following the results of finite element models. Finally, galvanostatic electrochemical impedance spectroscopy measurements showed how temperature and humidity stimuli have different effects on the device impedance and phase, and these differences can be the basis for stimuli recognition.

Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation.

The integration of assembled foils in injection-molded parts is a challenging step. Such assembled foils typically comprise a plastic foil on which a circuit board is printed and electronic components are mounted. Those components can detach during overmolding when high pressures and shear stresses prevail due to the injected viscous thermoplastic melt. Hence, the molding settings significantly impact such parts' successful, damage-free manufacturing. In this paper, a virtual parameter study was performed using injection molding software in which 1206-sized components were overmolded in a plate mold using polycarbonate (PC). In addition, experimental injection molding tests of that design and shear and peel tests were made. The simulated forces increased with decreasing mold thickness and melt temperature and increasing injection speed. The calculated tangential forces in the initial stage of overmolding ranged from 1.3 N to 7.3 N, depending on the setting used. However, the experimental at room temperature-obtained shear forces at break were at least 22 N. Yet, detached components were present in most of the experimentally overmolded foils. Hence, the shear tests performed at room temperature can only provide limited information. In addition, there might be a peel-like load case during overmolding where the flexible foil might bend during overmolding.

Technique-Dependent Relationship between Local Ski Bending Curvature, Roll Angle and Radial Force in Alpine Skiing.

Skiing technique, and performance are impacted by the interplay between ski and snow. The resulting deformation characteristics of the ski, both temporally and segmentally, are indicative of the unique multi-faceted nature of this process. Recently, a PyzoFlex® ski prototype was presented for measuring the local ski curvature (w″), demonstrating high reliability and validity. The value of w″ increases as a result of enlargement of the roll angle (RA) and the radial force (RF) and consequently minimizes the radius of the turn, preventing skidding. This study aims to analyze segmental w″ differences along the ski, as well as to investigate the relationship among segmental w″, RA, and RF for both the inner and outer skis and for different skiing techniques (carving and parallel ski steering). A skier performed 24 carving and 24 parallel ski steering turns, during which a sensor insole was placed in the boot to determine RA and RF, and six PyzoFlex® sensors were used to measure the w″ progression along the left ski (w1-6″). All data were time normalized over a left-right turn combination. Correlation analysis using Pearson's correlation coefficient (r) was conducted on the mean values of RA, RF, and segmental w1-6″ for different turn phases [initiation, center of mass direction change I (COM DC I), center of mass direction change II (COM DC II), completion]. The results of the study indicate that, regardless of the skiing technique, the correlation between the two rear sensors (L2 vs. L3) and the three front sensors (L4 vs. L5, L4 vs. L6, L5 vs. L6) was mostly high (r > 0.50) to very high (r > 0.70). During carving turns, the correlation between w″ of the rear (w1-3″) and that of front sensors (w4-6″) of the outer ski was low (ranging between -0.21 and 0.22) with the exception of high correlations during COM DC II (r = 0.51-0.54). In contrast, for parallel ski steering, the r between the w″ of the front and rear sensors was mostly high to very high, especially for COM DC I and II (r = 0.48-0.85). Further, a high to very high correlation (r ranging between 0.55 and 0.83) among RF, RA, and w″ of the two sensors located behind the binding (w2″,w3″) in COM DC I and II for the outer ski during carving was found. However, the values of r were low to moderate (r = 0.04-0.47) during parallel ski steering. It can be concluded that homogeneous ski deflection along the ski is an oversimplified picture, as the w″ pattern differs not only temporally but also segmentally, depending on the employed technique and turn phase. In carving, the rear segment of the outer ski is considered to have a pivotal role for creating a clean and precise turn on the edge.

Influence of Injection Molding Parameters on the Peel Strength between Plasma-Treated Fluoropolymer Films and Polycarbonate.

Light guiding is used to direct light from an emitting source to a different location. It is frequently realized through a clad-core structure with a difference in the refractive index of the materials. This paper explores the possibility of combining a fluoropolymer (THV) film of low refractive index, serving as a cladding layer, with a polycarbonate (PC) core, via injection molding. Pristine THV lacks adherence to the PC. However, when treated with O2 plasma prior to overmolding, bonding can be established that was quantified in peel tests. The effect of this surface treatment was further investigated by adjusting the plasma treatment duration and time to overmolding. Furthermore, parameter studies comprising the four molding parameters, namely packing pressure, injection speed, melt temperature, and mold temperature, were performed. Numerical injection molding simulations assessed the prevailing temperatures at the PC-THV boundary. Consequently, the temperature-time integral could be calculated and linked with the measured peel strengths by fitting a proportionality constant. While the plasma treatment duration showed minor influence, the activation diminished with time, halving the measured peel loads within 24 h. The adhesion was experimentally found to increase with a lower packing pressure, faster injection speed, and higher melt and mold temperature. Those same molding relations influencing the peel loads were also found with the temperature-time integral when scaled by the proportionality constant in the simulations (R2=85%). Apparently, adhesion is added by molding settings which promote higher interface temperatures that prevail for longer. Hereby, the faster injection speed increases the melt temperature through shear heating. A higher packing pressure, in contrast, presumably increases the heat transfer at the PC-THV interface, accelerating the cooling. The measured peel loads were 0.3-1.6 N/mm for plasma-treated samples and nearly zero for pristine THV.

Study of Pressure Distribution in Floor Tiles with Printed P(VDF:TrFE) Sensors for Smart Surface Applications.

Pressure sensors integrated in surfaces, such as the floor, can enable movement, event, and object detection with relatively little effort and without raising privacy concerns, such as video surveillance. Usually, this requires a distributed array of sensor pixels, whose design must be optimized according to the expected use case to reduce implementation costs while providing sufficient sensitivity. In this work, we present an unobtrusive smart floor concept based on floor tiles equipped with a printed piezoelectric sensor matrix. The sensor element adds less than 130 µm in thickness to the floor tile and offers a pressure sensitivity of 36 pC/N for a 1 cm2 pixel size. A floor model was established to simulate how the localized pressure excitation acting on the floor spreads into the sensor layer, where the error is only 1.5%. The model is valuable for optimizing the pixel density and arrangement for event and object detection while considering the smart floor implementation in buildings. Finally, a demonstration, including wireless connection to the computer, is presented, showing the viability of the tile to detect finger touch or movement of a metallic rod.

Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion.

The integration of structural electronics in injection-molded parts is a challenging step. The films-comprising of laminated stacks with electronics-are exposed to shear stresses and elevated temperatures by the molten thermoplastic. Hence, molding settings have a significant impact on the successful, damage-free manufacturing of such parts. In this paper, test films with polycarbonate (PC) sheets as outer and two different thermoplastic polyurethanes (TPUs) as middle layers incorporating conductive tracks on a flexible printed circuit board (flexPCB) are manufactured and overmolded with PC. Parameter studies investigating the influence of the melt temperature, mold temperature, injection speed and used TPU layer were performed. The molded parts were inspected visually and compared with a numerical simulation using injection molding software. A shear distortion factor for the TPU layer was derived based on the simulations that linked the shear stresses with the injection time and the softening (melting) of the TPU. The distortion of the films was found to reduce with higher melt temperature, lower mold temperature and faster injection speed. Films using the TPU with the higher melting temperature yielded significantly better results. Moreover, distortion on the films reduced with the increasing distance to the gate and a larger cavity thickness was found to be beneficial. All those relations could be correlated with the shear distortion factor.

Tuning the Porosity of Piezoelectric Zinc Oxide Thin Films Obtained from Molecular Layer-Deposited "Zincones".

Porous zinc oxide (ZnO) thin films were synthesized via the calcination of molecular layer-deposited (MLD) "zincone" layers. The effect of the MLD process temperature (110 °C, 125 °C) and of the calcination temperature (340 °C, 400 °C, 500 °C) on the chemical, morphological, and crystallographic properties of the resulting ZnO was thoroughly investigated. Spectroscopic ellipsometry reveals that the thickness of the calcinated layers depends on the MLD temperature, resulting in 38-43% and 52-56% of remaining thickness for the 110 °C and 125 °C samples, respectively. Ellipsometric porosimetry shows that the open porosity of the ZnO thin films depends on the calcination temperature as well as on the MLD process temperature. The maximum open porosity of ZnO derived from zincone deposited at 110 °C ranges from 14.5% to 24%, rising with increasing calcination temperature. Compared with the 110 °C samples, the ZnO obtained from 125 °C zincone yields a higher porosity for low calcination temperatures, namely 18% for calcination at 340 °C; and up to 24% for calcination at 500 °C. Additionally, the porous ZnO thin films were subjected to piezoelectric measurements. The piezoelectric coefficient, d33, was determined to be 2.8 pC/N, demonstrating the potential of the porous ZnO as an, e.g., piezoelectric sensor or energy harvester.

Fine-Tuning the Performance of Ultraflexible Organic Complementary Circuits on a Single Substrate via a Nanoscale Interfacial Photochemical Reaction.

Flexible electronics has paved the way toward the development of next-generation wearable and implantable healthcare devices, including multimodal sensors. Integrating flexible circuits with transducers on a single substrate is desirable for processing vital signals. However, the trade-off between low power consumption and high operating speed is a major bottleneck. Organic thin-film transistors (OTFTs) are suitable for developing flexible circuits owing to their intrinsic flexibility and compatibility with the printing process. We used a photoreactive insulating polymer poly((±)endo,exo-bicyclo[2.2.1]hept-ene-2,3-dicarboxylic acid, diphenylester) (PNDPE) to modulate the power consumption and operating speed of ultraflexible organic circuits fabricated on a single substrate. The turn-on voltage (V on) of the p- and n-type OTFTs was controlled through a nanoscale interfacial photochemical reaction. The time-of-flight secondary ion mass spectrometry revealed the preferential occurrence of the PNDPE photochemical reaction in the vicinity of the semiconductor-dielectric interface. The power consumption and operating speed of the ultraflexible complementary inverters were tuned by a factor of 6 and 4, respectively. The minimum static power consumption was 30 ± 9 pW at transient and 4 ± 1 pW at standby. Furthermore, within the tuning range of the operating speed and at a supply voltage above 2.5 V, the minimum stage delay time was of the order of hundreds of microseconds. We demonstrated electromyogram measurements to emphasize the advantage of the nanoscale interfacial photochemical reaction. Our study suggests that a nanoscale interfacial photochemical reaction can be employed to develop imperceptible and wearable multimodal sensors with organic signal processing circuits that exhibit low power consumption.

Heterogeneous Functional Dielectric Patterns for Charge-Carrier Modulation in Ultraflexible Organic Integrated Circuits.

Flexible electronics have gained considerable attention for application in wearable devices. Organic transistors are potential candidates to develop flexible integrated circuits (ICs). A primary technique for maximizing their reliability, gain, and operation speed is the modulation of charge-carrier behavior in the respective transistors fabricated on the same substrate. In this work, heterogeneous functional dielectric patterns (HFDP) of ultrathin polymer gate dielectrics of poly((±)endo,exo-bicyclo[2.2.1]hept-ene-2,3-dicarboxylic acid, diphenylester) (PNDPE) are introduced. The HFDP that are obtained via the photo-Fries rearrangement by ultraviolet radiation in the homogeneous PNDPE provide a functional area for charge-carrier modulation. This leads to programmable threshold voltage control over a wide range (-1.5 to +0.2 V) in the transistors with a high patterning resolution, at 2 V operational voltage. The transistors also exhibit high operational stability over 140 days and under the bias-stress duration of 1800 s. With the HFDP, the performance metrics of ICs, for example, the noise margin and gain of the zero-VGS load inverters and the oscillation frequency of ring oscillators are improved to 80%, 1200, and 2.5 kHz, respectively, which are the highest among the previously reported zero-VGS -based organic circuits. The HFDP can be applied to much complex and ultraflexible ICs.

Lab-on-a-foil devices with integrated retro-reflective structures for multiplexed DNA testing.

ABSTRACT: With the Covid-19-based global pandemic that started in the beginning of 2020, the vital importance of accelerated, reliable and affordable virus testing systems has once again become clearer. Besides, we all learned very well that the disposable biochips, to be used in these in vitro diagnostic (IVD) testing systems, supposed to be produced in large amounts in a very short time to be widely available for the use of humanity to save more and more lives. That is why; roll-to-roll (R2R) polymer structuring manners offer such large quantities for the production of in vitro biochips. Our technology, based on R2R UV nanoimprint lithography (UV-NIL), has superior features. Via our pilot line, robust 7500 biochip components per 100 meter of a flexible, polymer foil coated with a UV curable photo-resin (i.e., parts with capillary fluidic channels or optical structures for IVDs) can be generated. This study shows an example of a prototype of a R2R UV-NIL generated chip: a foil, capillary flow-based IVD biochip for multiplexed DNA detection purposes (i.e., a Lab-on-a-Foil device). The biochip performance was further increased dramatically by integrating UV-NIL produced retro-reflective microstructures, which reflects the light back, to its design to enhance optical signal detection in a commercial IVD device, detecting DNA on a chemiluminescent-reaction basis.

Imperceptible energy harvesting device and biomedical sensor based on ultraflexible ferroelectric transducers and organic diodes.

Energy autonomy and conformability are essential elements in the next generation of wearable and flexible electronics for healthcare, robotics and cyber-physical systems. This study presents ferroelectric polymer transducers and organic diodes for imperceptible sensing and energy harvesting systems, which are integrated on ultrathin (1-µm) substrates, thus imparting them with excellent flexibility. Simulations show that the sensitivity of ultraflexible ferroelectric polymer transducers is strongly enhanced by using an ultrathin substrate, which allows the mounting on 3D-shaped objects and the stacking in multiple layers. Indeed, ultraflexible ferroelectric polymer transducers have improved sensitivity to strain and pressure, fast response and excellent mechanical stability, thus forming imperceptible wireless e-health patches for precise pulse and blood pressure monitoring. For harvesting biomechanical energy, the transducers are combined with rectifiers based on ultraflexible organic diodes thus comprising an imperceptible, 2.5-µm thin, energy harvesting device with an excellent peak power density of 3 mW·cm-3.

High-throughput roll-to-roll production of polymer biochips for multiplexed DNA detection in point-of-care diagnostics.

Roll-to-roll UV nanoimprint lithography has superior advantages for high-throughput manufacturing of micro- or nano-structures on flexible polymer foils with various geometries and configurations. Our pilot line provides large-scale structure imprinting for cost-effective polymer biochips (4500 biochips/hour), enabling rapid and multiplexed detections. A complete high-volume process chain of the technology for producing structures like µ-sized, triangular optical out-couplers or capillary channels (width: from 1 µm to 2 mm, height: from 200 nm up to 100 µm) to obtain biochips (width: 25 mm, length: 75 mm, height: 100 µm to 1.5 mm) was described. The imprinting process was performed with custom-developed resins on polymer foils with resin thicknesses ranging between 125-190 µm. The produced chips were tested in a commercial point-of-care diagnostic system for multiplexed DNA analysis of methicillin resistant Staphylococcus aureus (e.g., mecA, mecC gene detections). Specific target DNA capturing was based on hybridisation between surface bound DNA probes and biotinylated targets from the sample. The immobilised biotinylated targets subsequently bind streptavidin-horseradish peroxidase conjugates, which in turn generate light upon incubation with a chemiluminescent substrate. To enhance the light out-coupling thus to improve the system performance, optical structures were integrated into the design. The limits-of-detection of mecA (25 bp) for chips with and without structures were calculated as 0.06 and 0.07 µM, respectively. Further, foil-based chips with fluidic channels were DNA functionalised in our roll-to-roll micro-array spotter following the imprinting. This straightforward approach of sequential imprinting and multiplexed DNA functionalisation on a single foil was also realised for the first time. The corresponding foil-based chips were able to detect mecA gene DNA sequences down to a 0.25 µM concentration.

Screen-Printed Ferroelectric P(VDF-TrFE)-co-PbTiO3 and P(VDF-TrFE)-co-NaBiTi2O6 Nanocomposites for Selective Temperature and Pressure Sensing.

Piezo- and pyroelectricity is an intrinsically combined material property for all ferroelectric materials. While the pyroelectric coefficients of most ferroelectric ceramics and polymers have the same sign, their piezoelectric coefficients have opposite ones. On this basis, we can create a polymer-ceramic nanocomposite material where either the piezo- or the pyroelectric effect is suppressed by a selective poling of the single constituents, a concept that was shown for composite pellets in the late 1990s. Motivated by the current demand for lightweight and low-cost piezoelectric sensors with reduced cross-sensitivity to temperature variations, we have taken up this idea and formulated screen-printable nanocomposite pastes from poly(vinylidene fluoride-trifluoroethylene (P(VDF-TrFE)) and lead titanate (PbTiO3, PT) or sodium bismuth titanate (NaBiTi2O6 or BNT) nanoparticles, respectively. We demonstrate that printed sensors on flexible substrates based on these materials can be conditioned by selective poling of the nanoparticles and the polymer matrix to show either only piezoelectric or only pyroelectric sensor response. We examined the degree of cross-talk between the thermal and pressure sensing channels and show a reduction of over 90% cross-sensitivity for the ferroelectric composites compared to pure P(VDF-TrFE) sensors.

Route towards sustainable smart sensors: ferroelectric polyvinylidene fluoride-based materials and their integration in flexible electronics.

With the advent of the Internet of Everything (IoE) era, our civilization and future generations will employ an unimaginable complex array of electronics and sensors in daily life. Ferroelectric polymers represent a core group of materials supporting the fast development of IoE, and their functionality, straightforward processing and unmatched versatility make them prime candidates for integration in multifaceted devices. Since they are highly selective, highly responsive, highly scalable, self-powering and compatible with flexible and stretchable substrates, they can be easily integrated with various electronics into numerous stand-alone objects and even into skin as sensors for monitoring diverse mechanical, thermal and vital parameters. They can also be used in combination with other sensor materials for harvesting waste energy from mechanical and thermal sources, for data storage and for actuation. This article reviews the up-to-date accomplishments in the ferroelectric polymer field, with focus on materials involving polyvinylidene fluoride (PVDF), and also discussed both their current advancement and future growth in the development of sustainable systems.

Stability of Selected Hydrogen Bonded Semiconductors in Organic Electronic Devices.

The electronics era is flourishing and morphing itself into Internet of Everything, IoE. At the same time, questions arise on the issue of electronic materials employed: especially their natural availability and low-cost fabrication, their functional stability in devices, and finally their desired biodegradation at the end of their life cycle. Hydrogen bonded pigments and natural dyes like indigo, anthraquinone and acridone are not only biodegradable and of bio-origin but also have functionality robustness and offer versatility in designing electronics and sensors components. With this Perspective, we intend to coalesce all the scattered reports on the above-mentioned classes of hydrogen bonded semiconductors, spanning across several disciplines and many active research groups. The article will comprise both published and unpublished results, on stability during aging, upon electrical, chemical and thermal stress, and will finish with an outlook section related to biological degradation and biological stability of selected hydrogen bonded molecules employed as semiconductors in organic electronic devices. We demonstrate that when the purity, the long-range order and the strength of chemical bonds, are considered, then the Hydrogen bonded organic semiconductors are the privileged class of materials having the potential to compete with inorganic semiconductors. As an experimental historical study of stability, we fabricated and characterized organic transistors from a material batch synthesized in 1932 and compared the results to a fresh material batch.

Dicyano- and tetracyanopentacene: foundation of an intriguing new class of easy-to-synthesize organic semiconductors.

Cyanated pentacenes are very promising candidate materials for ambipolar and n-type transistors. However, only a few examples have been obtained to date - all requiring lengthy, multi-step processes. Herein, we present the first preparation of 5,7,12,14-tetracyanopentacene (TCP) and a facile, scaled-up preparation of 6,13-dicyanopentacene (DCP). Both compounds are prepared by a one-pot synthesis using cheap quinones as starting materials. Detailed crystallographic investigations evince that the bulk assemblies of both cyanated pentacenes are dominated by non-covalent interactions, resulting in a dense, stable, face-to-face packing and in an intriguing packing motif for TCP. Very low frontier molecular orbital energy levels and a reversible bleaching of TCP are revealed by cyclic voltammetry. Finally, both cyanated pentacenes are used in proof-of-concept organic thin-film transistors (OTFTs) operating under ambient conditions. This work highlights the potential of cyanation for larger acenes and presents a straightforward route to the rational design of this promising class of materials.

Switching from weakly to strongly limited injection in self-aligned, nano-patterned organic transistors.

Organic thin-film transistors for high frequency applications require large transconductances in combination with minimal parasitic capacitances. Techniques aiming at eliminating parasitic capacitances are prone to produce a mismatch between electrodes, in particular gaps between the gate and the interlayer electrodes. While such mismatches are typically undesirable, we demonstrate that, in fact, device structures with a small single-sided interlayer electrode gap directly probe the detrimental contact resistance arising from the presence of an injection barrier. By employing a self-alignment nanoimprint lithography technique, asymmetric coplanar organic transistors with an intentional gap of varying size (< 0.2 µm) between gate and one interlayer electrode are fabricated. An electrode overlap exceeding 1 µm with the other interlayer has been kept. Gaps, be them source or drain-sided, do not preclude transistor operation. The operation of the device with a source-gate gap reveals a current reduction up to two orders of magnitude compared to a source-sided overlap. Drift-diffusion based simulations reveal that this marked reduction is a consequence of a weakened gate-induced field at the contact which strongly inhibits injection.

Efficiency of the Switching Process in Organic Electrochemical Transistors.

Entirely screen printed organic electrochemical transistors (OECTs) based on poly(3,4-ethylenedioxithiophene) poly(styrenesulfonate) ( PEDOT: PSS) and a polymer electrolyte are investigated in view of a correlation between the electrical charge consumed during switching and the volume of PEDOT: PSS in the transistor channel. An understanding of the relation between charge consumption and the amount of electrochemically active PEDOT is essential for the design of high performance transistors and for providing a deeper insight into the fundamentals of the electrochemical switching process in OECTs. It turned out that a precise control of the width of the PEDOT: PSS source-drain line is imperative for maximizing both the on-current and the on/off current ratio of lateral OECTs.

Multilength Scale Patterning of Functional Layers by Roll-to-Roll Ultraviolet-Light-Assisted Nanoimprint Lithography.

Top-down fabrication of nanostructures with high throughput is still a challenge. We demonstrate the fast (>10 m/min) and continuous fabrication of multilength scale structures by roll-to-roll UV-nanoimprint lithography on a 250 mm wide web. The large-area nanopatterning is enabled by a multicomponent UV-curable resist system (JRcure) with viscous, mechanical, and surface properties that are tunable over a wide range to either allow for usage as polymer stamp material or as imprint resist. The adjustable elasticity and surface chemistry of the resist system enable multistep self-replication of structured resist layers. Decisive for defect-free UV-nanoimprinting in roll-to-roll is the minimization of the surface energies of stamp and resist, and the stepwise reduction of the stiffness from one layer to the next is essential for optimizing the reproduction fidelity especially for nanoscale features. Accordingly, we demonstrate the continuous replication of 3D nanostructures and the high-throughput fabrication of multilength scale resist structures resulting in flexible polyethylenetherephtalate film rolls with superhydrophobic properties. Moreover, a water-soluble UV-imprint resist (JRlift) is introduced that enables residue-free nanoimprinting in roll-to-roll. Thereby we could demonstrate high-throughput fabrication of metallic patterns with only 200 nm line width.