Effects of RF Magnetron Sputtering Power on the Mechanical Behavior of Zr-Cu-Based Metallic Glass Thin Films.

Zirconium-based metallic glass films are promising materials for nanoelectronic and biomedical applications, but their mechanical behavior under different conditions is not well understood. This study investigates the effects of radio frequency (RF) power and test temperature on the nanostructure, morphology, and creep behavior of Zr55Cu30Al10Ni5 metallic glass films prepared by RF magnetron sputtering. The films were characterized by X-ray diffraction and microscopy, and their mechanical properties were measured by a bulge test system. The results show that the films were amorphous and exhibited a transition from noncolumnar to columnar morphology as the RF power increased from 75 W to 125 W. The columnar morphology reduced the creep resistance, Young's modulus, residual stress, and hardness of the films. The creep behavior of the films was also influenced by the test temperature, with higher temperature leading to higher creep strain and lower creep stress. The findings of this study provide insights into the optimization of the sputtering parameters and the design of zirconium-based metallic glass films for various applications.

Design and Measurement of Microelectromechanical Three-Axis Magnetic Field Sensors Based on the CMOS Technique.

The design, fabrication, and measurement of a microelectromechanical system (MEMS) three-axis magnetic field sensor (MFS) based on the commercial complementary metal oxide semiconductor (CMOS) process are investigated. The MFS is a magnetic transistor type. The performance of the MFS was analyzed employing the semiconductor simulation software, Sentaurus TCAD. In order to decrease the cross-sensitivity of the three-axis MFS, the structure of the MFS is planed to accommodate two independent sensing components, a z-MFS utilized to sense magnetic field (M-F) in the z-direction and a y/x-MFS composed of a y-MFS and a x-MFS to be utilized to sense M-F in the y- and x-directions. The z-MFS incorporates four additional collectors to increase its sensitivity. The commercial 1P6M 0.18 µm CMOS process of the Taiwan Semiconductor Manufacturing Company (TSMC) is utilized to manufacture the MFS. Experiments depict that the MFS has a low cross-sensitivity of less than 3%. The sensitivities of z-, y-, and x-MFS are 237 mV/T, 485 mV/T, and 484 mV/T, respectively.

Laser-Induced Graphene Stretchable Strain Sensor with Vertical and Parallel Patterns.

In intelligent manufacturing and robotic technology, various sensors must be integrated with equipment. In addition to traditional sensors, stretchable sensors are particularly attractive for applications in robotics and wearable devices. In this study, a piezoresistive stretchable strain sensor based on laser-induced graphene (LIG) was proposed and developed. A three-dimensional, porous LIG structure fabricated from polyimide (PI) film using laser scanning was used as the sensing layer of the strain sensor. Two LIG pattern structures (parallel and vertical) were fabricated and integrated within the LIG strain sensors. Scanning electron microscopy, an X-ray energy dispersive spectrometer, and Raman scattering spectroscopy were used to examine the microstructure of the LIG sensing layer. The performance and strain sensing properties of the parallel and vertical stretchable LIG strain sensors were investigated in tensile tests. The relative resistance changes and the gauge factors of the parallel and vertical LIG strain sensors were quantified. The parallel strain sensor achieved a high gauge factor of 15.79 in the applied strain range of 10% to 20%. It also had high sensitivity, excellent repeatability, good durability, and fast response times during the tensile experiments. The developed LIG strain sensor can be used for the real-time monitoring of human motions such like finger bending, wrist bending, and throat swallowing.

Thermoelectric Energy Micro Harvesters with Temperature Sensors Manufactured Utilizing the CMOS-MEMS Technique.

This study develops a TEMH (thermoelectric energy micro harvester) chip utilizing a commercial 0.18 µm CMOS (complementary metal oxide semiconductor) process. The chip contains a TEMH and temperature sensors. The TEMH is established using a series of 54 thermocouples. The use of the temperature sensors monitors the temperature of the thermocouples. One temperature sensor is set near the cold part of the thermocouples, and the other is set near the hot part of the thermocouples. The performance of the TEMH relies on the TD (temperature difference) at the CHP (cold and hot parts) of the thermocouples. The more the TD at the CHP of the thermocouples increases, the higher the output voltage and output power of the TEMH become. To obtain a higher TD, the cold part of the thermocouples is designed as a suspended structure and is combined with cooling sheets to increase heat dissipation. The cooling sheet is constructed of a stack of aluminum layers and is mounted above the cold part of the thermocouple. A finite element method software, ANSYS, is utilized to compute the temperature distribution of the TEMH. The TEMH requires a post-process to obtain the suspended thermocouple structure. The post-process utilizes an RIE (reactive ion etch) to etch the two sacrificial materials, which are silicon dioxide and silicon substrate. The results reveal that the structure of the thermocouples is completely suspended and does not show any injury. The measured results reveal that the output voltage of the TEMH is 32.5 mV when the TD between the CHP of the thermocouples is 4 K. The TEMH has a voltage factor of 8.93 mV/mm2K. When the TD between the CHP of the thermocouples is 4 K, the maximum output power of the TEMH is 4.67 nW. The TEMH has a power factor of 0.31 nW/mm2K2.

Manufacturing and Characterization of Three-Axis Magnetic Sensors Using the Standard 180 nm CMOS Technology.

A three-axis micro magnetic sensor (MS) is developed based on the standard 180 nm complementary metal oxide semiconductor (CMOS) technology. The MS designs two magnetic sensing elements (MSEs), which consists of an x/y-MSE and an z-MSE, to reduce cross-sensitivity. The x/y-MSE is constructed by an x-MSE and an y-MSE that are respectively employed to detect in the x- and y-direction magnetic field (MF). The z-MSE is used to sense in the z-direction MF. The x/y-MSE, which is constructed by two magnetotransistors, designs four additional collectors that are employed to increase the sensing current and to enhance the sensitivity of the MS. The Sentaurus TCAD software simulates the characteristic of the MS. The measured results reveal that the MS sensitivity is 534 mV/T in the x-direction MF, 525 mV/T in the y-direction MF and 119 mV/T in the z-axis MF.

Identifying Images of Dead Chickens with a Chicken Removal System Integrated with a Deep Learning Algorithm.

The chicken industry, in which broiler chickens are bred, is the largest poultry industry in Taiwan. In a traditional poultry house, breeders must usually observe the health of the broilers in person on the basis of their breeding experience at regular times every day. When a breeder finds unhealthy broilers, they are removed manually from the poultry house to prevent viruses from spreading in the poultry house. Therefore, in this study, we designed and constructed a novel small removal system for dead chickens for Taiwanese poultry houses. In the mechanical design, this system mainly contains walking, removal, and storage parts. It comprises robotic arms with a fixed end and sweep-in devices for sweeping dead chickens, a conveyor belt for transporting chickens, a storage cache for storing chickens, and a tracked vehicle. The designed system has dimensions of approximately 1.038 × 0.36 × 0.5 m3, and two dead chickens can be removed in a single operation. The walking speed of the chicken removal system is 3.3 cm/s. In order to enhance the automation and artificial intelligence in the poultry industry, the identification system was used in a novel small removal system. The conditions of the chickens in a poultry house can be monitored remotely by using a camera, and dead chickens can be identified through deep learning based on the YOLO v4 algorithm. The precision of the designed system reached 95.24% in this study, and dead chickens were successfully moved to the storage cache. Finally, the designed system can reduce the contact between humans and poultry to effectively improve the overall biological safety.

Manufacturing and Testing of Radio Frequency MEMS Switches Using the Complementary Metal Oxide Semiconductor Process.

A radio frequency microelectromechanical system switch (MSS) manufactured by the complementary metal oxide semiconductor (CMOS) process is presented. The MSS is a capacitive shunt type. Structure for the MSS consists of coplanar waveguide (CPW) lines, a membrane, and springs. The membrane locates over the CPW lines. The surface of signal line for the CPW has a silicon dioxide dielectric layer. The fabrication of the MSS contains a CMOS process and a post-process. The MSS has a sacrificial oxide layer after the CMOS process. In the post-processing, a wet etching of buffer oxide etch (BOE) etchant is employed to etch the sacrificial oxide layer, so that the membrane is released. Actuation voltage for the MSS is simulated using the CoventorWare software. The springs have a low stiffness, so that the actuation voltage reduces. The measured results reveal that actuation voltage for the MSS is 10 V. Insertion loss for the MSS is 0.9 dB at 41 GHz and isolation for the MSS is 30 dB at 41 GHz.

Magnetic Micro Sensors with Two Magnetic Field Effect Transistors Fabricated Using the Commercial Complementary Metal Oxide Semiconductor Process.

The fabrication and characterization of a magnetic micro sensor (MMS) with two magnetic field effect transistors (MAGFETs) based on the commercial complementary metal oxide semiconductor (CMOS) process are investigated. The magnetic micro sensor is a three-axis sensing type. The structure of the magnetic microsensor is composed of an x/y-MAGFET and a z-MAGFET. The x/y-MAGFET is employed to sense the magnetic field (MF) in the x- and y-axis, and the z-MAGFET is used to detect the MF in the z-axis. To increase the sensitivity of the magnetic microsensor, gates are introduced into the two MAGFETs. The sensing current of the MAGFET enhances when a bias voltage is applied to the gates. The finite element method software Sentaurus TCAD was used to analyze the MMS's performance. Experiments show that the MMS has a sensitivity of 182 mV/T in the x-axis MF and a sensitivity of 180 mV/T in the y-axis MF. The sensitivity of the MMS is 27.8 mV/T in the z-axis MF.

Micro-Fabricated Presure Sensor Using 50 nm-Thick of Pd-Based Metallic Glass Freestanding Membrane.

This paper reports on micro-fabricated pressure sensors based on a thin metallic glass membrane. The Pd66Cu4Si30 metallic glass material is deposited successfully by a sputter technique. An amorphous feature of the deposited film is confirmed by high resolution transmission electron microscopy (HR-TEM) and the corresponding the selected area electron diffraction (SAED). The ultra-flat freestanding metallic glass membrane with 50 nm in thickness and 2 mm in circular diameter has been fabricated successfully. In addition, two kinds of micro-fabricated pressure sensor types, including itself membrane and additional metallic glass bar as piezoresistive sensing elements, are proposed and fabricated. A displacement of membrane can reach over 100 µm without any damage to membrane which is equivalent to over 0.7% of an elastic strain. Besides, the temperature coefficient of resistance of the Pd-based metallic glass thin film is extremely low 9.6 × 10-6 °C-1. This development of nano-thick metallic glass membrane possibly opens a new field of micro-fabricated devices with large displacement and enhanced sensing.

Low-Concentration Ammonia Gas Sensors Manufactured Using the CMOS-MEMS Technique.

This study describes the fabrication of an ammonia gas sensor (AGS) using a complementary metal oxide semiconductor (CMOS)-microelectromechanical system (MEMS) technique. The structure of the AGS features interdigitated electrodes (IDEs) and a sensing material on a silicon substrate. The IDEs are the stacked aluminum layers that are made using the CMOS process. The sensing material; polypyrrole/reduced graphene oxide (PPy/RGO), is synthesized using the oxidation-reduction method; and the material is characterized using an electron spectroscope for chemical analysis (ESCA), a scanning electron microscope (SEM), and high-resolution X-ray diffraction (XRD). After the CMOS process; the AGS needs post-processing to etch an oxide layer and to deposit the sensing material. The resistance of the AGS changes when it is exposed to ammonia. A non-inverting amplifier circuit converts the resistance of the AGS into a voltage signal. The AGS operates at room temperature. Experiments show that the AGS response is 4.5% at a concentration of 1 ppm NH3; and it exhibits good repeatability. The lowest concentration that the AGS can detect is 0.1 ppm NH3.

Level repulsion of GHz phononic surface waves in quartz substrate with finite-depth holes.

This paper presents numerical and experimental results on the level repulsion of gigahertz surface acoustic waves in an air/ST-cut quartz phononic structure with finite-depth holes. The colorful dispersion with the parameter of the in-plane (sagittal plane) ratio of polarization was adopted to determine the Rayleigh wave bandgap induced by the level repulsion. The results of numerical analyses showed that the frequency and width of the bandgap induced by the level repulsion strongly depend on the geometry of the air holes in the phononic structure. In the experiment, a pair of slanted interdigital transducers with frequency in the gigahertz range was designed and fabricated to generate and receive broadband Rayleigh waves, whereas the reactive ion etching process with electron-beam lithography was used to fabricate submicrometer phononic structures. The measured results of the bandgap induced by the level repulsion agreed favorably with the numerical prediction.

On-Chip Micro-Pseudocapacitors for Ultrahigh Energy and Power Delivery.

Microscale supercapapcitors based on hierarchical nanoporous hybrid electrodes consisting of 3D bicontinuous nanoporous gold and pseudocapacitive manganese oxide deliver an excellent stack capacitance of 99.1 F cm-3 and a high energy density of 12.7 mW h cm-3 with a retained high power density of 46.6 W cm-3.

The image feature analysis for microscopic thyroid tissue classification.

Thyroid diseases are prevalent among endocrine diseases. Observation and examination of histological tissue images can help in understanding the cause and pathogenesis of the tumor. The aim of this study was to quantify the histological image features of microscopic thyroid images in order to classify varying tissue types. Five typical histological thyroid tissues were characterized using seven image features including hue, brightness, standard deviation of brightness, entropy, energy, regularity, and fractal analysis. Statistical stepwise selection and multiple discriminant analysis were then used to classify the features. The results show all of the features are significant and our algorithm has the capability of differentiating histological tissue types. The algorithm is applied utilizing quad-tree based region splitting methods to segment the tissue regions from the heterogeneous microscopic image. The preliminary results show the system has good performance for tissue segmentation.